Low temperature full wafer adhesive bonding of structured wafers
Journal article, 2001
Author
Frank Niklaus
Helene Andersson
Peter Enoksson
Department of Microelectronics
Göran Stemme
Sensors and Actuators A
Vol. 92 235-241
Areas of Advance
Nanoscience and Nanotechnology (SO 2010-2017, EI 2018-)
Production
Materials Science
Subject Categories (SSIF 2011)
Materials Engineering
Other Engineering and Technologies
Other Engineering and Technologies not elsewhere specified
Electrical Engineering, Electronic Engineering, Information Engineering