SIMULATION OF THE HOT DISK SENSOR: TEMPERATURE AND ELECTRIC CURRENT DISTRIBUTION
Paper in proceeding, 2017

The Hot Disk method, also known as the transient plane source (TPS) technique, is an experimental approach for determining the thermal transport properties of materials. The core of the method is the Hot Disk sensor, an electrically conducting metallic foil (typically nickel), shaped as a double spiral, clad with a protective polymer film or mica. The double spiral serves simultaneously as heat source and temperature probe. The mean temperature increase of the TPS- sensor has been formulated from various analytical approaches such as: the concentric ring sources model, the thermal quadrupoles formalism, and concentric circular strips structure approach. However, full numerical simulation of the sensor has not been addressed so far. Here we develop 3D model of a Hot Disk sensor. The simulation provides information such as temperature and current distribution along each spiral which is not accessible from the experiment. Modeling feature, Joule heating coupled with heat transfer in solids of COMSOL Multiphysics software is used to simulate the sensor. The temperature and current distributions along the nickel wire is obtained. This can potentially be used in further optimizing geometry and estimating better parameters.

hot disk method

Joule heating

Transient temperature

Finite element simulation

Hot disk sensor

Author

Besira Mekonnen Mihiretie

Chalmers, Physics, Condensed Matter Physics

Daniel Cederkrantz

Chalmers, Chemistry and Chemical Engineering, Applied Chemistry

Arne Rosen

University of Gothenburg

Henrik Otterberg

Kagaku Analysis

Maria Sundin

University of Gothenburg

Magnus Karlsteen

Chalmers, Physics, Condensed Matter Physics

Proceedings of the Asian Conference on Thermal Sciences 2017

Asian Conference on Thermal Sciences 2017, 1st ACTS
Jeju Island, South Korea,

Subject Categories

Energy Engineering

Other Physics Topics

Other Electrical Engineering, Electronic Engineering, Information Engineering

Areas of Advance

Materials Science

More information

Latest update

12/13/2019