Physics-Informed AI for Assembly Digital Twin (PIADT)
Research Project, 2023 – 2024

Purpose and goal
The purpose of the project is to establish a collaborative project within applied AI in an assembly digital twin context. This collaboration is between the Chalmers University of Technology and Georgia Tech. The project aims to propose a method for physics-informed AI for estimating the geometric quality of assemblies in a digital twin context. The assembly digital twin is a digital counterpart of the physical assembly system utilized to steer and optimize the process.

Expected results and effects
The expected outcome of this project is to propose a method utilizing physics-inforced AI principles for approximating the geometric quality of the assemblies. This method is planned to be published by means of an open-access publication. This method can enhance the understanding of the manufacturing process of complex assemblies by means of analyzing and simulating the expected outcome. The project can potentially impact the manufacturing industries to take advantage of the developed method to design and plan for assembly and adjust the design accordingly.

Participants

Roham Sadeghi Tabar (contact)

Chalmers, Industrial and Materials Science, Product Development

Funding

VINNOVA

Project ID: 2023-02592
Funding Chalmers participation during 2023–2024

More information

Latest update

6/10/2024