Johan Liu

Full Professor at Electronics Material and Systems

Dr Johan Liu graduated with a master and a Ph.D. degree in materials science from the Royal Institute of Technology, Sweden. Before joining Chalmers University of Technology, he served in various positions at the Swedish Institute for Production Engineering Research (IVF) as project manager, group leader and division manager. He is currently full professor in electronics production and head of Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience in Chalmers University of Technology, Sweden.

As a member of the Royal Swedish Academy of Engineering Sciences and a fellow of IEEE, he has published 500 papers in journals, conference proceedings and book chapters with a Hirsch index of 29 in Web of Science (WoS) and 39 in Google Scholar Citation System (Google Scholar) and with a citation of over 2840 times (WoS) or 6000 (Google Scholar). He has 75 patents accepted or filed and has given 55 keynote/invited talks. In addition to this, he has published 35 papers with impact factor over 3,5 (8 of them over 10) including those in Nature Communications, Advanced Materials, Advanced Functional Materials, Nanoenergy, Small, Carbon, Journal of Materials Chemistry, Biomicrofludics, Tissue Engineering, Glia, Langmuir, Scientific Reports, IEEE Electron Deveic Letters and IEEE CPMT Transactions, Applied Physics Letters, Nanotechnology, IEEE Nanotechnology, Journal of Composite Science and Technology and European Polymer Journal. He has also received many awards including IEEE Exceptional Technical Achievement Award, IEEE CPMT Transaction Best paper award in “Advanced Packaging”. His research field covers mainly nanoelectronics, microsystems packaging and 3D additive manufacturing materials and processes including vertical stacking CNT TSV technology, CNT/graphene assisted cooling technology, graphene heat spreader, high temperature stable conductive adhesives, nano-soldering, nano-thermal interface materials and biomedical nanoscaffolds. He has successfully run over 70 research projects funded by National Science Fundation, Swedish Board for Strategic Research (SSF), Natoinal Swedish Board for Innovation (Vinnova) and Formas, Sweden as well as EU FP6, FP7 and Horizon 2020 programs.

Source: chalmers.se
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Showing 554 publications

2024

Novel Lightweight, Highly Thermally Conductive Graphene-Enhanced Heat Pipes for Electronics Cooling and Thermal Management Applications

Zhiyang Shen, Jiajia Chen, Sihua Guo et al
2024 International Conference on Electronics Packaging, ICEP 2024, p. 339-340
Paper in proceeding
2024

A Simulation Based Comparative Study on Thermal and Mechanical Performance of Silicone Grease and Graphene-enhanced Thermal Pad for Single-chip and Multi-chip Packaging Applications

Jiabin Chen, Yunzheng Xuan, Yiran Liu et al
NordPac 2024 - 60th Annual Microelectronics and Packaging Conference and Exhibition
Paper in proceeding
2023

Toward ultrahigh thermal conductivity graphene films

Sihua Guo, Shujin Chen, Amos Nkansah et al
2D Materials. Vol. 10 (1)
Journal article
2023

A Critical Assessment of graphene based heat pipes for electronics and power module cooling applications

Zhiyang Shen, Hongfeng Zhang, Amos Nkansah et al
2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
Paper in proceeding
2023

Characterization of a Novel Cost-efficient and Environmentally Friendly Graphene-enhanced Thermal Interface Material

Sihua Guo, Kristoffer Harr Martinsen, Amos Nkansah et al
24th European Microelectronics and Packaging Conference, EMPC 2023
Paper in proceeding
2022

Improved Thermal Properties of Three-Dimensional Graphene Network Filled Polymer Composites

Yong Zhang, Fei Yang, Chen Yu et al
Journal of Electronic Materials. Vol. 51 (1), p. 420-425
Journal article
2022

Reliability Characterization of Graphene Enhanced Thermal Interface Material for Electronics Cooling Applications

Markus Enmark, Murali Murugesan, Amos Nkansah et al
2022 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2022
Paper in proceeding
2022

Reduction of thermal resistance of Ag-coated GFs/copper structure using nano-Ag paste as interconnection

Zhen Lv, Chenfei Zhou, Johan Liu et al
Journal of Physics: Conference Series. Vol. 2174 (1)
Paper in proceeding
2022

