Low temperature full wafer adhesive bonding of structured wafers
Journal article, 2001
Author
Frank Niklaus
Helene Andersson
Peter Enoksson
Department of Microelectronics
Göran Stemme
Sensors and Actuators A
Vol. 92 235-241
Areas of Advance
Nanoscience and Nanotechnology
Production
Materials Science
Subject Categories (SSIF 2011)
Materials Engineering
Other Engineering and Technologies
Other Engineering and Technologies not elsewhere specified
Electrical Engineering, Electronic Engineering, Information Engineering