Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applications
Paper in proceeding, 2005
Author
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Yu Wang
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
James Morris
Helge Kristiansen
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05)
pp156-172
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering