Johan Liu

Professor at Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Dr Johan Liu graduated with a master and a Ph.D. degree in materials science from the Royal Institute of Technology, Sweden. Before joining Chalmers University of Technology, he served in various positions at the Swedish Institute for Production Engineering Research (IVF) as project manager, group leader and division manager. He is currently full professor in electronics production and head of Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience in Chalmers University of Technology, Sweden. He is also director of SMIT Center both at Chalmers University of Technology and Shanghai University, China (A joint center between Sweden and China).As a member of the Royal Swedish Academy of Engineering Sciences and a fellow of IEEE, he has published 480 papers in journals, proceedings and book chapters with a Hirsch index of 25 in Web of Science (WoS) and 33 in Google Scholar Citation System (Google Scholar) and with a citation of over 2200 times (WoS) or 3300 (Google Scholar). He has 70 patents accepted or filed and has given about 50 key note/invited talks during the last 25 years. Recently, he has published 25 papers with impact factor over 3,5 (6 of them over 10). He has also received many awards including IEEE Exceptional Technical Achievement Award, IEEE CPMT Transaction Best paper award in “Advanced Packaging”. His research field covers mainly nanoelectronics, microsystems packaging and 3D additive manufacturing materials and processes including vertical stacking CNT TSV technology, CNT/graphene assisted cooling technology, graphene heat spreader, high temperature stable conductive adhesives, nano-soldering, nano-thermal interface materials and biomedical nanoscaffolds.

Source: chalmers.se

Projects

2017–2017

Värmespridare och värmeöverförande element med grafenbaserade filmer för radar och laser

Johan Liu Electronics Material and Systems Laboratory
Torbjörn Nilsson Electronics Material and Systems Laboratory
VINNOVA

2009–2012

Nanomaterial from stem cell divistion, migration and differentiation into neuronal cells

Johan Liu Electronics Material and Systems
VINNOVA

2011–2016

Computational and experimental analysis of drop-on-demand jetting of complex fluids

Johan Liu Electronics Material and Systems Laboratory
Gustaf Mårtensson Electronics Material and Systems Laboratory
Swedish Research Council (VR)

2017–2017

Grafenförstärkt betong för lättvikts stängsel

Johan Liu Electronics Material and Systems Laboratory
VINNOVA

2016–2017

Grafenförstärkta betongpålar - industrialisering av funktionaliserad grafen i betong

Johan Liu Electronics Material and Systems
Luping Tang Building Technology
VINNOVA

2016–2016

Long-term performance monitoring of concrete structures using a novel graphene-based DURAble SENSor

Sotirios Grammatikos Building Technology
Johan Liu Electronics Material and Systems
VINNOVA

2016–2020

Nanotechnology Enhanced Sintered Steel Processing

Lars Nyborg Materials and Manufacturing Technology
Johan Liu Microtechnology and Nanoscience (MC2)
Eduard Hryha Surface and Microstructure Engineering
Swedish Foundation for Strategic Research (SSF)

2016–2018

Pilot line production of functionalized CNTs as thermal interface material for heat dissipation in electronics applications (SMARTHERM)

Johan Liu Electronics Material and Systems Laboratory
European Commission (Horizon 2020)

2015–2016

Miniatyriserad kryokylare baserad på grafen

Johan Liu Electronics Material and Systems Laboratory
VINNOVA

2015–2019

Graphene reinforced composite for asphalt pavements

Luping Tang Building Technology
Johan Liu Electronics Material and Systems Laboratory
Norwegian Public Roads Administration

2014–2019

Carbon Based High Speed 3D GaN Electronics System

Johan Liu Electronics Material and Systems Laboratory
Per Hyldgaard Electronics Material and Systems Laboratory
Jan Stake Terahertz and Millimetre Wave Laboratory
Andrei Vorobiev Terahertz and Millimetre Wave Laboratory
Swedish Foundation for Strategic Research (SSF)

2015–2018

Phononic Thin-Film Thermoelectric Generators - HotTEG

Johan Liu Electronics Material and Systems Laboratory
Swedish Research Council (VR)

2015–2017

EUREKA Eurostars E! 9395 COPTIMS KTH

Johan Liu Electronics Material and Systems Laboratory
VINNOVA

2014–2015

Förstudie på Miniatyriserad kryokylare baserad på grafen

Johan Liu Electronics Material and Systems Laboratory
VINNOVA

2011–2015

Micro and Nano Technologies Based on Wide Band Gap Materials for Future Transmitting Receiving and Sensing Systems (NANOCOM)

Johan Liu Electronics Material and Systems Laboratory
European Commission (EC)

2015–2017

Funtionalized graphene reinforced cementitious materials for greener construction

Johan Liu Electronics Material and Systems Laboratory
Luping Tang Building Technology
Formas

2012–2014

Environmental reliability of nano-structured polymer-metal composite thermal interface material

Johan Liu Electronics Material and Systems Laboratory
VINNOVA

2012–2015

Skalbar Nanomaterial och lösning bearbetningsbar TEG

Johan Liu Electronics Material and Systems Laboratory
Swedish Foundation for Strategic Research (SSF)

2011–2015

Smart integration of GaN and SiC high power electronics for industrial and RF applications (SMARTPOWER)

Johan Liu Electronics Material and Systems Laboratory
Murali Murugesan Electronics Material and Systems Laboratory
European Commission (FP7)

3 publications exist
2012–2015

Innovative Nano and Micro Technologies for Advanced Thermo and Mechanical Interfaces (NANOTHERM)

Johan Liu Electronics Material and Systems Laboratory
European Commission (FP7)

3 publications exist
2012–2015

Carbon Based Smart Systems for Wireless Applications (NANO RF)

Johan Liu Electronics Material and Systems Laboratory
Murali Murugesan Electronics Material and Systems Laboratory
European Commission (FP7)

8 publications exist
There might be more projects where Johan Liu participates, but you have to be logged in as a Chalmers employee to see them.

Publications

2017

An overview of carbon nanotubes based interconnects for microelectronic packaging

S. Chen, B. Shan, Y. Yang et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 113-119
Paper in proceedings
2017

Thermal Conductivity Enhancement of Coaxial Carbon@Boron Nitride Nanotube Arrays

Lin Jing, Kabir Majid Samani, B. Liu et al
ACS Applied Materials & Interfaces. Vol. 9 (17), p. 14555-14560
Journal article
2017

Silver decorated graphene-polyvinyl alcohol hybrid hydrogel as catalyst for benzonitrile conversion

Marcello Casa, Maria Sarno, Johan Liu et al
Advanced Science Letters. Vol. 23 (6), p. 5980-5983
Journal article
2017

Sintering of SiC enhanced copper paste for high power applications

Marti Gutierrez, Nan Wang, Kabir Majid Samani et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 151-156
Paper in proceedings
2017

Efficient surface modification of carbon nanotubes for fabricating high performance CNT based hybrid nanostructures

Nan Wang, Santosh Pandit, L. Ye et al
Carbon. Vol. 111, p. 402-410
Journal article
2017

Fabrication and characterization of a carbon fiber solder composite thermal interface material

Josef Hansson, L. Ye, Johan Liu
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 97-100
Paper in proceedings
2017

Control of Nanoplane Orientation in voBN for High Thermal Anisotropy in a Dielectric Thin Film: A New Solution for Thermal Hotspot Mitigation in Electronics

O. Cometto, Kabir Majid Samani, B. Liu et al
ACS Applied Materials & Interfaces. Vol. 9 (8), p. 7456-7464
Journal article
2017

Investigation of thermal interface materials reinforced with micro- and nanoparticles

K. Janeczek, A. Arazna, Y. Zhang et al
Paper in proceedings
2017

Sintering of SiC enhanced copper paste for high power applications

Marti Gutierrez, Nan Wang, Kabir Majid Samani et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 151-156
Paper in proceedings
2017

Effect of sintering method on properties of nanosilver paste

Q. Zhang, Johan Liu, W. Ke et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 186-189
Paper in proceedings
2017

Evaluating CNT-Based Interconnects : A Nummerical Tool to Characterize Hybrid CNT-Copper Interconnects

Silvia Bistarelli, Shuangxi Sun, Luca Pierantoni et al
IEEE Microwave Magazine. Vol. 18 (4), p. 124-129
Journal article
2017

Control of Nanoplane Orientation in voBN for High Thermal Anisotropy in a Dielectric Thin Film: A New Solution for Thermal Hotspot Mitigation in Electronics

O. Cometto, Kabir Majid Samani, B. Liu et al
ACS Applied Materials & Interfaces. Vol. 9 (8), p. 7456-7464
Journal article
2017

Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging

Y. Yang, H. Ye, W. Ke et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 125-128
Paper in proceedings
2017

Synthesis of tunable hydrogels based on O-acetyl-galactoglucomannans from spruce

Kajsa Markstedt, W. Xu, Johan Liu et al
Carbohydrate Polymers. Vol. 157, p. 1349-1357
Journal article
2017

Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier

S. Huang, W. Ke, Y. Yang et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 143-146
Paper in proceedings
2017

Fabrication and characterization of graphene based film

Yuqing Shi, L. Ye, Abdelhafid Zehri et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 162-166
Paper in proceedings
2017

Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications

ANDREAS NYLANDER, Yifeng Fu, L. Ye et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 175-181
Paper in proceedings
2017

Cellulose-derived carbon nanofibers/graphene composite electrodes for powerful compact supercapacitors

Volodymyr Kuzmenko, Nan Wang, Mohammad Mazharul Haque et al
RSC Advances. Vol. 7 (73), p. 45968-45977
Journal article
2017

Finite element analysis of bond line thickness and fiber distribution in solder based thermal interface materials

Maulik Satwara, Josef Hansson, L. Ye et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 167-171
Paper in proceedings
2017

Synthesis and characterization of three-dimensional graphene foams by chemical vapor deposition

Yong Zhang, Kabir Majid Samani, Johan Liu
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 139-142
Paper in proceedings
2017

Stretchable Thermoelectric Generators Metallized with Liquid Alloy

Seung Hee Jeong, Francisco Javier Cruz, Si Chen et al
ACS Applied Materials & Interfaces. Vol. 9 (18), p. 15791-15797
Journal article
2017

Graphene-CNT hybrid material as potential thermal solution in electronics applications

C. C. Darmawan, L. Ye, Kabir Majid Samani et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 190-193
Paper in proceedings
2017

Efficient surface modification of carbon nanotubes for fabricating high performance CNT based hybrid nanostructures

Nan Wang, Santosh Pandit, L. Ye et al
Carbon. Vol. 111, p. 402-410
Journal article
2017

Graphene-based heat spreading materials for electronics packaging applications

G. Yuan, B. Shan, S. Chen et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 172-174
Paper in proceedings
2017

Chemical vapor deposition grown graphene on Cu-Pt alloys

Yong Zhang, Yifeng Fu, Michael Edwards et al
Materials Letters. Vol. 193, p. 255-258
Journal article
2016

Development of bulk-nanostructuring methods for BiSbTe Thermoelectric

ANDREAS NYLANDER, Nikolaos Logothetis, Johan Liu
Conference contribution
2016

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability. Vol. 56, p. 129-135
Journal article
2016

Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

Wei Mu, Yifeng Fu, Shuangxi Sun et al
Chemical Engineering Journal. Vol. 304 (15 November 2016), p. 106-114
Journal article
2016

2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS

Yong Zhang, S. Huang, Nan Wang et al
China Semiconductor Technology International Conference (CSTIC) (Shanghai, March 13-14)
Conference contribution
2016

Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

Wei Mu, Yifeng Fu, Shuangxi Sun et al
Chemical Engineering Journal. Vol. 304 (15 November 2016), p. 106-114
Journal article
2016

Mechanical characterization ofnanoparticleenhancedSn-3.0Ag-0.5Cu solder

Lilei Ye, Si Chen, Johan Liu
Paper in proceedings
2016

The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging

Shirong Huang, Jie Bao, N. Wang et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p. Art no 7583272; Pages 889-892
Paper in proceedings
2016

Carbon nanotube growth on different underlayers for thermal interface material application

Yifeng Fu, Shuangxi Sun, Wei Mu et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceedings
2016

A review of recent progress of thermal interface materials: from research to industrial applications

Josef Hansson, Liley Ye, Henric Rhedin et al
Paper in proceedings
2016

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Shuangxi Sun, Wei Mu, Michael Edwards et al
Nanotechnology. Vol. 27 (33), p. Art no335705-
Journal article
2016

Nanophotonics-based low-temperature PECVD epitaxial crystalline silicon solar cells

W. H. Chen, R. Cariou, M. Foldyna et al
Journal of Physics D: Applied Physics. Vol. 49 (12)
Journal article
2016

Enhanced cooling properties of radar antenna electronics using novel materials

Torbjörn M J Nilsson, Lilei Ye, Johan Liu
Paper in proceedings
2016

Review of Current Progress of Thermal Interface Materials for Electronics Thermal Management Applications

Josef Hansson, Carl Zandén, L. Ye et al
2016 Ieee 16th International Conference on Nanotechnology (Ieee-Nano), p. 371-374
Paper in proceedings
2016

Heat dissipation of a hybrid CNT/Graphene based heat spreader

Shuangxi Sun, Peng Su, Nan Wang et al
Paper in proceedings
2016

Graphene oxide based coatings on Nitinol for biomedical implant applications: Effectively promote mammalian cell growth but kill bacteria

Changhong Zhao, Santosh Pandit, Yifeng Fu et al
RSC Advances. Vol. 6 (44), p. 38124-38134
Journal article
2016

Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders

Kjell Jeppson, Jie Bao, S. Huang et al
29th IEEE International Conference on Microelectronic Test Structures (ICMTS), Yokohama, Japan, Mar 28-31, 2016, p. 32-36
Paper in proceedings
2016

Review of Current Progress of Thermal Interface Materials for Electronics Thermal Management Applications

Josef Hansson, Carl Zandén, L. Ye et al
2016 Ieee 16th International Conference on Nanotechnology (Ieee-Nano), p. 371-374
Paper in proceedings
2016

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Di Jiang, Nan Wang, Michael Edwards et al
Small. Vol. 12 (11), p. 1521-1526
Journal article
2016

A brief overview of atomic layer deposition and etching in the semiconductor processing

G. Yuan, N. Wang, Shirong Huang et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p. 1365-1368
Paper in proceedings
2016

Thermal properties of TIM using CNTs forest in electronics packaging

Dongsheng Zhang, Johan Liu, Shuangxi Sun et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016; Wuhan Optics Valley Kingdom Hotel Wuhan; China; 16 August 2016 through 19 August 2016, p. 1355-1359
Paper in proceedings
2016

Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation

Xin Luo, J. C. Peng, Carl Zandén et al
Acta Materialia. Vol. 104, p. 109-118
Journal article
2016

Experimental investigation of paraffin wax with graphene enhancement as thermal management materials for batteries

Yan Zhang, Wang Yue, Shaochun Zhang et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p. 1401-1405
Paper in proceedings
2016

Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications

Yong Zhang, Michael Edwards, Kabir Majid Samani et al
Carbon. Vol. 106, p. 195-201
Journal article
2016

Thermal conductivity measurement of densified carbon nanotube bundles by pulsed photothermal reflectance technique

Kabir Majid Samani, Shuangxi Sun, Yifeng Fu et al
Paper in proceedings
2016

FREESTANDING CARBON NANOFIBERS/GRAPHENE COMPOSITE ELECTRODES FOR SUPERCAPACITORS

Volodymyr Kuzmenko, Nan Wang, Arun Bhaskar et al
Paper in proceedings
2016

Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes

Wei Mu, Eun-Hye Kwak, Bingan Chen et al
Electronic Materials Letters. Vol. 12 (3), p. 329-337
Journal article
2016

Application of two-dimensional layered hexagonal boron nitride in chip cooling

Jie Bao, Y. Zhang, S. Huang et al
Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering. Vol. 24 (1), p. 210-217
Magazine article
2016

Enhanced cooling properties of radar antenna electronics using novel materials

Torbjörn M J Nilsson, Lilei Ye, Johan Liu
Paper in proceedings
2016

Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives

Nan Wang, Nikolaos Logothetis, Wei Mu et al
2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764682-
Paper in proceedings
2016

Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review

Yifeng Fu, Wei Mu, Shuangxi Sun et al
2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764713-
Paper in proceedings
2016

Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

Wei Mu, Josef Hansson, Shuangxi Sun et al
66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, USA, May 31-Jun 03, 2016, p. 211-216
Paper in proceedings
2016

Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging

Jie Bao, Michael Edwards, Shirong Huang et al
Journal of Physics D: Applied Physics. Vol. 49 (July 2016), p. 265501-
Journal article
2016

Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing

Jie Bao, Kjell Jeppson, Michael Edwards et al
Electronic Materials Letters. Vol. 12 (1), p. 1-16
Journal article
2016

Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging

Shirong Huang, N. Wang, Jie Bao et al
6th Electronic System-integration Technology Conference (ESTC 2016), p. Article no 7764696-
Paper in proceedings
2016

Graphene-based heater

Yong Zhang, Michael Edwards, Yifeng Fu et al
IMAPS Nordic Annual Conference 2016; Tonsberg; Norway; 5-7 June 2016
Paper in proceedings
2016

Preventing Aging of Electrically Conductive Adhesives on Metal Substrate Using Graphene-Based Barrier

Hui Ye, Shirong Huang, Kjell Jeppson et al
2016 China Semiconductor Technology International Conference (CSTIC), p. Shanghai, China-
Conference contribution
2016

Finite element simulation of 2D-based materials as heat spreaders

Michael Edwards, Yong Zhang, Jie Bao et al
Paper in proceedings
2016

Functionalization mediates heat transport in graphene nanoflakes

H. X. Han, Yong Zhang, Nan Wang et al
Nature Communications. Vol. 7
Journal article
2016

Graphene Fibres: Towards high mechanical, thermal and electrical properties state of art

Abdelhafid Zehri, Josef Hansson, Lilei Ye et al
Paper in proceedings
2016

Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor

Wei Mu, Yifeng Fu, Shuangxi Sun et al
Paper in proceedings
2015

Flexible Multi-functionalized Carbon Nanotubes Based Hybrid Nanowires

Nan Wang, Di Jiang, Lilei Ye et al
Advanced Materials for Optics and Electronics
Journal article
2015

Thermal elastomer composites for soft transducers

Seung Hee Jeong, Si Chen, Jinxing Huo et al
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015, p. 1873-1876
Paper in proceedings
2015

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment

Seung Hee Jeong, Si Chen, Jinxing Huo et al
Scientific Reports. Vol. 5, p. 18257-
Journal article
2015

Cooling hot spots by hexagonal boron nitride heat spreaders

Shuangxi Sun, Jie Bao, Wei Mu et al
2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015, San Diego, United States, 26-29 May 2015, p. 1658-1663
Paper in proceedings
2015

Flexible Multifunctionalized Carbon Nanotubes-Based Hybrid Nanowires

Nan Wang, Di Jiang, L. Ye et al
Advanced Materials for Optics and Electronics. Vol. 25 (26), p. 4135-4143
Journal article
2015

Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application

Yong Zhang, H. X. Han, Nan Wang et al
Advanced Functional Materials. Vol. 25 (28), p. 4430-4435
Journal article
2015

Unusual tensile behavior of fiber-reinforced indium matrix composite and its in-situ TEM straining observation

Xin Luo, Jianchao Peng, Carl Zandén et al
Acta Materialia
Journal article
2015

A High Performance Ag Alloyed Nano-scale n-type Bi2Te3 Based Thermoelectric Material

Si Chen, Nikolaos Logothetis, L. Ye et al
Materials Today: Proceedings. Vol. 2 (2), p. 610-619
Paper in proceedings
2015

Reliability of Graphene-based Films Used for High Power Electronics Packaging

Shirong Huang, Yong Zhang, Nan Wang et al
16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11-14 August 2015, p. 852-855
Paper in proceedings
2015

Liquid Phase Exfoliated Graphene for Thermal Management in Electronic Packaging

Yong Zhang, Yifeng Fu, Ye Lilei et al
Paper in proceedings
2015

Chemically enhanced carbon nanotubes based Thermal Interface Materials

J. Daon, Shuangxi Sun, Di Jiang et al
Conference contribution
2015

Combination of positive charges and honeycomb pores to promote MC3T3-E1 cell behaviour

C. H. Zhao, C. J. Pan, Joakim Sandstedt et al
RSC Advances. Vol. 5 (53), p. 42276-42286
Journal article
2015

The promising application of graphene oxide coatings in orthopedic implants: preparation, characterization, cell behavior, and antimicrobial activity

Johan Liu, Changhong Zhao, Xiuzhen Lu et al
Journal of Biomedical Materials Research - Part A
Journal article
2015

Measurement of Dielectric Properties of Ultrafine BaTiO3 Using an Organic-Inorganic Composite Method

Jie Bao, W. W. Wang, S. T. Li et al
Journal of Electronic Materials. Vol. 44 (7), p. 2300-2307
Journal article
2015

Vertically stacked carbon nanotube-based interconnects for through silicon via application

Di Jiang, Wei Mu, Si Chen et al
IEEE Electron Device Letters. Vol. 36 (5), p. 499-501
Journal article
2015

Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging

Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability
Journal article
2015

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Wei Mu, Shuangxi Sun, Di Jiang et al
Journal of Electronic Materials. Vol. 2015 (17 April), p. http://dx.doi.org/10.1007/s11664-015-3752-2-
Journal article
2015

Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles

Si Chen, Xin Luo, Di Jiang et al
IEEE Transactions on Components, Packaging and Manufacturing Technology. Vol. 5 (8), p. 1186-1196
Journal article
2015

The promising application of graphene oxide as coating materials in orthopedic implants: preparation, characterization and cell behavior

C. H. Zhao, X. Lu, Carl Zandén et al
Biomedical Materials (Bristol). Vol. 10 (1), p. Art.no. 015019-
Journal article
2014

Reliability of carbon nanotube bumps for chip on glass application

X. Fan, X. Li, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962753-
Paper in proceedings
2014

Energy efficient nano metal polymer composites for cooling applications

Johan Liu, Carl Zandén, Lilei Ye
Paper in proceedings
2014

Ultra-short vertically aligned carbon nanofibers transfer and application as bonding material

Johan Liu
Soldering and Surface Mount Technology
Journal article
2014

Characterization of Nano-Enhanced Interconnect Materials for Fine Pitch Assembly

Johan Liu
Soldering and Surface Mount Technology
Journal article
2014

Use of graphene-based films for hot spot cooling

Yong Zhang, Pengtu Zhang, Nan Wang et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962834-
Paper in proceedings
2014

Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application

J. Sitek, M. Koscielski, Y. Zhang et al
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014 (Art. no. 6922625), p. 151-154
Paper in proceedings
2014

Carbon fiber solder matrix composite for thermal management of high power electronics

Murali Murugesan, Carl Zandén, Xin Luo et al
Journal of Materials Chemistry. Vol. 2 (35), p. 7184-7187
Journal article
2014

A new solder matrix nano polymer composite for thermal management and die attach applications

Johan Liu, Carl Zandén, Xin Luo et al
Composites Science and Technology. Vol. 94, p. 54-61
Journal article
2014

Study on the verification of IR and RTD methods applied in the thermal measurement of high power chips

Yan Zhang, C. He, Yong Zhang et al
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014, p. 1507-1511
Paper in proceedings
2014

Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications

Xin Luo, Yong Zhang, Carl Zandén et al
Journal of Materials Science: Materials in Electronics. Vol. 25 (5), p. 2333-2338
Journal article
2014

A carbon fiber solder matrix composite for thermal management of microelectronic devices

Murali Murugesan, Carl Zandén, Xin Luo et al
Journal of Materials Chemistry C. Vol. 2 (35), p. 7184-7187
Journal article
2014

Pre-Study of Graphene-Enhanced Cementitious Materials

Luping Tang, Johan Liu, Nan Wang et al
Report
2014

Boron nitride nanofiber and indium composite based thermal interface materials for electronics heat dissipation applications

Xin Luo, Yong Zhang, Carl Zandén et al
Journal of Materials Science: Materials in Electronics. Vol. 25 (5), p. 2333-2338
Journal article
2014

Enhanced Heat Spreader Based on Few-Layer Graphene Intercalated With Silane-Functionalization Molecules

Hao xue han, Y. A. Kosevich, Yong Zhang et al
IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014, p. 1-4
Paper in proceedings
2014

A Novel Method for Three-Dimensional Culture of Central Nervous System Neurons.

