The influence of sintering process on thermal properties of nano-silver paste
Paper in proceedings, 2018

Nano-silver paste with low sintering temperature and high operation temperature was introduced to the application of bonding materials for GaN and SiC devices. Thermal properties are critical issues for die attach materials due to the heat dissipation requirements of high power devices. The influence of sintering process parameters for nano-silver paste on the thermal properties was investigated. The thermal conductivity of sintered nano-silver paste increased with the increase of sintering temperature and sintering time because of the dense structure due to high temperature and long sintering time. To improve the thermal property, Ag coated micro-SiC particles were used as an alternative to partly replace pure nano-Ag particles. The results demonstrate that the SiC particles can reduce the voids and improve the density of the sintered silver structure. Moreover, the addition of SiC particles can also contribute to the increase of thermal diffusivity. As a result, the thermal conductivity of sintered silver paste with 1.5 wt.% Ag coated SiC particles was two times as compared to that without SiC particles with the same Ag concentration.

nano-silver paste

sintering time

Sintering temperature

Thermal conductivity

SiC particles

Author

Xiuzhen Lu

Shanghai University

Qianran Zhang

Shanghai University

Abdelhafid Zehri

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Wei Ke

Shanghai University

Shirong Huang

Shanghai University

Cheng Zhou

Aerosp Sci & Technol Corp

Weijuan Xia

Aerosp Sci & Technol Corp

Yanpei Wu

Aerosp Sci & Technol Corp

Lilei Ye

SHT Smart High-Tech

Johan Liu

SHT Smart High-Tech

Shanghai University

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)

1157-1160

Subject Categories

Ceramics

Materials Chemistry

Other Materials Engineering

More information

Latest update

12/12/2018