Yu Wang

Showing 2 publications


Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applications

Johan Liu, Yu Wang, James Morris et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp156-172
Paper in proceeding

Development of an ontology for the ACA technology in electronics applications

Johan Liu, Yu Wang, James Morris
10th International Symposium and Exhibition on, Advanced Packaging Materials. Vol. 8 (1)
Paper in proceeding

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