Till B. Puschmann, Yolanda de Pablo, Carl Zandén et al
Tissue engineering. Part C, Methods. Vol. 20 (6), p. 485-492
Journal article
2014

Development and characterization of graphene-enhanced thermal conductive adhesives

Marcello Casa, S. Huang, Paolo Ciambelli et al
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014 (Art. no. 6922700), p. 480-483
Paper in proceedings
2014

1. Thermal Characterization of Power Devices Using Graphene-based Film

Johan Liu, Pengtu Zhang, Nan Wang et al
2014 Electronic Components & Technology Conference, p. 459 - 463
Paper in proceedings
2014

A new solder matrix nano polymer composite for thermal management applications

Carl Zandén, Xin Luo, L. Ye et al
Composites Science and Technology. Vol. 94, p. 54-61
Journal article
2014

Stem cell responses to plasma surface modified electrospun polyurethane scaffolds.

Carl Zandén, Nina Hellström Erkenstam, Thomas Padel et al
Nanomedicine: Nanotechnology, Biology, and Medicine. Vol. 10 (5), p. 949-958
Journal article
2014

A solder joint structure with vertically aligned carbon nanofibres as reinforcements

S. Chen, Di Jiang, L. Ye et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962851-
Paper in proceedings
2014

HB-EGF affects astrocyte morphology, proliferation, differentiation, and the expression of intermediate filament proteins

Till B. Puschmann, Carl Zandén, Isabell Lebkuechner et al
Journal of Neurochemistry. Vol. 128 (6), p. 878-889
Journal article
2014

Carbon nanotube/solder hybrid structure for interconnect applications

Di Jiang, Shuangxi Sun, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962751-
Paper in proceedings
2014

Experimental results versus numerical simulations of In/Cu intermetallic compounds growth

T. Fałat, B.T. Płatek, P.K. Matkowski et al
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, Marina Bay Sands, Singapore, 3-5 December 2014, p. 797-800
Paper in proceedings
2014

Characterization of nano-enhanced interconnect materials for fine pitch assembly

Y. Zhang, J. Sitek, J. Fan et al
Soldering and Surface Mount Technology. Vol. 26 (1), p. 12-17
Journal article
2014

CHEMICALLY VAPOR DEPOSITED CARBON NANOTUBES FOR VERTICAL ELECTRONICS INTERCONNECT IN PACKAGING APPLICATIONS

Johan Liu, Yifeng Fu, Di Jiang
Proceedings of the 12th international conference on Solid States and Integrated Circuits, ICSICT2014, p. 47-50
Paper in proceedings
2014

Thermal characterization of power devices using graphene-based film

P. Zhang, Nan Wang, Carl Zandén et al
64th Electronic Components and Technology Conference, ECTC 2014; Walt Disney World Swan and Dolphin ResortOrlando; United States; 27 May 2014 through 30 May 2014, p. 459-463
Paper in proceedings
2013

Investigation on interaction between indium based thermal interface material and copper and silicon substrates

Fatat Tomasz, Ptatek Barotsz, Matkowski Przemystaw et al
Paper in proceedings
2013

Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration

Johan Liu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (1), p. 13-27
Journal article
2013

Characterization for Graphene as Heat Spreader Using Thermal Imaging Method

Shirong Huang, Yong Zhang, Shuangxi Sun et al
Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT), p. 403-408
Paper in proceedings
2013

Mechanical properties of a novel Nano-Thermal Interface Material

Wangli Peng, Carl Zandén, Lilei Ye et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 942-945
Paper in proceedings
2013

Bioactive 3D cell culture system minimizes cellular stress and maintains the in vivo-like morphological complexity of astroglial cells

Till B. Puschmann, Carl Zandén, Yolanda de Pablo et al
GLIA. Vol. 61 (3), p. 432-440
Journal article
2013

Experimental study of Electrical properties and stability of CNT bumps in high density interconnects

Yan Zhang, Yingjie Zhou, Jingyu Fan et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 1085-1088
Paper in proceedings
2013

Controlling the Density of CNTs by Different UnderlayerMaterials in PECVD Growth

Liang Xu, Di Jiang, Yifeng Fu et al
Proceedings of the 19th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems, September 25-27 2013, Berlin, Germany, IEEE / Therminic 2013, p. 248-252
Paper in proceedings
2013

Surface oxide analysis of lead-free solder particles

Xin Luo, W. Du, X. Lu et al
Soldering and Surface Mount Technology. Vol. 25 (1), p. 39-44
Journal article
2013

Molecular dynamics simulation of inertial trapping-induced atomic scale mass transport inside single walled carbon nanotubes

Z. L. Hu, Gustaf Mårtensson, Murali Murugesan et al
Applied Physics Letters. Vol. 102 (8)
Journal article
2013

Fabrication and Characterization of a Metal Matrix Polymer Fibre Composite for Thermal Interface Material Applications

Carl Zandén, Xin Luo, Lilei Ye et al
19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013; Berlin; Germany; 25 September 2013 through 27 September 2013, p. 286-292
Paper in proceedings
2013

Experimental Study on the Mechanical Reliability of Carbon Nanotubes

Yan Zhang, Ling Wang, Jingyu Fan et al
Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT), p. 105-108
Paper in proceedings
2013

Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD

Liang Xu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (3), p. 236-240
Journal article
2013

Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots

Zhaoli Gao, Yong Zhang, Y. F. Fu et al
Carbon. Vol. 61, p. 342-348
Journal article
2013

Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology

Shirong Huang, Yong Zhang, Shuangxi Sun et al
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), p. 347-352
Paper in proceedings
2013

Reliability of Carbon Nanotube Bumps for Chip on Film Application

X. Li, Wei Mu, Di Jiang et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 845-848
Paper in proceedings
2013

Graphene Heat Spreader for Thermal Management of Hot Spots

Zhaoli Gao, Yong Zhang, Yifeng Fu et al
Proceedings of the IEEE 2013 Electronic Components & Technology Conference, p. 2075-2078
Paper in proceedings
2013

Experimental measurements for mechanical and electrical conductive properties of CNT bundles

Y. Zhang, Yingjie Zhou, Jing-yu Fan et al
6th International Conference on Nonlinear Mechanics, ICNM 2013; Shanghai; China; 12 August 2013 through 15 August 2013, p. 454-457
Paper in proceedings
2012

Low Partial Pressure Chemical Vapor Deposition of Graphene on Copper

Jie Sun, Niclas Lindvall, Matthew Cole et al
IEEE Transactions on Nanotechnology. Vol. 11 (2), p. 255-260
Journal article
2012

Thick film patterning by lift-off process using double-coated single photoresists

Yifeng Fu, L. Ye, Johan Liu
Materials Letters. Vol. 76, p. 117-119
Journal article
2012

Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material

Shuangxi Sun, Wei Mu, Yan Zhang et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging (Article number 6474593), p. 171-176
Paper in proceedings
2012

Environmental reliability of nano-structured polymer-metal composite thermal interface material

Xiuzhen Lu, Mengke Zhuang, Lei Zhang et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 1326-1328
Paper in proceedings
2012

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

Kjell Jeppson, Teng Wang, Di Jiang et al
IEEE Electron Device Letters. Vol. 33 (3), p. 420-422
Journal article
2012

Development and Characterization of Nano-Composite Solder

Johan Liu, Si Chen, Lilei Ye
Lead-Free Solders: Materials Reliability for Electronics, p. 161-177
Chapter in monograph, book - peer reviewed
2012

Characterization of CNT Enhanced Conductive Adhesives in Terms of Thermal Conductivity

Zhfei Zhang, Lilei Ye, Akos Kukovecz et al
ECS Transactions. Vol. 44 (1), p. 1011-1017
Paper in proceedings
2012

Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler

Yan Zhang, Huifeng Lv, Jing-yu Fan et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 1573-1577
Paper in proceedings
2012

Microstructural evolution in electrically conductive adhesives containing Ag micro-fillers during curing and annealing

Masahiro Inoue, Hiroaki Muta, Shinsuke Yamanaka et al
CD Proceedings of the 4th Electronics System Integration Technologies Conference (ESTC 2012), p. 27-
Paper in proceedings
2012

Organic Thin-Film Transistors with Anodized Gate Dielectric Patterned by Self-Aligned Embossing on Flexible Substrates

Yiheng Qin, D. H. Turkenburg, I. Barbu et al
Advanced Materials for Optics and Electronics. Vol. 22 (6), p. 1209-1214
Journal article
2012

Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate

Di Jiang, Yifeng Fu, Yan Zhang et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, Budapest, 25-27 September 2012, p. 213-216
Paper in proceedings
2012

Formation of three-dimensional carbon nanotube structures by controllable vapor densification

Teng Wang, Di Jiang, Si Chen et al
Materials Letters. Vol. 78, p. 184-187
Journal article
2012

Polymer-metal nanofibrous composite for thermal management of microsystems

Björn Carlberg, L. Ye, Johan Liu
Materials Letters. Vol. 75, p. 229-232
Journal article
2012

Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application

Di Jiang, Teng Wang, Si Chen et al
Microelectronic Engineering. Vol. 103, p. Pages 177-180
Journal article
2012

Electrical Interconnects Made of Carbon Nanotubes: Applications in 3D Chip Stacking

Di Jiang, Lilei Ye, Kjell Jeppson et al
IMAPS Nordic Annual Conference Proceedings 2012, Helsingor, 2 - 4 September 2012, p. 150-159
Paper in proceedings
2012

Effect of microstructural evolution in electrically conductive adhesives containing Ag micro-fillers

Masahiro Inoue, Hiroaki Muta, Johan Liu
Proceedings of the ICEP-IAAC Conference, p. 676-680
Paper in proceedings
2012

Controllable chemical vapor deposition of large area uniform nanocrystalline graphene directly on silicon dioxide

Jie Sun, Niclas Lindvall, M. T. Cole et al
Journal of Applied Physics. Vol. 111 (4)
Journal article
2012

Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology

Di Jiang, Teng Wang, Lilei Ye et al
ECS Transactions. Vol. 44 (1), p. 683-692
Paper in proceedings
2012

Thermal performance characterization of nano thermal interface materials after power cycling

S. Sun, L. Xin, Carl Zandén et al
Proceedings - Electronic Components and Technology Conference, p. 1426-1430
Paper in proceedings
2012

Detecting single molecules inside a carbon nanotube to control molecular sequences using inertia trapping phenomenon

Zhili Hu, Gustaf Mårtensson, Murali Murugesan et al
Applied Physics Letters. Vol. 101 (13), p. Art. no. 133105-
Journal article
2012

Selective growth of double-walled carbon nanotubes on gold films

Yifeng Fu, Si Chen, Johan Bielecki et al
Materials Letters. Vol. 72, p. 78-80
Journal article
2012

Graphene Heat Spreader for Thermal Management of Hot Spots in Electronic Packaging

Zhaoli Gao, Yong Zhang, Yifeng Fu et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, p. 217-220
Paper in proceedings
2012

Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene

Yifeng Fu, Björn Carlberg, Niklas Lindahl et al
Advanced Materials. Vol. 24 (12), p. 1576-1581
Journal article
2012

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Yifeng Fu, N. Nabiollahi, Teng Wang et al
Nanotechnology. Vol. 23 (4)
Journal article
2012

TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder

Manman Rui, Xiuzhen Lu, Si Chen et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 203-207
Paper in proceedings
2012

Reliability investigation of nano-enhanced thermal conductive adhesives

Nan Wang, Murali Murugesan, L. Ye et al
Proceedings of the IEEE Conference on Nanotechnology
Paper in proceedings
2012

Direct Chemical Vapor Deposition of Large-Area Carbon Thin Films on Gallium Nitride for Transparent Electrodes: A First Attempt

Jie Sun, M. T. Cole, S. Awais Ahmad et al
IEEE Transactions on Semiconductor Manufacturing. Vol. 25 (3), p. 494-501
Journal article
2012

A method to integrate patterned electrospun fibers with microfluidic systems to generate complex microenvironments for cell culture applications

Patric Wallin, Carl Zandén, Björn Carlberg et al
Biomicrofluidics. Vol. 6 (2)
Journal article
2012

Surface characterisation of oxygen plasma treated electrospun polyurethane fibres and their interaction with red blood cells

Carl Zandén, Marina Voinova, Julie Gold et al
European Polymer Journal. Vol. 48 (3), p. 472-482
Journal article
2012

Patterned electrospun microfibers integrated in a microfluidic system to study cells in complex microenvironments

Patric Wallin, Carl Zandén, Björn Carlberg et al
eCM Journal. Vol. 23 (Supplement 5), p. 65-
Conference poster
2012

A New Thermally Conductive Thermoplastic Die Attach Film

Y. Duan, Lilei Ye, H. Cui et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 212-215
Paper in proceedings
2011

Cell road - biomaterials for neural stem cell migration

Nina Hellström Erkenstam, Carl Zandén, R. Mottaleb et al
European Cells and Materials. Vol. 21 (SUPPL.1), p. 6-
Paper in proceedings
2011

Reliability of Microtechnology – Interconnects, Devices and Systems

Johan Liu, Olli Salmela, Jussi Särkkä et al
Book
2011

Study on the reliability of fast curing isotropic conductive adhesive

Wenhui Du, Huiwang Cui, Si Chen et al
ECS Transactions. Vol. 34 (1), p. 805 - 810
Paper in proceedings
2011

Investigation of accelerated surface oxidation of Sn-3,5Ag-0,5Cu solder particles by TEM and STEM

Xin Luo, Wenhui Du, Xiuzhen Lu et al
Proceedings of the IEEE 2011 International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011, p. 73 - 79
Paper in proceedings
2011

Study into the application of single-wall carbon nanotubes in isotropic conductive adhesives

D. Li, H. Cui, Q. Fan et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 430-435
Paper in proceedings
2011

Electrical and thermal conductivities of thermally conductive adhesives composed of a multi-functional epoxy resin containing Ag-plated Cu fillers

M. Inoue, H. Muta, S. Yamanaka et al
Proceedings of the International Conference on Electronics Packaging (ICEP), Japan, Nara 2011 April 13-15, p. 941 - 946
Paper in proceedings
2011

Numerical investigation on thermal properties of micro-pin-fin cooler

Yan Zhang, Yangmin Liu, Jing-yu Fan et al
Journal of Shanghai University. Vol. 15 (4), p. 273 - 278
Journal article
2011

Numerical study of the interface heat transfer characteristics of micro-cooler with CNT structures

Yan Zhang, Shun Wang, Shiwei Ma et al
Paper in proceedings
2011

Characterization of surface oxide of lead-free solder particle by TEM and STEM

Xin Luo, Wenhui Du, Xiuzhen Lu et al
Paper in proceedings
2011

Influence of substrate on electrical conductivity of isotropic conductive adhesive

Zhili Hu, Wenhui Du, Cong Yue et al
Proceedings of the IEEE International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011, p. 330 - 335
Paper in proceedings
2011

Study into high temperature reliability of isotropic conductive adhesive

W. Du, H. Cui, S. Chen et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 1053-1055
Paper in proceedings
2011

Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures

L. Zhang, X. Lu, Xin Luo et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 426-429
Paper in proceedings
2011

Comparisons of nano-additives influence on properties of the bi-modal solder pastes for special applications

J. Sitek, Y. Zhang, S. Ma et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 183-187
Paper in proceedings
2011

Molecular dynamics simulation for the bonding energy of metal-SWNT interface

Y. Zhang, Zhili Hu, L. Ye et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 506-509
Paper in proceedings
2011

The effect of functionalized silver on properties of conductive adhesives

Q. Fan, H. Cui, D. Li et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 423-425
Paper in proceedings
2011

Benchmarking assembly materials for vertically aligned carbon nanotubes into microsystems

Teng Wang, Nabi Nabiollahi, Kjell Jeppson et al
Paper in proceedings
2011

Surface-Confined Synthesis of Silver Nanoparticle Composite Coating on Electrospun Polyimide Nanofibers

Björn Carlberg, L. Ye, Johan Liu
Small. Vol. 7 (21), p. 3057-3066
Journal article
2011

Study on the bimodal filler influence on the effective thermal conductivity of thermal conductive adhesive

Y. Zhang, Jing-yu Fan, C. Yue et al
Microsystem Technologies. Vol. 17 (1), p. 93-99
Journal article
2011

Molecular Gun Composed of Carbon Nanotube

Zhili Hu, X. Guo, Johan Liu
Journal of Computational and Theoretical Nanoscience. Vol. 8 (9), p. 1716-1719
Journal article
2011

Electrospun polyurethane-based elastomer fibers for biomedical applications

Carl Zandén, Marina Voinova, C. T. Wang et al
European Cells and Materials. Vol. 21 (SUPPL.1), p. 36-
Paper in proceedings
2011

Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers

D. Wang, J. He, X. Wang et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 560-563
Paper in proceedings
2011

Printed monopole antenna with extremely wide bandwidth on liquid crystal polymer substrates

X. Zhang, X. Yan, Johan Liu et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 1157-1159
Paper in proceedings
2011

Development and characterisation of nanofiber films with high adhesion

Xin Tang, Hui Wang Cui, Xiu Zhen Lu et al
Proceedings of the IEEE Electronics Components and Technology Conference (ECTC) 2011, May 31 – June 2011, Florida, US, p. 673 - 677
Paper in proceedings
2011

Numerical study of thermal transfer between adhesive and CNTs

Yan Zhang, Shun Wang, Zhili Hu et al
Proceedings of the International Conference on Electronics Packaging (ICEP), Japan, Nara 2011 April 13-15, p. 133 - 137
Paper in proceedings
2011

Study on the reliability of nano-structured polymer-metal composite for thermal interface material

Lei Zhang, Xin Luo, Xiuzhen Lu et al
ECS Transactions. Vol. 34 (1), p. 991- 995
Paper in proceedings
2011

The effect of functionalized silver on rheological and electrical properties of conductive adhesives

Q. Fan, H. Cui, C. Fu et al
ECS Transactions. Vol. 34 (1), p. 811-816
Paper in proceedings
2011

A highly conductive bimodal isotropic conductive adhesive and its reliability

Dongsheng Li, Huiwang Cui, Si Chen et al
ECS Transactions. Vol. 34 (1), p. 583 - 588
Paper in proceedings
2011

Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration

Teng Wang, Kjell Jeppson, L. Ye et al
Small. Vol. 7 (16), p. 2313-2317
Journal article
2011

Surface properties of electrospun polyurethane-based elastomer networks for biomedical applications

Carl Zandén, Marina Voinova, Chi-Ting Wang et al
Conference poster
2010

Nanofiber based composites for thermal management

Johan Liu, Björn Carlberg
Conference contribution
2010

Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill

Xingrui Chen, Teng Wang, Joachim Nurnus et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582779), p. 1250-1254
Paper in proceedings
2010

Use of carbon nanotubes in potential electronics packaging applications

Johan Liu, Teng Wang, Yifeng Fu et al
2010 10th IEEE Conference on Nanotechnology, NANO 2010, p. 160-166
Conference contribution
2010

3D computational fluid dynamics simulation of carbon nanotube based microchannel on-chip cooler

N. Nabiollahi, Yifeng Fu, Johan Liu
IMAPS Nordic Annual Conference 2010, Proceedings, p. 44-47
Paper in proceedings
2010

Dry densification of carbon nanotube bundles

Teng Wang, Kjell Jeppson, Johan Liu
Carbon. Vol. 48 (13), p. 3795-3801
Journal article
2010

Future Emerging Packaging Technology Using Carbon Nanotubes

Johan Liu, Yiheng Qin, Carl Zandén et al
Conference contribution
2010

The effect of modulus on the performance of thermal conductive adhesives

Zhili Hu, Cong Yue, X. Guo et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582884), p. 648-651
Paper in proceedings
2010

MDS Investigation on the Heat Transfer Properties of CNT Micro-Channel Cooler

Yan Zhang, Shun Wang, Jingyu Fan et al
Conference contribution
2010

A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

S. Chen, L. L. Zhang, Johan Liu et al
Materials Transactions. Vol. 51 (10), p. 1720-1726
Journal article
2010

Effects of BN and SiC nanoparticles on properties of conductive adhesive

Huaxiang Lai, Xiuzhen Lu, H. Cui et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582434), p. 235-239
Paper in proceedings
2010

Polymer nanofiber based continuous metal phase composite for thermal management applications

Björn Carlberg, Johan Liu, L. Ye
3rd Electronics System Integration Technology Conference, ESTC 2010; Berlin; Germany; 13 September 2010 through 16 September 2010, p. Art. no. 5642950-
Paper in proceedings
2010

Reliability of isotropic conductive adhesive joints

Lilei Ye, Johan Liu
Magazine article
2010

Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach

C. Yue, Y. Zhang, Z. L. Hu et al
Microsystem Technologies. Vol. 16 (4), p. 633-639
Journal article
2010

New fast curing isotropic conductive adhesive for electronic packaging application

Wenhui Du, C. Fu, Si Chen et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582446), p. 199-201
Paper in proceedings
2010

Design of Printed Monopole Antennas on Liquid Crystal Polymer Substrates

Xia Zhang, X. Yan, Johan Liu et al
Journal of Infrared, Millimeter, and Terahertz Waves. Vol. 31 (4), p. 469-480
Journal article
2010

