Low temperature full wafer adhesive bonding of structured wafers
Paper in proceeding, 2001
Author
Frank Niklaus
Peter Enoksson
Department of Microelectronics
Patrick Griss
Edvard Kälvesten
Göran Stemme
The 11th International Conference on Solid-State Sensors and Actuators (TRANSDUCERS'01 / Eurosensors XV), Munich, Germany
Subject Categories
Mechanical Engineering
Materials Engineering
Other Engineering and Technologies
Chemical Engineering
Electrical Engineering, Electronic Engineering, Information Engineering
Areas of Advance
Nanoscience and Nanotechnology (SO 2010-2017, EI 2018-)
Production
Materials Science