Technical Debt Problems and Concerns
Journal article, 2022

This article reports papers about technical debt (TD) from the 2021 IEEE/Association for Computing Machinery (ACM) International Conference on technical debt (TechDebt'21), the 43rd IEEE/ACM International Conference on Software Engineering: Journal First Track (ICSE-JF'21), the 43rd IEEE/ACM International Conference on Software Engineering: Software Engineering in Practice Track (ICSE-SEIP'21), and the 2021 IEEE/ACM 18th International Conference on Mining Software Repositories (MSR'21). Feedback or suggestions are welcome. In addition, if you try or adopt any of the practices included in the column, please send us and the authors a note about your experiences.

Author

Jeffrey C. Carver

University of Alabama

Xabier Larrucea

Basque Research and Technology Alliance (BRTA)

Alexander Serebrenik

Eindhoven University of Technology

Miroslaw Staron

Chalmers, Computer Science and Engineering (Chalmers), Software Engineering (Chalmers)

IEEE Software

0740-7459 (ISSN)

Vol. 39 3 116-119

Subject Categories

Other Mechanical Engineering

Human Aspects of ICT

Software Engineering

DOI

10.1109/MS.2021.3133734

More information

Latest update

5/9/2022 9