Reliability characterisation of bi-modal high temperature stable Isotropic Conductive Adhesives

W. Tao, S. Chen, X. Liu et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xian, 16-19 August 2010 (Article number 5582437), p. 225-228
Paper in proceedings
2010

Application of through silicon via technology for in situ temperature monitoring on thermal interfaces

Yifeng Fu, Teng Wang, Ove Jonsson et al
Journal of Micromechanics and Microengineering. Vol. 20 (2), p. id 025027 (5 pp)-
Journal article
2010

MDS study on the adhesive heat transfer in micro-channel cooler

Shun Wang, Y. Zhang, Zhili Hu et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5583859), p. 630-633
Paper in proceedings
2010

Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film

Xia Zhang, Teng Wang, Pär Berggren et al
ECS Transactions. Vol. 27 (1), p. 825-830
Paper in proceedings
2010

Optimization of stiffness for isotropic conductive adhesives

C. Fu, Si Chen, Pär Berggren et al
2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 29-33
Conference contribution
2010

A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles

H. Lai, X. Lu, Si Chen et al
2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 49-53
Conference contribution
2010

Numerical investigation on the thermal properties of the micro-cooler

Yangming Liu, Y. Zhang, S. Wang et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5583917), p. 634-638
Paper in proceedings
2010

Direct Photolithographic Patterning of Electrospun Films for Defined Nanofibrillar Microarchitectures

Björn Carlberg, Teng Wang, Johan Liu
Langmuir. Vol. 26 (4), p. 2235-2239
Journal article
2010

Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly

Yifeng Fu, Yiheng Qin, Teng Wang et al
Advanced Materials. Vol. 22 (44), p. 5039-5042
Journal article
2010

Reliability study for high temperature stable conductive adhesives

W. Tao, Si Chen, Pär Berggren et al
2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 74-77
Conference contribution
2009

Modeling of Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications

Zhili Hu, Björn Carlberg, Cong Yue et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 481-484
Paper in proceedings
2009

Polymer-metal nano-composite films for thermal management

Björn Carlberg, Teng Wang, Johan Liu et al
Microelectronics International. Vol. 26 (2), p. 28-36
Journal article
2009

Study of the filler effect of the effective thermal conductivity of thermal conductive adhesive

Yan Zhang, Cong Yue, Johan Liu et al
Paper in proceedings
2009

Evaluation of new and improved thermal interface materials and surface roughness effect on thermal interface resistance

Carl Zandén, Björn Carlberg, Johan Liu
Proceedings of the The International 3rd Swedish Production Symposium (SPS), p. 88-96
Paper in proceedings
2009

Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg

Yifeng Fu, Teng Wang, Johan Liu
Proceedings of the Annual Nordic Conference, p. 35-38
Paper in proceedings
2009

3D chip stacking using planarized carbon nanotubes as through-silicon-vias

Kjell Jeppson, Teng Wang, Johan Liu et al
Conference contribution
2009

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Xiangdong Zou, Yulai Gao, Qijie Zhai et al
Journal of Electronic Materials. Vol. 38 (2), p. 351-355
Journal article
2009

Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect Based on Micropolar Theory and Cohesive Zone Model

Yan Zhang, Jinyu Fan, Johan Liu
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 160-163
Paper in proceedings
2009

Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells.

Björn Carlberg, Mathilda Zetterström Axell, Ulf Nannmark et al
Biomedical Materials (Bristol). Vol. 4 (4), p. 45004-
Journal article
2009

Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles

C.-D. Zou, Y.-L. Gao, B. Yang et al
Soldering and Surface Mount Technology. Vol. 21 (2), p. 9-13
Journal article
2009

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Yi Fan, Xiaolong Zhong, Johan Liu et al
Microsystem Technologies. Vol. 15 (3), p. 375-381
Journal article
2009

Carbon Nanotubes as Cooling Fins in Microelectronic Systems

Yifeng Fu, Teng Wang, Johan Liu et al
Proceedings of the 9th Nanotechnology Conference, p. 10-14
Paper in proceedings
2009

Coffin-Mansson equation of Sn-4.0Ag-0.5Cu solder joint

S. Chen, Peng Sun, Xi-cheng Wei et al
Soldering and Surface Mount Technology. Vol. 21 (2), p. 48-54
Journal article
2009

Through silicon vias filled with planarized carbon nanotube bundles

Teng Wang, Kjell Jeppson, Niklas Olofsson et al
Nanotechnology. Vol. 20 (48), p. 485203-
Journal article
2009

The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder

Si Chen, Zhaonian Cheng, Johan Liu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1240-1245
Paper in proceedings
2009

Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages

Cristina Andersson, B. Vandevelde, C. Noritake et al
Soldering and Surface Mount Technology. Vol. 21 (2), p. 28-38
Journal article
2009

Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging

Xiuzhen Lu, Li Xu, Huaxiang Lai et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1051-1053
Paper in proceedings
2009

Design of 50-70 GHz Planar Wideband Bandpass Filter on Liquid Crystal Polymer Substrate

Xia Zhang, Dan Kuylenstierna, Johan Liu et al
Journal of Infrared, Millimeter, and Terahertz Waves. Vol. 30 (2), p. 183-189
Journal article
2009

Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy

Yulai Gao, Changdong Zou, Bin Yang et al
Journal of Alloys and Compounds. Vol. 484 (1-2), p. 777-781
Journal article
2009

Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging

Li Xu, Xiuzhen Lu, Johan Liu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1051-1053
Paper in proceedings
2009

Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA

Cong Yue, Yan Zhang, Zhili Hu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 851-855
Paper in proceedings
2009

Development of a test platform for thermal characterization using through-silicon-via technology

Yifeng Fu, Teng Wang, Johan Liu
IMAPS Nordic Annual Conference 2009; Tonsberg; Norway; 13 September 2009 through 15 September 2009, p. 35-38
Paper in proceedings
2009

Stem Cell Growth and Migration on Nanofibrous Polymer Scaffolds and Micro-Fluidic Channels on Silicon-Chip

Johan Liu, Hans-Georg Kuhn, Jing Yujia et al
Proceedings of the 2009 Electronic Components and Technology Conference, p. 1080-1085
Paper in proceedings
2009

A Compact Ultra-Wideband Bandpass Filter with Ultra-Fine Conductor Trace based on Liquid Crystal Polymer Substrates

Xia Zhang, Johan Liu, Camilla kärnfeldt et al
Circuit World. Vol. 35 (1), p. 16-21
Journal article
2009

FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives

Nabi Nabiollahi, Johan Liu, Zhili Hu et al
2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009; Genoa; Italy; 26 July 2009 through 30 July 2009, p. 422-425
Paper in proceedings
2008

Development of High Temperature Stable Isotropic Conductive Adhesives

Zhikun Zhang, Sijia Jiang, Johan Liu et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. E3-04
Paper in proceedings
2008

Carbon Nanotubes for thermal management of Microsystems

Johan Liu, Teng Wang
Nanopackaging, p. 377-394
Chapter in monograph, book - peer reviewed
2008

A Compact V-band Planar Wideband Bandpass Filter Based on Liquid Crystal Polymer Substrates

Xia Zhang, Dan Kuylenstierna, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 163-167
Paper in proceedings
2008

The Comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu) joints during isothermal aging and their tensile strengths

Guo-Kui Ju, Xi-cheng Wei, Peng Sun et al
Soldering & Surface Mount Technology. Vol. 20 (3), p. 4-10
Journal article
2008

RF Performance of Flip Chip ACA Joints for CPW Transmission Lines

Xu Wang, Xia Zhang, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 501-506
Paper in proceedings
2008

A METHOD STUDY OF CFD SIMULATION FOR CNT MICROCOOLER

Xiao-long Zhong, Yan Zhang, Johan Liu et al
Chapter in monograph, book - peer reviewed
2008

Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles

Lili Zhang, Wenkai Tao, Johan Liu et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. E1-1 0
Paper in proceedings
2008

Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging

Johan Liu, Yifeng Fu, Teng Wang
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. E3-01
Paper in proceedings
2008

A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers

Yi Fan, Yifeng Fu, Yan Zhang et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. D1-05
Paper in proceedings
2008

Effect of Encapsulation on OLED Characteristics with Anisotropic Conductive Adhesive

Yan Zhang, Måns Andreasson, Johan Liu
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 613-616
Paper in proceedings
2008

Recent Progress of Thermal Interface Material Research – An Overview

Johan Liu, Bruno Michel, Marta Rencz et al
Therminic 2008, p. 156-162
Paper in proceedings
2008

Preparation of Polymer-metal Nanocomposite Films and Performance Evaluation as Thermal Interface Material

Björn Carlberg, Teng Wang, Yifeng Fu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1395-1400
Paper in proceedings
2008

Heat transfer simulation of nanofluids in microfluidic channels

Hongjun Liu, X Wang, Minliang Zhang et al
Paper in proceedings
2008

Thermal cycling aging effect on the shear strength, microstructure, IMC and initiation and propagation of surface mounted Sn-3.8Ag-0.7Cu and wave soldered Sn-3.5Ag ceramic chip components

Cristina Andersson, Per-Erik Tegehall, Dag R. Andersson et al
IEEE Transactions on Components and Packaging Technologies. Vol. 31 (2), p. 331-344
Journal article
2008

Overview of Carbon Nanotubes as Off-Chip Interconnects

Xia Zhang, Teng Wang, Johan Liu et al
Paper in proceedings
2008

Vibration and Bucling of a carbon nanotbue inserted with a carbon chain

Zhili Hu, Ximing Guo, Johan Liu
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. D1-09
Paper in proceedings
2008

Electrical and Thermal Properties of Electrically Conductive Adhesives Using A Heat-resistant Epoxy Binder

Masahiro Inoue, Johan Liu
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1147-1152
Paper in proceedings
2008

Effect of different temperature cycle profiles on the crack initiation and propagation of Sn3,5Ag wave soldered joints

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
Microelectronics Reliability. Vol. 47, p. 266-272
Journal article
2008

Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection

Yan Zhang, Johan Liu, Ragnar Larsson et al
Journal of Adhesion Science and Technology. Vol. 22 (14), p. 1717-1731
Journal article
2008

Micropolar Cohesive Zone Model for Delamination Failure in Microsystem Interconnects

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Paper in proceedings
2008

Recent Advances in the Synthesis of Lead-free Solder Nanoparticle

Cristina Andersson, Changdong Zou, Bin Yang et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 915-922
Paper in proceedings
2008

Recent Progress of Thermal Interface Materials

Johan Liu, Teng Wang, Björn Carlberg et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 351-358
Paper in proceedings
2008

Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant

Yi Fan, Yifeng Fu, Teng Wang et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1391-1394
Paper in proceedings
2008

Nanostructured Polymer-metal Composite for Thermal Interface Material Applications

Björn Carlberg, Teng Wang, Yifeng Fu et al
proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC), p. 191-197
Paper in proceedings
2008

Development of Nanomaterials and Devices for Electronics Cooling and Interconnect

Johan Liu, Teng Wang, Björn Carlberg et al
Proceedings of the Ecology in Electronics Conference in “Progress in Eco-Electronics”, as Monongraphies of Tele, Radio Institute, p. 33-47
Chapter in monograph, book - peer reviewed
2008

Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application

Li Xu, Cong Yue, Johan Liu et al
Paper in proceedings
2008

Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder alloy for electronics applications

Cristina Andersson, Peng Sun, Johan Liu
Journal of Alloys and Compounds. Vol. 457 (1/2), p. 97-105
Journal article
2008

