Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration

Journal article, 2022

This paper presents a novel substrateless packaging solution for the D-band active e mixer MMIC module, using a waveguide line with a glide-symmetric periodic electromagnetic bandgap (EBG) hole configuration. The proposed packaging concept has the benefit of being able to control signal propagation behavior by using a cost-effective EBG hole configuration for millimeter-wave- and terahertz (THz)-frequency-band applications. Moreover, the mixer MMIC is connected to the proposed hollow rectangular waveguide line via a novel wire-bond wideband transition without using any intermediate substrate. A simple periodical nail structure is utilized to suppress the unwanted modes in the transition. Additionally, the presented solution does not impose any limitations on the chip's dimensions or shape. The packaged mixer module shows a return loss lower than 10 dB for LO (70-85 GHz) and RF (150-170 GHz) ports, achieving a better performance than that of traditional waveguide transitions. The module could be used as a transmitter or receiver, and the conversion loss shows good agreement in multiple samples. The proposed packaging solution has the advantages of satisfactory frequency performance, broadband adaptability, low production costs, and excellent repeatability for millimeter-wave- and THz-band systems, which would facilitate the commercialization of millimeter-wave and THz products.