Performance Analysis of an Integrated Multi-Channel Power Amplifier Incorporating an IC-to-Waveguide Transition
Paper in proceeding, 2021

This paper studies the power combiner efficiency of multiple Power Amplifier (PA) output signals that are combined within a low-loss contactless transition, intrinsically having low isolation characteristics. Since the PA performance is sensitive to load impedance variations, poor isolation may affect each PA performance, thereby reducing the overall power combiner efficiency. Load impedance variations can e.g. be due to process, supply-voltage and temperature variations. A four-way spatial power combiner (SPC) design is compared to an on-chip Wilkinson Power Combiner (WPC) implemented in 0.13 mu m SiGe BiCMOS technology incorporating a 50 Omega impedance matching network. The WPC occupies 84% more area than the non-isolating SPC. Moreover, the non-isolating SPC has an average efficiency 14% larger than the WPC. For physically realistic variations, simulated results show a sigma-variation of 2.81 mW in P-out and 0.87 % in PAE for the non-isolating SPC, and 2.34 mW in P-out and 0.45 % in PAE for the WPC (@1 dB compression).

system integration

spatial power combiner

Wilkinson power combiner

millimeter-wave integrated circuits

power amplifiers

PVT variations

power combining efficiency

waveguide transitions

Impedance matching


Alhassan Aljarosha

Chalmers, Electrical Engineering, Communication and Antenna Systems, Antennas

Eindhoven University of Technology

Piyush Kaul

Eindhoven University of Technology

A. B. Smolders

Eindhoven University of Technology

Marion K. Matters-Kammerer

Eindhoven University of Technology

Rob Maaskant

Chalmers, Electrical Engineering, Communication and Antenna Systems

Eindhoven University of Technology


2164-3342 (ISSN)

Subject Categories


Communication Systems

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Latest update