Experimental Study of Component Placement in Solder Paste
Paper in proceedings, 2004

Author

Zoran Djurovic

Martin Dahlberg

Johan Anderson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

6th IEEE-CPMT Conference on High Density Microsystem Design and Packaging and Component Failure analysis

pp 185-194

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017