Characterization of Nano-Enhanced Interconnect Materials for Fine Pitch Assembly
Journal article, 2014

Author

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Soldering and Surface Mount Technology

0954-0911 (ISSN)

Areas of Advance

Nanoscience and Nanotechnology (2010-2017)

Subject Categories

Manufacturing, Surface and Joining Technology

More information

Created

10/7/2017