Wei-Cheng Wu

Showing 3 publications

2010

Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent Reliability

Li-Han Hsu, Wei-Cheng Wu, E. Y. Chang et al
IEEE Transactions on Microwave Theory and Techniques. Vol. 58 (8), p. 2244-2250
Magazine article
2009

Fabrication process and 110 GHz measurement result of MS-to-CPW RF-via transition for RF-MEMS devices packaging applications

Li-Han Hsu, Wei-Cheng Wu, E. Y. Chang et al
2009 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2009
Paper in proceeding

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