Study on the reliability of fast curing isotropic conductive adhesive
Paper in proceeding, 2011
Author
Wenhui Du
Huiwang Cui
Si Chen
Zhichao Yuan
Lilei Ye
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
ECS Transactions
Vol. 34 1 805 - 810
Subject Categories
Materials Engineering
Other Electrical Engineering, Electronic Engineering, Information Engineering
Areas of Advance
Materials Science