Low temperature full wafer adhesive bonding of structured wafers
Journal article, 2001

Author

Frank Niklaus

Helene Andersson

Peter Enoksson

Department of Microelectronics

Göran Stemme

Sensors and Actuators A

Vol. 92 235-241

Areas of Advance

Nanoscience and Nanotechnology (2010-2017)

Production

Materials Science

Subject Categories

Materials Engineering

Other Engineering and Technologies

Other Engineering and Technologies not elsewhere specified

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017