Considerations of SiP based Antenna in Package/Module (AiP/AiM) Design at Sub-Terahertz Frequencies for Potential B5G/6G Applications
Paper in proceeding, 2021

Antenna-in-Package/Module (AiP/AiM) are the primary technologies to realize the RF subsystems for frequencies beyond millimeter-wave (mmW) bands, including sub-terahertz for potential B5G/6G applications. Due to the small wavelength, the mechanical process of the current system-in-package (SiP) results in limitations to realize antenna arrays at sub-terahertz. In this paper, the mechanical limits to cause radiation discrepancy is investigated by designing an AiP/AiM at 110 GHz band. Through the parametric studies based on the currently available cheap SiP process, one may summarize the considerations of AiP/AiM design for beyond sub-terahertz frequencies. The examination will consider the design of an 8x8 antenna array to provide a radiation gain of 20 dBi. Numerical full-wave simulations by HFSS were performed to obtain reliable behaviors of AiP/AiM radiations.


Sub-Terahertz frequencies


antenna array

Active antenna

B5G/6G mobile communication


Kuan-Hsun Wu

National Taiwan University

Hsi-Tseng Chou

National Taiwan University

Ding-Bing Lin

National Taiwan University of Science and Technology

Chao-Shun Yang

Powertech Technology Inc.

Chieh-Wei Chou

Powertech Technology Inc.

Chi-Liang Pan

Powertech Technology Inc.

Chun-Te Lin

Powertech Technology Inc.

Ji-Cheng Lin

Powertech Technology Inc.

Li-Chih Fang

Powertech Technology Inc.

Marianna Ivashina

Chalmers, Electrical Engineering, Communication, Antennas and Optical Networks

Proceedings - Electronic Components and Technology Conference

05695503 (ISSN)


IEEE 71st Electronic Components and Technology Conference (ECTC)
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Subject Categories

Aerospace Engineering

Geotechnical Engineering

Other Electrical Engineering, Electronic Engineering, Information Engineering



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