Refining Efficiency for Future CTMP and TMP systems Co-optimizing Fundamental Wood Material Knowledge with a Soft Sensor Control Approach
Paper in proceeding, 2016

Internal variables in (C)TMP-refining processes (e.g. temperature, consistency, fiber residence time, backward flowing steam and forces acting upon the chips and pulp) are defined as physical states obtained in different parts of the refining zones. In short, they differ from the traditional external variables (e.g. dilution water feed rate, load and gap distance) which are not available as distributed variables from refining zone measurements. The internal variables are the backbone of physical models and such models can be used for on-line implementation of soft sensors and advanced process control. Of special interest are the temperature and consistency profiles together with fiber residence time, which are the internal variables in focus of (in) this study. Moreover, they are directly linked to pulp and handsheet property development. To illustrate the capability to use a modeling strategy, two examples are given; one where it is shown how to reach a 40% reduction in specific energy in a CD82-refiner using a new control strategy without violating the pulp properties studied and one example where the consistency can be controlled individually in two parallel Twin refining zones. Hence, the article comprises both temperature and consistency control to reach optimal process conditions. We believe that increased fundamental understanding of the role of the spatially dependent viscosity in refining in general will be a key factor to find ways to further improve energy efficiency of refining.

temperature profile

motor load distribution

pulp consistency

fiber residence time



energy efficiency

fiber-to-bar interaction


Anders Karlström

Chalmers, Signals and Systems, Systems and control

P. Engstrand

Mid Sweden University

International Mechanical Pulp conference

978-151083073-8 (ISBN)

Areas of Advance


Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering



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