Development and characterisation of nanofiber films with high adhesion
Paper i proceeding, 2011

With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronic packaging. This paper reports the study on fabrication of a nanofiber films used for nano-thermal interface material (nano-TIM) with the adhesive function. The nano-TIM with high thermal conductivity and low thermal resistivity has been fabricated by electrospinning process. In the present work, hotmelt was added into the electrospinning solution to improve the adhesion properties of the film. The morphology of the film was observed by Scanning Electrical Microscope (SEM). The nanofiber films have a nano-scale structure with hotmelt randomly attached into the fiber matrix. Shear tests were conducted to measure the bonding strength of nanofiber films. The results show that the nanofiber films reached a 6.52 MPa in terms of average shear strength, more than 2 times better than the case without the hotmelt addition.


Xin Tang

Hui Wang Cui

Xiu Zhen Lu

Qiong Fan

Zhichao Yuan

Lilei Ye

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial och system

Proceedings of the IEEE Electronics Components and Technology Conference (ECTC) 2011, May 31 – June 2011, Florida, US

0569-5503 (ISSN)

673 - 677


Nanovetenskap och nanoteknik (2010-2017)




Elektroteknik och elektronik



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