Qazi Mashaal Khan

Postdoc at Microwave Electronics

Qazi Mashaal Khan received the B.Sc. degree in Electrical Engineering from National University of Computer and Emerging Sciences, Pakistan, with summa cum laude, in 2016. He completed the EU funded Erasmus + Joint M.Sc. degree in Smart Systems Integration from Heriot-Watt University, UK, University of South-Eastern Norway, and Budapest University of Technology & Economics, Hungary, with distinction, in 2019. His master thesis focused on digital system design concepts and was hosted at eesy-IC GmH, Germany.

He completed his Ph.D. degree (Hons.) in Electronics Engineering from Institut National des Sciences Appliquees (INSA) Rennes University, France, in 2023. His doctoral work was funded by the EU Horizon 2020 MSCA ETN PETER project and was carried out at the Department of Electrical and Electronic Engineering, ESEO, Angers, France.

Dr. Khan is currently a Postdoctoral Researcher with the Microwave Electronics Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Sweden. He has authored or co-authored several peer-reviewed scientific journal and conference publications. His main research interests include multi-physical thermal modelling, microwave filters, EMC design and reliability characterization of integrated circuits.

Source: chalmers.se
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Showing 3 publications

2024

Improvements proposed to noisy-OR derivatives for multi-causal analysis: A case study of simultaneous electromagnetic disturbances

Lokesh Devaraj, Qazi Mashaal Khan, Alastair R. Ruddle et al
International Journal of Approximate Reasoning. Vol. 164
Journal article
2024

Analysis of Q-factor for AM-SLM Cavity based Resonators using Surface Roughness Models

Qazi Mashaal Khan, Dan Kuylenstierna
IEEE Journal on Multiscale and Multiphysics Computational Techniques. Vol. 9, p. 75-83
Journal article
2023

Validation of IC Conducted Emission and Immunity Models Including Aging and Thermal Stress

Qazi Mashaal Khan, M. Koohestani, Jean Luc Levant et al
IEEE Transactions on Electromagnetic Compatibility. Vol. 65 (3), p. 780-793
Journal article

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