A Dual-frequency Distributed MIMO Approach for Future 6G Applications
Research Project, 2023 – 2026

TThe 6GTandem project will demonstrate ultra-high-capacity coverage, off-load of lower frequency bands and new services such as sub-cm resolution sensing and positioning in high traffic areas by adding sub-THz carriers to lower frequency bands in a seamless, tightly coordinated fashion. The two frequency bands will form a network collaborating and supporting each other in a “tandem” configuration enabling an introduction of high capacity, energy efficient, sub-THz enabled services, while mitigating known drawbacks of the sub-THz frequency bands such as susceptibility to line-of-sight blockage, coverage, and cost. Deployment will be addressed through the introduction of a thin and light dielectric waveguide to distribute a sub-THz RF signal through a daisy chain of integrated low-power antenna units, referred to as a “radio stripe”. We will demonstrate the use of lower, sub-10 GHz frequency bands to support the sub-THz band with resilience and coverage and the implementation of a distributed MIMO system to extend the coverage of the sub-THz band as well as offering capacities in the order of Tbps system throughput. We will demonstrate the possibility to implement local fronthaul solutions for added sub-10GHz access points using the high bandwidth of sub-THz radio stripes.
Key elements for 6GTandem:
- A system defining an ‘aligned tandem’ dual-frequency distributed MIMO architecture
- Medium-aware waveforms, transmission schemes and communication strategies for energy-efficient operation and development of cross-layer solutions to offer required service levels on the novel dual-frequency infrastructure
- Novel, “radio stripe” hardware including transceivers at 130GHz-175GHz, packaging, integration, and plastic waveguide for a low-cost, easy-deployable sub-THz infrastructure
- Conception of a combined low-frequency and sub-THz distributed MIMO system supporting joint high-resolution sensing, high-accuracy positioning, and high-resilience and reliability communication.

Participants

Christian Fager (contact)

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Collaborations

Ericsson

Stockholm, Sweden

Infineon Technologies

Neubiberg, Germany

KU Leuven

Leuven, Belgium

Linköping University

Linköping, Sweden

Lund University

Lund, Sweden

TECHNIKON Forschungs- und Planungsgesellschaft mbH

Villach, Austria

Funding

European Commission (EC)

Project ID: EC/HE/101096302
Funding Chalmers participation during 2023–2026

Related Areas of Advance and Infrastructure

Sustainable development

Driving Forces

More information

Latest update

9/16/2023