Experimental demonstration of staggered cap modulation for low bandwidth red-emitting polymer-LED based visible light communications
Paper in proceeding, 2019
© 2019 IEEE. In this paper we experimentally demonstrate, for the first time, staggered carrier-less amplitude and phase (sCAP) modulation for visible light communication systems based on polymer light-emitting diodes emitting at ∼639 nm. The key advantage offered by sCAP in comparison to conventional multiband CAP is its full use of the available spectrum. In this work, we compare sCAP, which utilises four orthogonal filters to generate the signal, with a conventional 4-band multi-CAP system and on-off keying (OOK). We transmit each modulation format with equal energy and present a record un-coded transmission speed of ∼6 Mb/s. This represents gains of 25% and 65% over the achievable rate using 4-CAP and OOK, respectively.
Visible light communications
Modulation
Digital signal processing
Carrier-less amplitude and phase modulation
Author
Paul Anthony Haigh
University College London (UCL)
A. Minotto
University College London (UCL)
Andrew Burton
Northumbria University
Zabih Ghassemlooy
Northumbria University
Petri Henrik Murto
Chalmers, Chemistry and Chemical Engineering, Applied Chemistry
Flinders University
Zewdneh Genene Wolkeba
Chalmers, Chemistry and Chemical Engineering, Applied Chemistry
Chalmers, Chemistry and Chemical Engineering, Applied Chemistry
Addis Ababa University
W. Mammo
Addis Ababa University
Mats Andersson
Flinders University
Ergang Wang
Chalmers, Chemistry and Chemical Engineering, Applied Chemistry
F. Cacialli
University College London (UCL)
I.Z. Darwazeh
University College London (UCL)
2019 IEEE International Conference on Communications Workshops, ICC Workshops 2019 - Proceedings
8757114
2019 IEEE International Conference on Communications Workshops, ICC Workshops 2019
Shanghai, China,
Shanghai, China,
Subject Categories (SSIF 2011)
Telecommunications
Signal Processing
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/ICCW.2019.8757114