RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints
Paper in proceedings, 2006

Author

Xu Wang

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017