Flow Behaviour of Anisotropic Conductive Adhesive Film during COG Bonding Process in Flat Panel Display Assembly
Paper in proceeding, 2006
Author
Fabien Raugi
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany
Subject Categories
Other Materials Engineering