Coaxial transitions for CPW-to-CPW flip chip interconnects
Journal article, 2007

A novel coaxial transition for CPW-to-CPW flip chip interconnect is presented and experimentally demonstrated. To realise the coaxial transition on the CPW circuit, benzocyclobutene was used as the interlayer dielectric between the vertical coaxial transition and the CPW circuit. The coaxial interconnect structure was successfully fabricated and RF characterised to 67 GHz. The structure showed excellent interconnect performance from DC up to 55 GHz with low return loss below 20 dB and low insertion loss less

Coaxial CPW-CPW transition

flip chip

Author

W. C. Wu

E. Y. Chang

C. H. Huang

L. H. Hsu

Piotr Starski

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Herbert Zirath

Chalmers, Microtechnology and Nanoscience (MC2)

Electronics Letters

Vol. 43 17, Aug. 16 929-930

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017