Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applications
Paper in proceedings, 2005

Author

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Yu Wang

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

James Morris

Helge Kristiansen

Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05)

pp156-172

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017