Millimeter-wave ultra-wideband bandpass filter based on LCP substrates for automotive radar systems

Xia Zhang, Johan Liu, Peng Cai et al
Journal of Microwave and Optical Technology Letters, p. 2276-2280
Journal article
2008

Preparation of polysulfoneamide electrospinning nanofibers

Liu Li, Ying Shi, Qinghua Jiao et al
Paper in proceedings
2008

Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load

Yan Zhang, Johan Liu, Ragnar Larsson
Journal of Electronic Packaging, Transactions of the ASME. Vol. 130 (2), p. 0210101-0210107
Journal article
2008

The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish

Lili Zhang, Cristina Andersson, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1295-1300
Paper in proceedings
2008

Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Thermal Interface Material

Cong Yue, Yan Zhang, Johan Liu et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. C1-10
Paper in proceedings
2008

Recent Development of Nano-solder Paste for Electronics Interconnect Applications

Johan Liu, Cristina Andersson, Yulai Gao et al
Paper in proceedings
2008

Understanding BGA interconnect interface behaviour using Micropolar theory

Yan Zhang, Ragnar Larsson, Johan Liu
Journal article
2008

Effect of Corrosion on the Low Cycle Fatigue Behaviour of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints

Cristina Andersson, Johan Liu
International Journal of Fatigue, p. 917-930
Journal article
2007

A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

Johan Liu, Yan Zhang, Teng Wang
Paper in proceedings
2007

Electrically Conductive Adhesives

James E. Morris, Johan Liu
Micro- and Opto-Electronic Materials and Structures – Physics, Mechanics, Design, Reliability, Packaging, Volume II: Physics Design – Reliability and Packaging, p. 527-570
Chapter in monograph, book - peer reviewed
2007

Encapsulation of OLED device by Using Anisotropic Conductive Adhesive

Yan Zhang, Måns Andreasson, Hua Zhou et al
Proceedings of 2007 International Symposium on High Density Packaging and Microsystem Integration, p. 314-317
Paper in proceedings
2007

PBGA Interconnect Behavior under Thermal Effects

Yan Zhang, Johan Liu, Ragnar Larsson
Proceedings of International Conference on Electronics Packaging (ICEP2007), Tokyo, Japan, p. 329-334
Paper in proceedings
2007

Second order multi-scale micropolar model for microsystem interconnections

Yan Zhang, Johan Liu, Jing-yu Fan et al
Proceedings of the Fifth International Conference on Nonlinear Mechanics (ICNM-V), p. 1434-1439
Paper in proceedings
2007

Process and pad design optimization for 01005 passive component surface mount assembly

Johan Liu
Soldering and Surface Mount Technology. Vol. 19, p. 34-44
Journal article
2007

Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive

Teng Wang, Björn Carlberg, Martin Jonsson et al
Applied Physics Letters. Vol. 91 (9), p. 093123-
Journal article
2007

Effect of different temperature cycling profiles on the crack initiation and propagation and of Sn-3.5Ag wave soldered joints

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
Microelectronics and Reliability. Vol. 47 (2-3), p. 266-272
Journal article
2007

Interface modelling microsystem interconnections using micropolar theory and discontinuous approximation

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Computers & Structures. Vol. 85 (19-20), p. 1500-1513
Journal article
2007

Tensile fracture behaviour of Sn-3.0Ag-0.5Cu solder joints on copper

Johan Liu, Peng Sun
Paper in proceedings
2007

Realization of A Ultra Wideband BPF based on LCP Substrate for Wireless Application

Xia Zhang, Herbert Zirath, Johan Liu
Paper in proceedings
2007

Reliability aspects of electronics packaging technology using anisotropic conductive adhesives

Johan Liu, Liqiang Cao
Journal of Shanghai University (English Edition). Vol. 11, p. 1-16
Journal article
2007

A method for determining elastic properties of micron-sized polymer particles by using flat punch test

Johan Liu
Computational Materials Science. Vol. 39 (2), p. 305-314
Journal article
2006

Computational Fluid Dynamics Simulation for On-chip Cooling with Carbon Nanotube Micro-fin Architectures

Xiaolong Zhong, Yan Zhang, Teng Wang et al
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), p. 117-123
Paper in proceedings
2006

Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 166-170
Paper in proceedings
2006

Characterization of Nanoparticles of Lead Free Solder Alloys

Wanbing Guan, Suresh Chand Verma, Yulai Gao et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 7-12
Paper in proceedings
2006

Design for Embedded Chinese Display Smart Card

Hua Zhou, Yang Liu, Dimitar Antonov Kolev et al
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06; Shanghai; China; 27 June 2006 through 28 June 2006, p. 152-156
Paper in proceedings
2006

Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering

Peng Sun, Cristina Andersson, Xicheng Wei et al
Materials Science & Engineering B: Solid-State Materials for Advanced Technology. Vol. 135 (2), p. 134-140
Journal article
2006

Development and Characterization of Microcoolers using Carbon Nanotubes

Teng Wang, Martin Jönsson, Zhimin Mo et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 881-885
Paper in proceedings
2006

Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal ccling testing

Peng Sun, Cristina Andersson, Johan Liu et al
Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, p. 760-767
Paper in proceedings
2006

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization

Peng Sun, Cristina Andersson, Xicheng Wei et al
Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06), p. 1468-1475
Paper in proceedings
2006

Assessment of Lead-Free Inert Gas Soldering Using a Novel Reflow Technology

Oyebode Ayoade, Andersson Cristina, Hjertkvist Tobias et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 428-437
Paper in proceedings
2006

Flow Behaviour of Anisotropic Conductive Adhesive Film during COG Bonding Process in Flat Panel Display Assembly

Fabien Raugi, Mohammad Kamruzzaman Chowdhury, Helge Kristiansen et al
1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006, p. 828-833
Paper in proceedings
2006

Consequential toxicity assessment of the global shift to Pb free solder paste

Anders Andrae, Johan Liu
Proceedings of the International Conference on Electronic Packaging (ICEP 2006), p. 298-303
Paper in proceedings
2006

Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint

C. Bailey, Peng Sun, Xicheng Wei et al
Soldering and Surface Mount Technology. Vol. 18 (2), p. 4-11
Journal article
2006

Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Proc. 1 st Electronics Systemintegration Technology Conference, 2006 (ESTC 2006), 5 - 7 Sept. 2006, Dresden, Germany. Vol. 2, p. 757-761
Paper in proceedings
2006

New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications

Wen Xuan Wang, Xiuzhen Lu, Johan Liu et al
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), p. 631-635
Paper in proceedings
2006

RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints

Xu Wang, Zhaonian Cheng, Johan Liu
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 123-127
Paper in proceedings
2006

Low Cycle Fatigue of Sn-based Lead-free Solder joints and the analysis of fatigue life prediction uncertainty

Cristina Andersson, Peng Sun, Johan Liu
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 19-26
Paper in proceedings
2006

Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions

Cristina Andersson, Johan Liu
ESTC 2006 - 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006, p. 457-467
Paper in proceedings
2006

Integrated inductors on liquid crystal polymer substrate for RF applications

Gang Zou, Hans Gronqvist, Johan Liu
Circuit World. Vol. 32 (1), p. pp41-44
Journal article
2006

Interface Modelling of ACA Interconnects Using Micropolar Theory

Yan Zhang, Ragnar Larsson, Johan Liu
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05; Shanghai; China; 27 June 2005 through 29 June 2005, p. Art. no. 4017426-
Paper in proceedings
2006

Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application

Qi Zhang, Zonghe Lai, Urban Jevelstam et al
Proceedings of the International Conference on Electronic Packaging (ICEP 2006), p. 83-89
Paper in proceedings
2006

Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Si Chen, Peng Sun, Johan Liu et al
Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, p. 368-373
Paper in proceedings
2006

Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy

Cristina Andersson, L. Liu, Johan Liu
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany, p. 152-160
Paper in proceedings
2006

Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection

Teng Wang, Martin Jönsson, Eleanor E B Campbell et al
1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. Vol. 2, p. 892-895
Paper in proceedings
2006

Analysis of Mechanical Strength for Flip-chip Bonding of GaAs MMIC

Bo Zhang, Vignesh Murugesan, Niklas Billström et al
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 325-328
Paper in proceedings
2006

Development of High Adhesion Nano-Thermal Interface Materials for Electronics Packaging Applications

Tomas Aronsson, Wen Xuan Wang, Michael Olugbenga Olorunyomi et al
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), p. 196-199
Paper in proceedings
2006

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Chen, Zonghe Lai, Zhaonian Cheng et al
Journal of Electronic Packaging, Transactions of the ASME. Vol. 128 (3), p. 177-183
Journal article
2006

High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization

Peng Sun, Cristina Andersson, Xi-cheng Wei et al
Journal of Alloys and Compounds. Vol. 425 (1-2), p. 191-199
Journal article
2006

On the heat transfer enhancement based on micro-scale air impingingment jets with microstructure heat sink in electronics cooling

Jingyu Fan, Yan Zhang, Johan Liu
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06; Shanghai; China; 27 June 2006 through 28 June 2006, p. 120-124
Paper in proceedings
2006

Development of SOP Module Technology Based on LCP Substrate for High Frequency Electronics Applications

Xia Zhang, Qi Zhang, Gang Zou et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 118-125
Paper in proceedings
2006

Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles

Suresh Chand Verma, Wanbing Guan, Cristina Andersson et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 282-286
Paper in proceedings
2005

Low cycle fatigue testing and simulation of Sn8Zn-3Bi and Sn-37Pb solder joints

Peng Sun, Cristina Andersson, Xicheng Wei et al
Soldering and surface Mount Technology. Vol. 17 (4), p. pp38-45
Journal article
2005

Reliability of Conductive adhesives

Johan Liu, Zhimin Mo
Journal article
2005

Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applications

Johan Liu, Yu Wang, James Morris et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp156-172
Paper in proceedings
2005

Integrated Capacitors and Resistors on Liquid Crystal Polymer Substrate

Gang Zou, Hans Gronqvist, Johan Liu
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp305-308
Paper in proceedings
2005

Reliability analysis of embedded chip technique with design of experiment methods

Xiuzhen Lu, Liu Chen, Zhaonian Cheng et al
2005 International Symposium on Electronics Materials and Packaging, p. pp43-49
Paper in proceedings
2005

Microsystem Interconnections Modelling Using Micropolar Theory and Discontinuous Approximation

Yan Zhang, Ragnar Larsson, Jingyu Fan et al
Proceedings of 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2005), p. 176-179
Paper in proceedings
2005

Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Paper in proceedings
2005

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Cristina Andersson, Zonghe Lai, Johan Liu et al
Materials Science and Engineering. Vol. A (394), p. pp20-27
Journal article
2005

Formulation and Characterization of Anisotropic Conductive Adhesive Paste for Microelectronics Packaging Applications

Liqiang Cao, Shiming Li, Zonghe Lai et al
Journal of Electronic Materials. Vol. 34, p. 1420-1427
Journal article
2005

Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate

Liqiang Cao, Zonghe Lai, Johan Liu
Journal of Electronics packaging. Vol. 127, p. pp43-46
Journal article
2005

A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic Conductive Adhesive Joining Technology

Johan Liu, Liqiang Cao, Min Xie et al
IEEE Transactions on Electronics Packaging Manufacturing (TEPM). Vol. 28 (4), p. 322-327
Journal article
2005

Modelling of Carbon Nanotubes as Heat Sink Fins in Microchannels for Microelectronics Cooling

