RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints
Paper in proceeding, 2006
Anisotropic conductive adhesives (ACAs) have been proved to own good performance in high frequency applications. However, the effect of distribution of conductive particles in ACAs on RF (radio frequency) characterization is not fully understood. Finite difference in time domain (FDTD) method based electromagnetic software QuickWave is used to establish the structure and investigate RF characterization of ACA. The effect of distribution of conductive particles both in random and uniform distribution is simulated. Furthermore, the influence of conductor overlap is also investigated. An equivalent lumped circuit is also set up. The results show in a certain particles number, that there is minor influence in different distribution of conductive particles, and that as expected, the conductor overlap should be minimized to improve high frequency performance
Author
Xu Wang
Shanghai University
Zhaonian Cheng
Shanghai University
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Shanghai University
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China
1-4244-0488-6 (ISBN)
Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06
Shanghai, China,
Shanghai, China,
Subject Categories (SSIF 2011)
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/HDP.2006.1707595