The influence of surface microroughness on wafer bonding
Licentiate thesis, 1996
AFM
hydrophilic
surface roughness
diamond
silicon-on-insulator
poly silicon
silicon-on-diamons
atomic force microscope
wafer bonding
SOI
aluminum nitride
hydrophobic
Author
Mats Bergh
Department of Solid State Electronics
Subject Categories
Other Electrical Engineering, Electronic Engineering, Information Engineering
ISBN
91-7197-438-5
Technical report L - School of Electrical and Computer Engineering, Chalmers University of Technology. : 257