Is it time to Reinforce In-opackage Solder Joints Using CNF?
Magazine article, 2014
Author
Vincent Desmaris
Sareh Shafiee
Mohammad Kabir
Muhammad Amin
Anders Johansson
Phil Marcoux
MEPTEC report
Vol. Spring 2014 20-21
Areas of Advance
Information and Communication Technology
Nanoscience and Nanotechnology
Materials Science
Driving Forces
Sustainable development
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
Nano Technology
Infrastructure
Nanofabrication Laboratory