Johan Liu
Dr Johan Liu graduated with a master and a Ph.D. degree in materials science from the Royal Institute of Technology, Sweden. Before joining Chalmers University of Technology, he served in various positions at the Swedish Institute for Production Engineering Research (IVF) as project manager, group leader and division manager. He is currently full professor in electronics production and head of Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience in Chalmers University of Technology, Sweden.
As a member of the Royal Swedish Academy of Engineering Sciences and a fellow of IEEE, he has published 500 papers in journals, conference proceedings and book chapters with a Hirsch index of 29 in Web of Science (WoS) and 39 in Google Scholar Citation System (Google Scholar) and with a citation of over 2840 times (WoS) or 6000 (Google Scholar). He has 75 patents accepted or filed and has given 55 keynote/invited talks. In addition to this, he has published 35 papers with impact factor over 3,5 (8 of them over 10) including those in Nature Communications, Advanced Materials, Advanced Functional Materials, Nanoenergy, Small, Carbon, Journal of Materials Chemistry, Biomicrofludics, Tissue Engineering, Glia, Langmuir, Scientific Reports, IEEE Electron Deveic Letters and IEEE CPMT Transactions, Applied Physics Letters, Nanotechnology, IEEE Nanotechnology, Journal of Composite Science and Technology and European Polymer Journal. He has also received many awards including IEEE Exceptional Technical Achievement Award, IEEE CPMT Transaction Best paper award in “Advanced Packaging”. His research field covers mainly nanoelectronics, microsystems packaging and 3D additive manufacturing materials and processes including vertical stacking CNT TSV technology, CNT/graphene assisted cooling technology, graphene heat spreader, high temperature stable conductive adhesives, nano-soldering, nano-thermal interface materials and biomedical nanoscaffolds. He has successfully run over 70 research projects funded by National Science Fundation, Swedish Board for Strategic Research (SSF), Natoinal Swedish Board for Innovation (Vinnova) and Formas, Sweden as well as EU FP6, FP7 and Horizon 2020 programs.
Showing 560 publications
A Novel Graphene and Titanium Laminated Composite Film for Electronics Cooling Applications
Reliability of Graphene Enhanced Thermal Interface Material under Mechanical Cycling
Toward ultrahigh thermal conductivity graphene films
Improved Thermal Properties of Three-Dimensional Graphene Network Filled Polymer Composites
A novel nano-Ag paste with Ag-rGO and its application in GF/Cu laminated structure
Enhanced Mechanical and Thermal Properties of Ag Joints Sintered by Spark Plasma Sintering
High-Performance Electrothermal Film Based on Laser-Induced Graphene
Transparent heaters based on CVD grown few-layer graphene
A Novel Graphene Quantum Dot-Based mRNA Delivery Platform
Characterization of Longitudinal Thermal Conductivity of Graphene Film
A Critical Assessment of Nano Enhanced Vapor Chamber Wick Structures for Electronics Cooling
Highly thermally conductive substrate based on graphene film
Aerosol Jet Printing of Graphene and Carbon Nanotube Patterns on Realistically Rugged Substrates
Fabrication and Characterization of Graphene/polyimide Composite Film
MDS study on tensile properties of defective graphene sheet
Heat transfer analysis of phase change materials with metal foams
Graphene-based films: Fabrication, interfacial modification, and applications
Synergistic Toughening of Graphene Films by Addition of Hydroxylated Carbon Nanotube
Thermal Properties of Laser Reduced Graphene Oxide Films
Thermal Conduction of Fiber-Reinforced Polymer under Loading
Thermal Analysis of an Au/Pt/Ti-Based Microheater
Characterterization of multi-scale nanosilver paste reinforced with SIC particles
Graphene oxide for nonvolatile memory application by using electrophoretic technique
Thermally reduced graphene oxide/carbon nanotube composite films for thermal packaging applications
Multiple growth of graphene from a pre-dissolved carbon source
Properties of Undoped Few-Layer Graphene-Based Transparent Heaters
Synthesis of graphene quantum dots and their applications in drug delivery
Bipolar electrochemical capacitors using double-sided carbon nanotubes on graphite electrodes
Graphene based thermal management system for battery cooling in electric vehicles
Scalable production of thick graphene films for next generation thermal management applications
Effect of Nanopowder Addition on the Sintering of Water-Atomized Iron Powder
Graphene related materials for thermal management
Highly Thermal Conductive and Light -weight Craphene-based Heatsink
Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
Mechanical properties of a novel multi-scale silver paste for electronics interconnect application
Highly thermal conductive and light-weight graphene-based heatsink
Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles
Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles
Thermal interface materials based on vertically aligned carbon nanotube arrays: A review
Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
Reliability investigation of a carbon nanotube array thermal interface material
Surface modification of graphene for use as a structural Fortifier in water-borne epoxy coatings
Graphene-coated copper nanoparticles for thermal conductivity enhancement in water-based nanofluid
