Making thick photoresist SU-8 flat on small substrates

Journal article, 2019

This work suggests a simple method to flatten thick layers (similar to 50-200 mu m) of SU-8 photoresist on small substrates (similar to 1 cm). The method sidesteps the edge beads problem and enables photolithography patterns up to the substrates' edges. Moreover, the method can be used even for substrates with large aspect ratios when the spin coating is largely impossible.