Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition
Paper in proceeding, 2021

In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.

system integration

millimeter-wave integrated circuits

spatial power combiners

impedance matching

power amplifiers

waveguide transitions

Co-design

Author

Piyush Kaul

Eindhoven University of Technology

Alhassan Aljarosha

Eindhoven University of Technology

Chalmers, Electrical Engineering, Communication and Antenna Systems, Antennas

A. B. Smolders

Eindhoven University of Technology

Marion Matters-Kammerer

Eindhoven University of Technology

Rob Maaskant

Eindhoven University of Technology

Chalmers, Electrical Engineering, Communication and Antenna Systems

EuMIC 2020 - 2020 15th European Microwave Integrated Circuits Conference

217-220 9337459

15th European Microwave Integrated Circuits Conference, EuMIC 2020
Utrecht, Netherlands,

Subject Categories

Telecommunications

Communication Systems

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/EuMIC48047.2021.00066

More information

Latest update

3/18/2021