Chips JU 2023 RIA Move2THz
Research Project, 2024 – 2027

The project will lead to a strengthened infrastructure for InPoSi based technologies where the entire value chain from the semiconductor wafer to finished semiconductor circuits will be available in Europe for HEMT, HBT and opto components. Move2THz will enable scaling up to 12" wafers which will lead to better competitiveness against other semiconductor technologies. We expect comparable transistor performance for InPoSi as for bulk InP, but with new opportunities for scaling and utilization of silicon process techniques and integration against other technologies such as CMOS.


Low Noise Factory (LNF) will focus on the development of an MMIC process compatible with InPoSi. The development will include both improvement of the existing process and adaptations necessary for the silicon carrier. Chalmers University of Technology (Chalmers) will focus on the development of InP HEMT transistors on InPoSi. Chalmers will develop an InP HEMT process on InPoSi and do comparative studies on InP HEMT on InP bulk wafers. Together, Chalmers and LNF will carry out extensive modelling, measurement and evaluation of InPoSi.

Participants

Helena Rodilla (contact)

Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory

Funding

VINNOVA

Project ID: 2024-00556
Funding Chalmers participation during 2024–2027

More information

Latest update

12/10/2024