Designing Thermally Uniform Heatsink with Rectangular Pins for High-Power Automotive SiC Inverters
Paper in proceedings, 2020
Electric drive
Temperature uniformity
Liquid cooling
Three-phase inverter
Conjugate heat transfer
SiC MOSFET
Author
Georgios Mademlis
Chalmers, Electrical Engineering, Electric Power Engineering, Electrical Machines and Power Electronics
Raik Orbay
Chalmers, Electrical Engineering, Electric Power Engineering, Electrical Machines and Power Electronics
Volvo Cars
Yujing Liu
Chalmers, Electrical Engineering, Electric Power Engineering, Electrical Machines and Power Electronics
Nimananda Sharma
Chalmers, Electrical Engineering, Electric Power Engineering, Electrical Machines and Power Electronics
IECON Proceedings (Industrial Electronics Conference)
Vol. 2020-October 1317-1322 9254692
Singapore, Singapore,
iTEM - Integrated Transmission and Electric Motor
Swedish Energy Agency, 2018-02-09 -- 2020-09-30.
Driving Forces
Sustainable development
Areas of Advance
Transport
Subject Categories
Vehicle Engineering
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/IECON43393.2020.9254692