Flexible additiv manufacturing of micrometer/millimeter wave components
Purpose and goal
Next generation of micrometer/millimeter wave components for future mobile communication would benefit significantly from further flexibility in product design. The aim is to develop such solutions through additive additive manufacturing (AM) using powder-based technologies implemented for copper-based material. The goal is to demonstrate product design based on experimental development, tests and theoretical modelling/evaluations. The idea is also at end to have an initial digital platform for additive manufacturing related to the intended area of application.
Expected results and effects
At project, the expected outcome is strengthened industrial ability in developing manufacturing to match future products through: A digital chain from product modelling to design for additive manufacturing to product realisation; proof-of-concept for applying AM to generate micrometer and millimeter wave components for future 5G systems, copper-based material solutions for powder-bed based AM. Through the project, new co-operation is also established along a value chain with input from specific input from core research organisations in the field.
Planned approach and implementation
The project addresses the technologies laser-powder fusion (LPBF) and binder jetting (BJ) as methods for future manufacture and realisation of components for millimetre/microwave applications. The project is a co-operative effort involving Ericsson as end-user and problem owner, Chalmers and RISE IVF as research providers and EOS and Digital Metal as core technology providers in AM. The development of the manufacturing technology is linked with the evaluation of properties and product design, which in turn is connected to functional assessment as input to the AM development.
Lars Nyborg (contact)
Full Professor at Chalmers, Industrial and Materials Science, Materials and manufacture
RISE Research Institutes of Sweden
Project ID: 2019-00786
Funding Chalmers participation during 2019–2022