Development of High Adhesion Nano-Thermal Interface Materials for Electronics Packaging Applications
Paper in proceedings, 2006

Author

Tomas Aronsson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

8th IEEE International Conference on Electronic Materials and Packaging (EMAP), December 11–14, 2006, Hong Kong

Subject Categories

Other Materials Engineering

More information

Created

10/7/2017