On the heat transfer enhancement based on micro-scale air impingingment jets with microstructure heat sink in electronics cooling
Paper in proceeding, 2006
Author
Jing-yu Fan
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China
Subject Categories
Atom and Molecular Physics and Optics