Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles
Paper in proceedings, 2006

Author

Suresh Chand Verma

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany

Subject Categories

Other Materials Engineering

More information

Created

10/6/2017