Lisa Ekstrand, Zhimin Mo, Yan Zhang et al
Proceedings of the IEEE CPMT Polytronic 05 Conference 2005, p. 185-187
Paper in proceedings
2005

Characterization of thermally conductive epoxy nano-composites

Lisa Ekstrand, Helge Kristiansen, Johan Liu
28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005; Wiener Neustadt; Austria; 19 May 2005 through 20 May 2005, p. 35-39
Paper in proceedings
2005

Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive

Liqiang Cao, Zhaonian Cheng, Zonghe Lai et al
Proceedings of the 2005 International Conference on Electronics Packaging (ICEP), p. pp48-55
Paper in proceedings
2005

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Cristina Andersson, Zonghe Lai, Johan Liu
Materials Science and Engineering A. Vol. 394, p. 20-27
Journal article
2005

Conductive adhesives

Ying Fu, Johan Liu, Magnus Willander
Chapter in monograph, book - peer reviewed
2005

Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation

Yan Zhang, Ragnar Larsson, Jingyu Fan et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp115-119
Paper in proceedings
2005

Development of an ontology for the ACA technology in electronics applications

Johan Liu, Yu Wang, James Morris
10th International Symposium and Exhibition on, Advanced Packaging Materials. Vol. 8 (1)
Paper in proceedings
2005

An Ontology of ICA for Microsystem applications

Jim Morris, Jeahuck Lee, Johan Liu
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp120-127
Paper in proceedings
2005

Reliability of conductive adhesives in electronics packaging

Johan Liu, Xiuzhen Lu, Liqiang Cao
The 4th IEEE International IEEE CPMT Conference on Polytronics (Polytronik´05), p. pp24-26
Journal article
2005

Microstructural evolution of Sn-Zn based lead-free solders after exposure to temperature and humidity

Peng Sun, Cristina Andersson, Zonghe Lai et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp197-202
Paper in proceedings
2005

Thermal cycling and reliability of lead free BGA components

Cristina Andersson, Dag Andersson, Johan Liu
IMAPS Europe Brugge, p. pp101-108
Paper in proceedings
2005

Adhesion study of copper layer deposited and liquid crystalline polymer for electronics packaging

Qi Zhang, Johan Liu, Lars Nyborg
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp109-114
Paper in proceedings
2005

Residual Stress in Flip Chip Joining Using Anisotropic Conductive Adhesive

Zhaonian Cheng, Lisa Ekstrand, Johan Liu
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp139-144
Paper in proceedings
2005

Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint

Peng Sun, Cristina Andersson, Zhaonian Cheng et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp342-347
Paper in proceedings
2005

Reliability of Conductive adhesives

Johan Liu, Zhimin Mo
Chapter in monograph, book - peer reviewed
2005

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Chen, Zonghe Lai, Zhaonian Cheng et al
Journal of Electronic Packaging. Vol. 3, p. pp343-349
Journal article
2005

Application of Simplified Methods for Partial Environmental Assessment of Microelectronics Soldering Materials and Processes in Small and Medium Sized Enterprises

Anders Andrae, Dag Andersson, Cecilia Ramberg et al
International Journal of Life Cycle Assessment. Vol. 10 (5)
Journal article
2005

Numerical Simulation Based on CFD for Impingement Heat Transfer in Electronics Cooling

Yan Zhang, Jingyu Fan, Johan Liu
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp360-364
Paper in proceedings
2005

THERMAL MODELING FOR SYSTEM-IN-A-PACKAGE BASED ON EMBEDDED CHIP STRUCTURE

Liu Chen, Lisa Ekstrand, Johan Liu
Proceedings of the 5th IEEE International Conferences on Adhesives and Polymers (POLYTRONIK05), p. 224-227
Paper in proceedings
2005

Design for Manufacturability and Reliability of Embedded Display Smart Card

Yang Liu, Rui Rodrigues, Johan Liu
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp476-478
Paper in proceedings
2005

Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
Proceedings of the IMAPS 2005, p. 523-528
Paper in proceedings
2005

Characterisation of Mechanical Properties of Metal-coated Polymer Spheres for Anisotropic Conductive Adhesive

H. Kristiansen, Z. Zhang, Johan Liu
10th International Symposium and Exhibition on, Advanced Packaging Materials. Vol. 8 (2)
Paper in proceedings
2005

Integrated Nanotube Microcooler for Microelectronics Applications

Zhimin Mo, Raluca Morjan, Johan Anderson et al
Proceedings of the IEEE CPMT Conference on Electronics Component Technology (ECTC55), p. pp51-54
Paper in proceedings
2005

Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder Joint

Peng Sun, Cristina Andersson, Zhaonian Cheng et al
Proceedings of the IEEE CPMT Conference on Electronics Component Technology (ECTC55), p. 696-700
Paper in proceedings
2005

Significance of intermediate production processes in life cycle assessment of electronic products assessed using a generic compact model

Anders Andrae, Dag Andersson, Johan Liu
Journal of Cleaner Production. Vol. 13 (13-14), p. 1269-1279
Journal article
2004

Theoretical Analysis of RF Performance of Anisotropic Conductive Adhesive Flip-Chip Joints

Gang Zou, Hans Grönqvist, Johan Liu
IEEE CPMT Part A. Vol. 27 (3), p. pp 546-550
Journal article
2004

LCA of Electronic Products - An environmental assessment of Gallium Arsenide Monolithic Microwave Integrated Circuit System in Package (SIP) switch product

Anders Andrae, Gang Zou, Johan Liu
International Journal of Life Cycle Assessment. Vol. 9 (1), p. 45-52
Journal article
2004

Characterization of Metal- coated Polymer Spheres and its Use in Anisotropic Conductive Adhesive

H. Kristiansen, T.O. Gronlund, Johan Liu
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). Vol. 04 (EX905), p. pp 259-264
Paper in proceedings
2004

High Frequency Flip Chip Interconnection on Liquid Crystal Polymer Substrate Using Anisotropic Conductive Adhesive

Gang Zou, Hans Grönqvist, Zonghe Lai et al
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics; Portland, OR; United States; 12 September 2004 through 15 September 2004. Vol. September (13-15), p. 137-140
Paper in proceedings
2004

Electron conduction through nano particles in electrically conductive adhesives

Ying Fu, Johan Liu
Micromaterials and Nanomaterials. Vol. 3, p. 104-109
Journal article
2004

Thermodynamic assessment of Sn-Co lead-free solder system

Libin Liu, Cristina Andersson, Johan Liu
Journal of Electronic Materials. Vol. 33 (9), p. p 935-
Journal article
2004

Uncertainty estimation by Monte Carlo Simulation applied to Life Cycle Inventory of Cordless Phones and Microscale Metallization Processes

Anders Andrae, Patrik Möller, Johan Anderson et al
IEEE Transactions on Electronics Packaging Manufacturing. Vol. 27 (4), p. 233-245
Journal article
2004

The deformation Characterization of Conductive Particles in Anisotropically Conductive Adhesive Using FEM

Liqiang Cao, Yanli Wang, Guoliang Chen et al
Proceedings of the IMAPS Nordic Annual Conference. Vol. September (21-23), p. pp 92-97
Paper in proceedings
2004

A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic conductive adhesive joining technology

Johan Liu, Liqiang Cao, Min Xie et al
Proceedings of the Polytronik04, p. RT23-
Paper in proceedings
2004

Reliability Modeling and Simulation of Anisotropic Conductive Adhesive Flip-Chip Bonding Assembly using Global/Local FEM Approach

Zhimin Mo, Johan Liu
Proc. of 6th Internal Conference on Electronic Materials & Packaging (EMAP 2004). Vol. December, p. pp 66-71
Paper in proceedings
2004

Characterization of electrical and mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive

Helge Kristiansen, T.O Grönlund, Johan Liu
Proceedings of IMAPS Nordic Annual Conference, 26-28 September, p. 86-91
Paper in proceedings
2004

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Chen, Zonghe Lai, Zhaonian Cheng et al
Paper in proceedings
2004

Process Development and Reliability for System-in-a-Package Using Liquid Crystal Polymer Substrate

Liu Chen, Xingzhong Duo, Lirong Zheng et al
ECTC04, p. pp 24-28
Paper in proceedings
2004

Conductive adhesives

Johan Liu
Lead free electronics, p. pp285-351
Chapter in monograph, book - peer reviewed
2004

Thermal Fatigue Cracking of Surface Mount Conductive Adhesive Joints

Z. Mo, Zonghe Lai, S. Li et al
Soldering & Surface Mount Technology. Vol. 16 (1), p. pp 48-52
Journal article
2004

A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic conductive adhesive joining technology

Johan Liu, Liqiang Cao, Min Xie et al
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics; Portland, OR; United States; 12 September 2004 through 15 September 2004, p. 191-197
Paper in proceedings
2004

Effect of Curing Condition of Adhesion Strength and ACA Flip Chip Contact Resistance

Liqiang Cao, Zonghe Lai, Johan Liu
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). Vol. 04 (EX905), p. pp 254-258
Paper in proceedings
2004

Conductive adhesives

Ying Fu, Johan Liu, Magnus Willander
Lead free electronics, p. pp 285-351
Chapter in monograph, book - peer reviewed
2004

Environmental Assessment of Embedded chip manufacturing Technology

Anders Andrae, Liu Chen, K. Schischke et al
Proceedings of Electronics Goes Green 2004+, Sept. 6-8, Berlin, Germany, p. 913-918
Conference contribution
2004

Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
Proceedings of the 5th international conference on thermal, mechanical and thermo-mechanical simulation and experiments in micro-electronics and micro-systems (EuroSimE). Vol. May (10th to 12th), p. pp 455-464
Paper in proceedings
2004

Characterization of Substrate Materials for System-in-a-Package Applications

Liu Chen, Anders Andrae, Gang Zou et al
Journal of Electronics Packaging. Vol. 126 (2), p. 195-201
Journal article
2004

Integrated Inductors on Liquid Crystal Polymer Substrate for RF Applications

Gang Zou, Hans Gronqvist, Johan Liu
Proc. of 6th Internal Conference on Electronic Materials & Packaging (EMAP 2004). Vol. December, p. pp 484-487
Paper in proceedings
2004

Integrating nano carbon tubes with microchannel cooler

Zhimin Mo, Johan Anderson, Johan Liu
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). Vol. 04 (EX905), p. pp 373-376
Paper in proceedings
2004

Study on thermomechanical reliability of a tunable light modulator

Zhimin Mo, Helge Kristiansen, Morten Eliassen et al
Microelectronics Reliability. Vol. 44 (2004), p. pp 779-785
Journal article
2004

Uncertainty estimation by Monte-Carlo Simulation applied to life cycle inventory of cordless phones and microscale metallization processes

Anders Andrae, Patrik Möller, Johan Liu
Proceedings of the 2004 International IEEE Conference on Asian Green Electronics (AGEC), Jan. 5-7, Shenzhen, China, p. 206-217
Conference contribution
2004

Electron conduction through nano particles in electrically conductive adhesives

Ying Fu, Johan Liu
Micromaterials and Nanomaterials. Vol. 3, p. 104-
Magazine article
2004

Microsystem Manufacturing, Assembly and Packaging Technology in Display-CardTM Applications

Junmei Duan, Johan Asplund, Johan Liu
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). Vol. 04 (EX905), p. pp 290-293
Paper in proceedings
2003

Thermodynamic Assessment of Sn-Co-Cu Lead-free Solder Alloy

Libin Liu, Cristina Andersson, Johan Liu et al
Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition, p. 2003-35126
Paper in proceedings
2003

Electrical conduction characteristics of anisotropic conductive adhesive particles, Guangbin Dou

