flip-chip interconnects
packaging
Fabrication
ghz
microelectromechanical devices
interconnections
cpw
microwave technology
Chalmers, Microtechnology and Nanoscience (MC2)
National Chiao Tung University Taiwan
Chalmers, Microtechnology and Nanoscience (MC2)
National Chiao Tung University Taiwan
National Chiao Tung University Taiwan
National Cheng Kung University
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
National Chiao Tung University Taiwan
National Chiao Tung University Taiwan
National Cheng Kung University
1521-3323 (ISSN)
Vol. 33 1 30-36Electrical Engineering, Electronic Engineering, Information Engineering
10.1109/TADVP.2009.2034137