Milan Friesel

Professor Emeritus at Physics

Contact Details

Publications (10)
Projects (0)

Showing 10 publications

2008

Tracer diffusion of boron in alpha-Ti and gamma-TiAl

S. Divinski, F. Hisker, T. Wilger et al

Intermetallics. Vol. 16 (2), p. 148-155

Journal article

2007

Медные сплавы для реставрации язычковых труб в исторических органах

Boris B. Straumal, Brigitte Baretzky, Janis Kalnins et al

Yurnal funkcional'nych materialov [Journal of Functional Materials] (T. 1, no. 1), p. 410-

Journal article

2007

Reconstruction of historical alloys for pipe organs brings true baroque music back to life

B. Baretzky, Milan Friesel, B. Straumal

MRS Bulletin. Vol. 32 (3), p. 249-255

Journal article

2007

High-Temperature Electronic Materials: Silicon Carbide and Diamond

Magnus Willander, Milan Friesel, Q.-U. Wahab et al

Springer Handbooks, p. 537-563

Book chapter

2006

Structure of historical brass tongues and shallots from Baroque organs

B. Baretzky, Milan Friesel, A. Petelin et al

Defect and Diffusion Forum. Vol. 249, p. 275-280

Journal article

2006

Nitrogen Incorporation in GaNAs Layers Grown by Molecular Beam Epitaxy

Qing Xiang Zhao, Shu Min Wang, Mahdad Sadeghi et al

Applied Physics Letters. Vol. 89 (3), p. 031907-

Journal article

2006

Silicon carbide and diamond for high temperature device applications

Magnus Willander, Milan Friesel, Q.-U. Wahab et al

Journal of Materials Science: Materials in Electronics. Vol. 17 (1), p. 1-25

Journal article

2005

Microstructure of Ni-based self-fluxing alloy coating (Part I)

JH Wang, Milan Friesel, Magnus Willander et al

Journal of Iron and Steel Research International. Vol. 12 (1), p. 50-53

Journal article

2005

Microstructure of Ni-based self-fluxing alloy sprayed coating

Jin-hua Wang, Milan Friesel, Magnus Willander et al

Journal of Iron and Steel Research International. Vol. 12 (2), p. 56-59

Journal article

2004

Structural properties of relaxed Ge buffer layers on Si(001): effect of layer thickness and low temperature Si initial buffer

Tobias Myrberg, AP Jacob, O. Nur et al

Journal of Materials Science: Materials in Electronics. Vol. 15 (7), p. 411-417

Journal article

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