Y C Chan, Johan Liu
Journal of Electronic Packaging. Vol. 125 (4), p. 609-616
Journal article
2003

Development of a web-based course on lead-free solders

Johan Liu, Cristina Andersson
ECTC´03, p. 739-742
Paper in proceedings
2003

Electron conduction through nano particles in electrically conductive adhesives

Y Fu, Johan Liu
Micromaterials and Nanomaterials, p. 40-45
Chapter in monograph, book - peer reviewed
2003

System-on-Packaging: A Broad Perspective from System Design to Technology Development

Zheng Li- Rong, Johan Liu
Microelectronics Reliability. Vol. 43, p. 1339-1348
Journal article
2003

Microwave-transmission, heat and temperature properties of electrically conductive adhesives

Ying Fu, Tiebing Wang, Johan Liu
IEEE CPMT Transactions. Vol. 26, p. 193-198
Journal article
2003

Design and Development of Thin Film and LCP-Based System-on-Package Modules for RF/Wireless Applications

Z. Duo, L. Zheng, H. Tenhunen et al
Proceedings of The 4th Pori Electronics Production and Packaging Technology Conference, p. 205-213
Paper in proceedings
2003

Thermal Stress Analysis of a Novel Light Modulator

Zhimin Mo, Helge Kristiansen, Morten Eliassen et al
ECTC53, p. 1408-1412
Paper in proceedings
2002

Development of a generic data collection model for upstream processes in life cycle inventory of electronic products

Anders Andrae, Johan Liu
Proceedings of First International Conference on Design And Manufacturing for Sustainable Development, p. 241-253
Conference contribution
2002

Experimental and Theoretical Analysis for Material Behavior of Anisotropically Conductive Adhesive Film

Yilan Kang, Johan Liu, Zonghe Lai et al
The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02), p. 123-125
Paper in proceedings
2002

Formulation and electrical and mechanical properties of anisotropic conductive adhesive pastes

Liqiang Cao, Shiming Li, Johan Liu
Proceedings of the 2002 Internatinal Conference on Electronics Packaging (2002 ICEP), p. 272-277
Paper in proceedings
2002

Microstructure Investigation of Sn-Ag-Based Lead-Free Solder Joints by Electron Microscopy

L. Ye, Zonghe Lai, Johan Liu et al
Proceedings of the IMAPS Nordic Conference, p. 180-187
Paper in proceedings
2002

Reliability of ACA flip-chip joints on FR-4 substrate

Johan Liu, Zonghe Lai
Journal of Electronics packaging, p. 240-245
Journal article
2002

High frequency characteristics of Liquid Crystal Polymer for System in a Package Application

Gang Zou, Hans Grönqvist, Piotr Starski et al
2002 8th International Advanced Packaging Materials Symposium, p. 337-341
Paper in proceedings
2002

A generic model for life cycle inventory of up-stream processes in life cycle assessment of electronic products

Andrae Anders S. G., Johan Liu
First International Conference on Design and Manufacture for Sustainable Development, p. 241-254
Paper in proceedings
2002

Panel-Size Component Integration (PCI) with Molded Liquid Crystal Polymer (LCP) Substrates

J. Kivilahti, Johan Liu, J. E. Morris et al
ECTC´02, p. 955-961
Paper in proceedings
2002

Web Course on Electrically Conductive Adhesives

Johan Liu, James E. Morris, Xitao Wang et al
ECTC´02, p. 1502-1506
Paper in proceedings
2002

Electrical Characterization of Isotropic Conductive Adhesive under Mechanical Deformation

Zhimin Mo, Xitao Wang, Tiebing Wang et al
Journal of Electronics Materials, p. 916-920
Journal article
2002

Characterization of Liquid Crystal Polymer for High Frequency System-in-a-Package Applications

Gang Zou, Hans Grönqvist, Piotr Starski et al
IEEE CPMT Transactions, Part B. Vol. 25, p. 503-508
Journal article
2002

Process development and adhesion behaviour of Electroless Copper on Liquid Crystal Polymer (LCP) for Electronic Packaging Application

Liu Chen, Midhat Crinic, Zonghe Lai et al
IEEE Transactions on Electronics Packaging Manufacturing. Vol. 25, p. 247-278
Journal article
2002

Behaviour and Properties of Conductive Particles for Anisotropic Conductive Adhesive

Helge Kristiansen, Johan Liu
The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02), p. 111-114
Paper in proceedings
2002

Isotropically Conductive Adhesives for Large Power Electronics Applications

Kristian Olsson, D. Johansson, Shiming Li et al
proceedings of the second International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, p. 29-37
Paper in proceedings
2001

The effect of bump height on the reliability of ACF in flip-chip

C.M.L Wu, Johan Liu, N. H Yeung
Soldering & Surface Mount Technology, p. 25-30
Journal article
2001

Low-Cycle fatigue life of SnAgBi and Sn-Ag lead-free solders

Cristina Andersson, Xitao Wang, Zonghe Lai et al
Proceedings of the IMAPS Nordic, p. 298-303
Paper in proceedings
2001

Thermal Performance of a System in Package Design Concept

D. C. Whalley, Johan Liu
Proceedings of APACK 2001 International Conference on Advances in Packaging, p. 461-467
Paper in proceedings
2001

Development of an internet Course on Conductive Adhesives for Electronics Packaging

Johan Liu, Xitao Wang, James E. Morris
ECTC 51th, p. 1270-1275
Paper in proceedings
2001

Spatial distribution of metal fillers in isotropically conductive adhesive, Journal of Electronics Materials

Ying Fu, Magnus Willander, Johan Liu
Journal of Electronics Materials. Vol. 30, p. 866-871
Journal article
2001

ACA bonding technology for low-cost electronics packaging applications – current status and remaining challenges

Johan Liu
Soldering and Surface Mount Technology, p. 39-57
Journal article
2001

Life Cycle Analysis of a telephone exchange station

Anders Andrae, Ulf Östermark, Johan Liu
Journal of Electronics Manufacturing, p. 147-160
Journal article
2001

Modelling of the anisotropic conductive adhesive assembly

David Whalley, Liu Chen, Johan Liu
Proceedings of Conference presentation at ISEPT´01, p. 319-324
Paper in proceedings
2001

Modelling of Heat Transfer for System in Package (SIP)

Jiemin Zhou, Xitao Wang, Liu Chen et al
EurosimE/2001, p. 89-94
Paper in proceedings
2001

Computational Modelling of the Anisotropic Conductive Adhesive Assembly Process

D. C. Whalley, G. Glinsky, C.J. Bailey et al
Proceedings of the 3rd International Symposium on Electronics Materials and Packaging, p. 393-398
Paper in proceedings
2001

Low Cycle fatigue of lead-free solders

Cristina Andersson, Xitao Wang, Zonghe Lai et al
The Fourth International Symposium on Electronic Packaging Technology, p. 462-470
Paper in proceedings
2001

Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B Lead Free Solders

L.L Ye, Zonghe Lai, Johan Liu
Soldering and Surface Mounting Technology, p. 16-20
Journal article
2001

Overview of Conductive Adhesive Joining and Bumping Technology for direct chip attach applications

Helge Kristiansen, Johan Liu
Chapter in monograph, book - peer reviewed
2001

Statistics on conduction in ACA materials

Ying Fu, Magnus Willander, Johan Liu
IEEE Transactions on Components and Packaging Technology, p. 250-5
Journal article
2001

Comparison of Mechanical Fatigue Test and Thermal Cycling for Failure Analysis of Solder Joints

Xitao Wang, Liu Chen, Zonghe Lai et al
Proceedings of The IMAPS Nordic 38th Annual Conference, p. 70-77
Paper in proceedings
2001

A review of microwave curing of polymer materials

Tiebing Wang, Johan Liu
Journal of Electronics Manufacturing, p. 181-189
Journal article
2001

Life time prediction of anisotropic conductive adhesive joint for electronics packaging applications

Johan Liu
Proceedings of the 1st International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, p. 209-212
Paper in proceedings
2001

Fundamentals of Packaging Materials and Processes

Pulugurtha Markondeya Ray, Johan Liu, Per Öchlckers
Fundamentals of Microsystems Packaging, p. 694-747
Chapter in monograph, book - peer reviewed
2001

Microwave Cure of Metal-filled Electrically Conductive Adhesives

Tiebing Wang, Ying Fu, Matthias Becker et al
ECTC 51th, p. 593-597
Paper in proceedings
2000

Microstructural coarsening of lead-free solders

Lilei Ye, Zonghe Lai, Johan Liu
ECTC50, p. 134-137
Paper in proceedings
2000

Microwave transmission, heating of electrically conductive adhesives

Ying Fu, Tiebing Wang, Johan Liu
Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis, p. 134-139
Paper in proceedings
2000

Life Cycle Assessment of a telecommunications exchange

Anders Andrae, Ulf Östermark, Johan Liu
Journal of Electronics Manufacturing. Vol. 10 (3), p. 147-160
Journal article
2000

Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip application

Kuntjoro Pinardi, Zonghe Lai, Dietmar Vogel et al
IEEE CPMT Transactions, Part A. Vol. 23, p. 447-451
Journal article
2000

An Internet Course on Conductive Adhesives for Electronics Packaging

Johan Liu, James Morris
ECTC 50th, p. 1016-1020
Paper in proceedings
2000

Reliability of ACF in Flip-Chip with Various Bump Height

C M L Wu, Johan Liu, N H Yeung
Proceedings of the 4th Adhesive joining and Coating Technology in Electronics Manufacturing, p. 101-106
Paper in proceedings
2000

Heating and reliability characterization electrically conductive adhesives using variable frequency microwave cure

Tiebing Wang, Ying Fu, Matthias Becker et al
3rd EPTC'2000, p. 373-377
Paper in proceedings
2000

Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesives

Ying Fu, Yanli Wang, Xitao Wang et al
IEEE CPMT transactions, Part B: Advanced Packaging. Vol. 23, p. 15-21
Journal article
2000

Effect of thermal ageing on the shear strength of lead-free solder joints

James Oliver, Johan Liu
Proceedings of the International Conference on ”Advanced Packaging Materials Processes, Properties and Interfaces”, p. 152-157
Paper in proceedings
2000

3. Thermal cycling life Flip-Chip On Board circuits with solder and isotropically conductive adhesive joints

Jon B Nysæther, Zonghe Lai, Johan Liu
IEEE CPMT Transactions, Part B: Advanced Packaging. Vol. 23, p. 743-749
Journal article
2000

Fatigue properties of lead-free solders

Xitao Wang, Cristina Andersson, Zonghe Lai et al
Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis, p. 163-169
Paper in proceedings
2000

Cluster effects on electrical conductance of isotropically conductive adhesive

Fu Ying, Magnus Willander, Johan Liu
Proceedings of the 4th Adhesive joining and Coating Technology in Electronics Manufacturing, p. 188-193
Paper in proceedings
2000

Heat Transfer Modeling of System in Package (SIP)

Jiemin Zhou, Xitao Wang, Liu Chen et al
Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis, p. 107-125
Paper in proceedings
2000

Bump Height Effect on the Reliability and on the Strains Variations of ACA Flip-chip Joints

K. Pinardi, Zonghe Lai, Yi Lan Kang et al
ECTC 50th, p. 1118-1121
Paper in proceedings
2000

Characterization of bulk mechanical properties of lead-free solders

Li Xiao, Johan Liu
Proceedings of the International Conference on ”Advanced Packaging Materials Processes, Properties and Interfaces”, p. 145-151
Paper in proceedings