Atomic Layer Deposition of Buffer Layers for the Growth of Vertically Aligned Carbon Nanotube Arrays
Effect of pressure during graphitization on mechanical properties of graphene films
Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds
Conductive adhesive based on mussel-inspired graphene decoration with silver nanoparticles
Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering
Thermal Reliability Study of Polymer Bonded Carbon Nanotube Array Thermal Interface Materials
MDS Investigation on the Melting and Solidification of Silver Nanoparticles
Understanding noninvasive charge transfer doping of graphene: a comparative study
Low-Temperature Sintering Bimodal Micro Copper-Nano Silver for Electrical Power Devices
The influence of sintering process on thermal properties of nano-silver paste
Light-weight Compressible and Highly Thermal Conductive Graphene-based Thermal Interface Material
Vertically Aligned Graphene-based Thermal Interface Material with High Thermal Conductivity
Surface analysis of iron and steel nanopowder
Carbon Nanotubes for thermal management of Microsystems
Novel nanostructured thermal interface materials: a review
The large enriched germanium experiment for neutrinoless double beta decay (LEGEND)
Synthesis of tunable hydrogels based on O-acetyl-galactoglucomannans from spruce
Synthesis and characterization of three-dimensional graphene foams by chemical vapor deposition
A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds
Concrete setting and hardening monitoring using a novel graphene-based sensor
Fabrication and characterization of a carbon fiber solder composite thermal interface material
Stretchable Thermoelectric Generators Metallized with Liquid Alloy
An overview of carbon nanotubes based interconnects for microelectronic packaging
Graphene-based heat spreading materials for electronics packaging applications
Design analysis of adhesively bonded structures
Fabrication and characterization of graphene based film
Investigation of thermal interface materials reinforced with micro- and nanoparticles
Graphene-CNT hybrid material as potential thermal solution in electronics applications
Thermal Conductivity Enhancement of Coaxial Carbon@Boron Nitride Nanotube Arrays
Silver decorated graphene-polyvinyl alcohol hybrid hydrogel as catalyst for benzonitrile conversion
Sintering of SiC enhanced copper paste for high power applications
Effect of sintering method on properties of nanosilver paste
Chemical vapor deposition grown graphene on Cu-Pt alloys
Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects
Finite element simulation of 2D-based materials as heat spreaders
Graphene Fibres: Towards high mechanical, thermal and electrical properties state of art
Functionalization mediates heat transport in graphene nanoflakes
Enhanced cooling properties of radar antenna electronics using novel materials
FREESTANDING CARBON NANOFIBERS/GRAPHENE COMPOSITE ELECTRODES FOR SUPERCAPACITORS
Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors
The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging
Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review
Carbon nanotube growth on different underlayers for thermal interface material application
Nanophotonics-based low-temperature PECVD epitaxial crystalline silicon solar cells
Application of two-dimensional layered hexagonal boron nitride in chip cooling
Heat dissipation of a hybrid CNT/Graphene based heat spreader
Thermal properties of TIM using CNTs forest in electronics packaging
2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS
Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives
Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes
Development of bulk-nanostructuring methods for BiSbTe Thermoelectric
A brief overview of atomic layer deposition and etching in the semiconductor processing
Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor
Mechanical characterization ofnanoparticleenhancedSn-3.0Ag-0.5Cu solder
Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing
A review of recent progress of thermal interface materials: from research to industrial applications
Flexible Multi-functionalized Carbon Nanotubes Based Hybrid Nanowires
Reliability of Graphene-based Films Used for High Power Electronics Packaging
Measurement of Dielectric Properties of Ultrafine BaTiO3 Using an Organic-Inorganic Composite Method
Liquid Phase Exfoliated Graphene for Thermal Management in Electronic Packaging
Photonic nanostructures for advanced light trapping in thin crystalline silicon solar cells
Cooling hot spots by hexagonal boron nitride heat spreaders
Flexible Multifunctionalized Carbon Nanotubes-Based Hybrid Nanowires
Thermal elastomer composites for soft transducers
A High Performance Ag Alloyed Nano-scale n-type Bi2Te3 Based Thermoelectric Material
Vertically stacked carbon nanotube-based interconnects for through silicon via application
Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications
Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application
Chemically enhanced carbon nanotubes based Thermal Interface Materials
Combination of positive charges and honeycomb pores to promote MC3T3-E1 cell behaviour
Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles
Use of graphene-based films for hot spot cooling
A solder joint structure with vertically aligned carbon nanofibres as reinforcements
A Novel Method for Three-Dimensional Culture of Central Nervous System Neurons.
