Humidity and Temperature Dependences of Resistivities of Various Formulations of Silicone Rubber for HVDC Applications
Paper in proceeding, 2023

Silicone rubber (SiR) is extensively used as housing material for outdoor HV insulators thanks to its excellent long-term stability combined with high hydrophobicity. For HVDC applications, the resistivity of SiR is a key design parameter and knowledge about its changes under various conditions is crucial. In the present work, the influences of relative humidity in air and temperature on the resistivities of five different HTV SiR formulations are studied. The resistivity is calculated from the results of the leakage current measurements conducted on 1.3 mm thick SiR samples under DC voltage. It is found that both the relative humidity and temperature have a significant impact on the resistivity of the studied materials the magnitudes of which varied over several orders. Furthermore, it is observed that SiR formulations with similar composition may have significantly different resistivities under the same temperature and humidity. Accordingly, it is concluded that the resistive properties of each SiR formulation used for HVDC applications need to be carefully evaluated to secure a reliable design and operation.

Author

[Person c9c9bdf1-8eb9-4406-9900-5b6036cac47f not found]

Hitachi

[Person 64bae9a0-982a-4854-bcd6-f7f16916936f not found]

Hitachi

[Person 5497aecf-2086-460d-837d-7b852f17ca4e not found]

Student at Chalmers

[Person 3e04857c-0a6c-43ea-83f4-9ee03b716da6 not found]

Chalmers, Electrical Engineering, Electric Power Engineering

[Person c64b180d-9262-452e-aa8e-0cccd8a1826c not found]

Chalmers, Electrical Engineering, Electric Power Engineering

Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

00849162 (ISSN)


9798350335620 (ISBN)

2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2023
East Rutherford, USA,

Subject Categories (SSIF 2011)

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/CEIDP51414.2023.10410503

More information

Latest update

12/2/2024