Void-Free Full Wafer Adhesive Bonding
Paper in proceeding, 2000
Author
Frank Niklaus
Peter Enoksson
Department of Microelectronics
Edvard Kälvesten
Göran Stemme
IEEE International Workshop on Micro Electromechanical Systems (MEMS2000), Miyazaki, Japan, Jan. 23-27
247-252
Subject Categories
Mechanical Engineering
Materials Engineering
Other Engineering and Technologies
Chemical Engineering
Electrical Engineering, Electronic Engineering, Information Engineering
Areas of Advance
Nanoscience and Nanotechnology (SO 2010-2017, EI 2018-)
Production
Materials Science