Pre-Study of Graphene-Enhanced Cementitious Materials
Stem cell responses to plasma surface modified electrospun polyurethane scaffolds.
A new solder matrix nano polymer composite for thermal management and die attach applications
A carbon fiber solder matrix composite for thermal management of microelectronic devices
Development and characterization of graphene-enhanced thermal conductive adhesives
Energy efficient nano metal polymer composites for cooling applications
Carbon nanotube/solder hybrid structure for interconnect applications
A new solder matrix nano polymer composite for thermal management applications
1. Thermal Characterization of Power Devices Using Graphene-based Film
Experimental results versus numerical simulations of In/Cu intermetallic compounds growth
Reliability of carbon nanotube bumps for chip on glass application
Characterization of nano-enhanced interconnect materials for fine pitch assembly
Carbon fiber solder matrix composite for thermal management of high power electronics
Experimental Study on the Mechanical Reliability of Carbon Nanotubes
Controlling the Density of CNTs by Different UnderlayerMaterials in PECVD Growth
Experimental study of Electrical properties and stability of CNT bumps in high density interconnects
Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD
Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology
Graphene Heat Spreader for Thermal Management of Hot Spots
Reliability of Carbon Nanotube Bumps for Chip on Film Application
Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration
Characterization for Graphene as Heat Spreader Using Thermal Imaging Method
Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots
Surface oxide analysis of lead-free solder particles
Mechanical properties of a novel Nano-Thermal Interface Material
Experimental measurements for mechanical and electrical conductive properties of CNT bundles
Thick film patterning by lift-off process using double-coated single photoresists
Selective growth of double-walled carbon nanotubes on gold films
Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate
Thermal performance characterization of nano thermal interface materials after power cycling
Formation of three-dimensional carbon nanotube structures by controllable vapor densification
Development and Characterization of Nano-Composite Solder
Effect of microstructural evolution in electrically conductive adhesives containing Ag micro-fillers
A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity
Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material
Characterization of CNT Enhanced Conductive Adhesives in Terms of Thermal Conductivity
Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology
TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder
Polymer-metal nanofibrous composite for thermal management of microsystems
Reliability investigation of nano-enhanced thermal conductive adhesives
Environmental reliability of nano-structured polymer-metal composite thermal interface material
Graphene Heat Spreader for Thermal Management of Hot Spots in Electronic Packaging
Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests
A New Thermally Conductive Thermoplastic Die Attach Film
Low Partial Pressure Chemical Vapor Deposition of Graphene on Copper
Electrical Interconnects Made of Carbon Nanotubes: Applications in 3D Chip Stacking
Numerical study of the interface heat transfer characteristics of micro-cooler with CNT structures
Molecular dynamics simulation for the bonding energy of metal-SWNT interface
Influence of substrate on electrical conductivity of isotropic conductive adhesive
Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration
Numerical study of thermal transfer between adhesive and CNTs
Reliability of Microtechnology – Interconnects, Devices and Systems
Benchmarking assembly materials for vertically aligned carbon nanotubes into microsystems
Numerical investigation on thermal properties of micro-pin-fin cooler
Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers
The effect of functionalized silver on properties of conductive adhesives
Study on the reliability of nano-structured polymer-metal composite for thermal interface material
Development and characterisation of nanofiber films with high adhesion
Cell road - biomaterials for neural stem cell migration
Study on the reliability of fast curing isotropic conductive adhesive
Investigation of accelerated surface oxidation of Sn-3,5Ag-0,5Cu solder particles by TEM and STEM
Characterization of surface oxide of lead-free solder particle by TEM and STEM
A highly conductive bimodal isotropic conductive adhesive and its reliability
Study into high temperature reliability of isotropic conductive adhesive
The effect of functionalized silver on rheological and electrical properties of conductive adhesives
Molecular Gun Composed of Carbon Nanotube
Printed monopole antenna with extremely wide bandwidth on liquid crystal polymer substrates
