Low temperature full wafer adhesive bonding of structured wafers
Paper in proceedings, 2001

Author

Frank Niklaus

Peter Enoksson

Department of Microelectronics

Patrick Griss

Edvard Kälvesten

Göran Stemme

The 11th International Conference on Solid-State Sensors and Actuators (TRANSDUCERS'01 / Eurosensors XV), Munich, Germany

Subject Categories

Mechanical Engineering

Materials Engineering

Other Engineering and Technologies

Chemical Engineering

Electrical Engineering, Electronic Engineering, Information Engineering

Areas of Advance

Nanoscience and Nanotechnology

Production

Materials Science

More information

Created

10/7/2017