Integration of a 140 GHz Packaged LTCC Grid Array Antenna with an InP Detector
Journal article, 2015
Integration of a 140-GHz packaged low-temperature cofired ceramic (LTCC) antenna with a power detector is demonstrated under the concept of antenna-in-package. The detector is designed on an indium phosphide (InP) process. A grid array antenna in LTCC is designed to provide package for the detector. Coplanar ground-signal-ground (GSG) bond wires are used to connect the detector and the antenna. Parallel plate mode is observed in the InP substrate and absorbed by the LTCC substrate. The comparison between the measured responsivity of the power detector with and without the antenna indicates the acceptable insertion loss of the coplanar GSG bond wires transition. It shows a feasible solution for the D-band front-end integration and packaging.
low-temperature cofired ceramic (LTCC)
Antenna-in-package (AiP)
parallel plate mode (PPM)
grid array antenna (GAA)
Author
Bing Zhang
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
H. Gulan
T. Zwick
Y. Li
U. Oderfalt
F. Carlsson
Herbert Zirath
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
IEEE Transactions on Components, Packaging and Manufacturing Technology
2156-3950 (ISSN) 21563985 (eISSN)
Vol. 5 8 1060-1068 7173018Subject Categories
Telecommunications
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/TCPMT.2015.2453407