Study into the application of single-wall carbon nanotubes in isotropic conductive adhesives
Electrospun polyurethane-based elastomer fibers for biomedical applications
Surface properties of electrospun polyurethane-based elastomer networks for biomedical applications
Numerical investigation on the thermal properties of the micro-cooler
3D computational fluid dynamics simulation of carbon nanotube based microchannel on-chip cooler
Effects of BN and SiC nanoparticles on properties of conductive adhesive
Polymer nanofiber based continuous metal phase composite for thermal management applications
Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film
Reliability characterisation of bi-modal high temperature stable Isotropic Conductive Adhesives
A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder
Interpenetrating phase polymer-metal composite for thermal interface material applications
MDS study on the adhesive heat transfer in micro-channel cooler
MDS Investigation on the Heat Transfer Properties of CNT Micro-Channel Cooler
A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles
New fast curing isotropic conductive adhesive for electronic packaging application
Optimization of stiffness for isotropic conductive adhesives
Future Emerging Packaging Technology Using Carbon Nanotubes
Dry densification of carbon nanotube bundles
Reliability of isotropic conductive adhesive joints
Use of carbon nanotubes in potential electronics packaging applications
Design of Printed Monopole Antennas on Liquid Crystal Polymer Substrates
Nanofiber based composites for thermal management
The effect of modulus on the performance of thermal conductive adhesives
Reliability study for high temperature stable conductive adhesives
Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA
Study of the filler effect of the effective thermal conductivity of thermal conductive adhesive
FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives
Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging
Modeling of Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications
Through silicon vias filled with planarized carbon nanotube bundles
Design of 50-70 GHz Planar Wideband Bandpass Filter on Liquid Crystal Polymer Substrate
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression
Termiskt ledande metall/polymer nanokompositfilm samt tillhörande tillverkningsmetoder
Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages
The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder
Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg
Coffin-Mansson equation of Sn-4.0Ag-0.5Cu solder joint
3D chip stacking using planarized carbon nanotubes as through-silicon-vias
Carbon Nanotubes as Cooling Fins in Microelectronic Systems
Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles
Polymer-metal nano-composite films for thermal management
Development of a test platform for thermal characterization using through-silicon-via technology
A METHOD STUDY OF CFD SIMULATION FOR CNT MICROCOOLER
Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application
Nanostructured Polymer-metal Composite for Thermal Interface Material Applications
Vibration and Bucling of a carbon nanotbue inserted with a carbon chain
Overview of Carbon Nanotubes as Off-Chip Interconnects
Preparation of polysulfoneamide electrospinning nanofibers
Användning av ett kompositmaterial som termiskt kontaktmaterial för mikroelektroniska komponenter
Recent Progress of Thermal Interface Materials
Understanding BGA interconnect interface behaviour using Micropolar theory
A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers
Development of Nanomaterials and Devices for Electronics Cooling and Interconnect
A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers
Effect of Encapsulation on OLED Characteristics with Anisotropic Conductive Adhesive
Vibration and buckling of a carbon nanotube inserted with a carbon chain
Heat transfer simulation of nanofluids in microfluidic channels
Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant
Recent Progress of Thermal Interface Material Research – An Overview
Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load
RF Performance of Flip Chip ACA Joints for CPW Transmission Lines
Micropolar Cohesive Zone Model for Delamination Failure in Microsystem Interconnects
Development of High Temperature Stable Isotropic Conductive Adhesives
Millimeter-wave ultra-wideband bandpass filter based on LCP substrates for automotive radar systems
Recent Development of Nano-solder Paste for Electronics Interconnect Applications
Recent Advances in the Synthesis of Lead-free Solder Nanoparticle
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression
A Compact V-band Planar Wideband Bandpass Filter Based on Liquid Crystal Polymer Substrates
Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging
Effect of Corrosion on the Low Cycle Fatigue Behaviour of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints
