RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints
Paper in proceeding, 2006
Author
Xu Wang
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China
Subject Categories
Other Electrical Engineering, Electronic Engineering, Information Engineering