Wafer Bonding - Problems and Possibilities
Doctoral thesis, 1998
SOI
atomic force microscope
micromechanics
compliant substrates
wafer bonding
semi-insulating silicon
AFM
surface chemistry
diamond
silicon on insulator
aluminium nitride
microelectronics
surface roughness
Author
Mats Bergh
Department of Microelectronics
Subject Categories (SSIF 2011)
Physical Sciences
Electrical Engineering, Electronic Engineering, Information Engineering
ISBN
91-7197-751-1
Doktorsavhandlingar vid Chalmers tekniska högskola. Ny serie: 1463
Technical report - School of Electrical and Computer Engineering, Chalmers University of Technology, Göteborg, Sweden: 353