Electrically Conductive Adhesives
Realization of A Ultra Wideband BPF based on LCP Substrate for Wireless Application
Encapsulation of OLED device by Using Anisotropic Conductive Adhesive
Reliability characterisation of lead free solder joints using three point bending test
Second order multi-scale micropolar model for microsystem interconnections
PBGA Interconnect Behavior under Thermal Effects
Advances in Europe - China Green Electronics Collaboration
Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive
Tensile fracture behaviour of Sn-3.0Ag-0.5Cu solder joints on copper
Reliability aspects of electronics packaging technology using anisotropic conductive adhesives
Preparation Techniques and Characterization for Sn-3.0Ag-0.5Cu Nanopowders
Manufacturing and Characterisation of Silver nano particles based Nano Thermal Interface material
Investigation of the Effect of Processing Variables on the Structure and Morphology of Nano-TIM
Process and pad design optimization for 01005 passive component surface mount assembly
A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array
Effect of Corrosion on the Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints
An aging study of intermetallic compounds formation in Sn-0.4Co-0.7Cu
Investigation of Dielectric Strength of Electrospun Nanofiber Based Thermal Interface Material
RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints
Development and Characterization of Microcoolers using Carbon Nanotubes
Integrated inductors on liquid crystal polymer substrate for RF applications
Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles
Interface Modelling of ACA Interconnects Using Micropolar Theory
Assessment of Lead-Free Inert Gas Soldering Using a Novel Reflow Technology
Analysis of Mechanical Strength for Flip-chip Bonding of GaAs MMIC
Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection
Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal ccling testing
Development of High Adhesion Nano-Thermal Interface Materials for Electronics Packaging Applications
Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection
Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint
Characterization of Nanoparticles of Lead Free Solder Alloys
Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions
Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy
Design for Embedded Chinese Display Smart Card
Consequential toxicity assessment of the global shift to Pb free solder paste
New Nano-Thermal Interface Material for Heat Removal in Electronics Packaging
Reliability analysis of embedded chip technique with design of experiment methods
Reliability of Conductive adhesives
Low cycle fatigue testing and simulation of Sn8Zn-3Bi and Sn-37Pb solder joints
Characterization of thermally conductive epoxy nano-composites
Numerical Simulation Based on CFD for Impingement Heat Transfer in Electronics Cooling
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
Development of an ontology for the ACA technology in electronics applications
Integrated Nanotube Microcooler for Microelectronics Applications
Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint
Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder Joint
Adhesion study of copper layer deposited and liquid crystalline polymer for electronics packaging
Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate
THERMAL MODELING FOR SYSTEM-IN-A-PACKAGE BASED ON EMBEDDED CHIP STRUCTURE
Thermal cycling and reliability of lead free BGA components
Integrated Capacitors and Resistors on Liquid Crystal Polymer Substrate
Design for Manufacturability and Reliability of Embedded Display Smart Card
An Ontology of ICA for Microsystem applications
Reliability of Conductive adhesives
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation
Modelling of Carbon Nanotubes as Heat Sink Fins in Microchannels for Microelectronics Cooling
Residual Stress in Flip Chip Joining Using Anisotropic Conductive Adhesive
Reliability of conductive adhesives in electronics packaging
Microsystem Interconnections Modelling Using Micropolar Theory and Discontinuous Approximation
Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation
Environmental Assessment of Embedded chip manufacturing Technology
Electron conduction through nano particles in electrically conductive adhesives
Thermodynamic assessment of Sn-Co lead-free solder system
Thermal Fatigue Cracking of Surface Mount Conductive Adhesive Joints
Microsystem Manufacturing, Assembly and Packaging Technology in Display-CardTM Applications
Effect of Curing Condition of Adhesion Strength and ACA Flip Chip Contact Resistance
Process Development and Reliability for System-in-a-Package Using Liquid Crystal Polymer Substrate
Theoretical Analysis of RF Performance of Anisotropic Conductive Adhesive Flip-Chip Joints
Characterization of Substrate Materials for System-in-a-Package Applications
Study on thermomechanical reliability of a tunable light modulator
