Making thick photoresist SU-8 flat on small substrates
Journal article, 2019

This work suggests a simple method to flatten thick layers (similar to 50-200 mu m) of SU-8 photoresist on small substrates (similar to 1 cm). The method sidesteps the edge beads problem and enables photolithography patterns up to the substrates' edges. Moreover, the method can be used even for substrates with large aspect ratios when the spin coating is largely impossible.

small substrates

edge beads

SU-8 uniformity

Author

Avgust Yurgens

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Device Physics

Journal of Micromechanics and Microengineering

0960-1317 (ISSN)

Vol. 29 1 017001

Subject Categories

Manufacturing, Surface and Joining Technology

Other Physics Topics

Discrete Mathematics

DOI

10.1088/1361-6439/aaed1c

More information

Latest update

7/17/2019