Characterization of Metal- coated Polymer Spheres and its Use in Anisotropic Conductive Adhesive
Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
Integrating nano carbon tubes with microchannel cooler
Integrated Inductors on Liquid Crystal Polymer Substrate for RF Applications
Electron conduction through nano particles in electrically conductive adhesives
Microwave-transmission, heat and temperature properties of electrically conductive adhesives
Development of a web-based course on lead-free solders
System-on-Packaging: A Broad Perspective from System Design to Technology Development
Electrical conduction characteristics of anisotropic conductive adhesive particles, Guangbin Dou
Thermodynamic Assessment of Sn-Co-Cu Lead-free Solder Alloy
Thermal Stress Analysis of a Novel Light Modulator
Electron conduction through nano particles in electrically conductive adhesives
Panel-Size Component Integration (PCI) with Molded Liquid Crystal Polymer (LCP) Substrates
Isotropically Conductive Adhesives for Large Power Electronics Applications
Behaviour and Properties of Conductive Particles for Anisotropic Conductive Adhesive
Formulation and electrical and mechanical properties of anisotropic conductive adhesive pastes
High frequency characteristics of Liquid Crystal Polymer for System in a Package Application
Characterization of Liquid Crystal Polymer for High Frequency System-in-a-Package Applications
Microstructure Investigation of Sn-Ag-Based Lead-Free Solder Joints by Electron Microscopy
Web Course on Electrically Conductive Adhesives
Electrical Characterization of Isotropic Conductive Adhesive under Mechanical Deformation
Reliability of ACA flip-chip joints on FR-4 substrate
Overview of Conductive Adhesive Joining and Bumping Technology for direct chip attach applications
Comparison of Mechanical Fatigue Test and Thermal Cycling for Failure Analysis of Solder Joints
Low Cycle fatigue of lead-free solders
Thermal Performance of a System in Package Design Concept
Computational Modelling of the Anisotropic Conductive Adhesive Assembly Process
Life Cycle Analysis of a telephone exchange station
Fundamentals of Packaging Materials and Processes
Life time prediction of anisotropic conductive adhesive joint for electronics packaging applications
The effect of bump height on the reliability of ACF in flip-chip
Modelling of Heat Transfer for System in Package (SIP)
Low-Cycle fatigue life of SnAgBi and Sn-Ag lead-free solders
A review of microwave curing of polymer materials
Modelling of the anisotropic conductive adhesive assembly
Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B Lead Free Solders
Microwave Cure of Metal-filled Electrically Conductive Adhesives
Statistics on conduction in ACA materials
Development of an internet Course on Conductive Adhesives for Electronics Packaging
Fatigue properties of lead-free solders
An Internet Course on Conductive Adhesives for Electronics Packaging
Reliability of ACF in Flip-Chip with Various Bump Height
Characterization of bulk mechanical properties of lead-free solders
Life Cycle Assessment of a telecommunications exchange
Effect of thermal ageing on the shear strength of lead-free solder joints
Microwave transmission, heating of electrically conductive adhesives
Heat Transfer Modeling of System in Package (SIP)
Microstructural coarsening of lead-free solders
Bump Height Effect on the Reliability and on the Strains Variations of ACA Flip-chip Joints
Cluster effects on electrical conductance of isotropically conductive adhesive
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Showing 26 research projects
2D material-based technology for industrial applications (2D-TECH)
Funktionaliserad grafenförstärkt beläggning
Miniatyriserad kryokylare baserad på grafen
Värmespridare och värmeöverförande element med grafenbaserade filmer för radar och laser
Grafenförstärkt betong för lättvikts stängsel
Grafenförstärkta betongpålar - industrialisering av funktionaliserad grafen i betong
Long-term performance monitoring of concrete structures using a novel graphene-based DURAble SENSor
Nanotechnology Enhanced Sintered Steel Processing
Miniatyriserad kryokylare baserad på grafen
Graphene reinforced composite for asphalt pavements
Phononic Thin-Film Thermoelectric Generators - HotTEG
Funtionalized graphene reinforced cementitious materials for greener construction
Förstudie på Miniatyriserad kryokylare baserad på grafen
Carbon Based High Speed 3D GaN Electronics System
Carbon Based Smart Systems for Wireless Applications (NANO RF)
Innovative Nano and Micro Technologies for Advanced Thermo and Mechanical Interfaces (NANOTHERM)
Skalbar Nanomaterial och lösning bearbetningsbar TEG
Environmental reliability of nano-structured polymer-metal composite thermal interface material
Computational and experimental analysis of drop-on-demand jetting of complex fluids
Nanomaterial from stem cell divistion, migration and differentiation into neuronal cells