A novel nano-Ag paste with Ag-rGO and its application in GF/Cu laminated structure

Chenfei Zhou, Zheng Lv, Xiuzhen Lu et al
2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022
Paper in proceeding
2022

Enhanced Mechanical and Thermal Properties of Ag Joints Sintered by Spark Plasma Sintering

Xiuzhen Lu, Zhen Lv, Yongqian Sun et al
Journal of Electronic Materials. Vol. 51 (11), p. 6310-6319
Journal article
2022

Transparent heaters based on CVD grown few-layer graphene

Yong Zhang, Fei Yang, Hao Liu et al
Journal of Materials Science: Materials in Electronics. Vol. 33 (7), p. 3586-3594
Journal article
2022

High-Performance Electrothermal Film Based on Laser-Induced Graphene

Fei Yang, Chen Yu, Li Zhang et al
Advanced Engineering Materials. Vol. 24 (11)
Journal article
2022

Graphene Oxide and Nitrogen-Doped Graphene Coated Copper Nanoparticles in Water-Based Nanofluids for Thermal Management in Electronics

Abdelhafid Zehri, Andreas Nylander, Torbjörn Nilsson et al
JOURNAL OF NANOFLUIDS. Vol. 11 (1), p. 125-134
Journal article
2021

MDS study on tensile properties of defective graphene sheet

Y. Zhang, Huihui Wang, Pei Lu et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2021

A Critical Assessment of Nano Enhanced Vapor Chamber Wick Structures for Electronics Cooling

Markus Enmark, Yifeng Fu, Torbjörn Nilsson et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2021

Fabrication and Characterization of Graphene/polyimide Composite Film

Xinjian Gong, Jin Chen, Yong Zhang et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2021

A Novel Graphene Quantum Dot-Based mRNA Delivery Platform

Ya Liu, Changhong Zhao, Alan Sabirsh et al
ChemistryOpen. Vol. 10 (7), p. 666-671
Journal article
2021

Characterization of Longitudinal Thermal Conductivity of Graphene Film

Jiajia Chen, Xinjian Gong, Sihua Guo et al
2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
Paper in proceeding
2021

Highly thermally conductive substrate based on graphene film

Zhen Lv, Chenfei Zhou, Xiuzhen Lu et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021, p. 195-199
Paper in proceeding
2021

Degradation of Carbon Nanotube Array Thermal Interface Materials through Thermal Aging: Effects of Bonding, Array Height, and Catalyst Oxidation

Andreas Nylander, Josef Hansson, Torbjörn Nilsson et al
ACS Applied Materials & Interfaces. Vol. 13 (26), p. 30992-31000
Journal article
2021

Aerosol Jet Printing of Graphene and Carbon Nanotube Patterns on Realistically Rugged Substrates

Reinhard Kaindl, Tushar Gupta, Alexander Bluemel et al
ACS Omega. Vol. 6 (50), p. 34301-34313
Journal article
2021

Heat transfer analysis of phase change materials with metal foams

Y. Zhang, Huihui Wang, Pei Lu et al
2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
Paper in proceeding
2021

Exploring Graphene Coated Copper Nanoparticles as a multifunctional Nanofiller for Micro-Scaled Copper Paste

Abdelhafid Zehri, Torbjörn Nilsson, Yifeng Fu et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2021

Graphene-based films: Fabrication, interfacial modification, and applications

Sihua Guo, Jin Chen, Yong Zhang et al
Nanomaterials. Vol. 11 (10)
Review article
2021

Thermal Conduction of Fiber-Reinforced Polymer under Loading

Pei Lu, Huihui Wang, Yong Zhang et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2021

Thermal Analysis of an Au/Pt/Ti-Based Microheater

Yong Zhang, Chen Yu, Fei Yang et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2021

Synergistic Toughening of Graphene Films by Addition of Hydroxylated Carbon Nanotube

Sihua Guo, Jin Chen, Yuanyuan Wang et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2021

Thermal Properties of Laser Reduced Graphene Oxide Films

Chen Yu, Fei Yang, Johan Liu et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2021

Thermal Properties of Laser-induced Graphene Films Photothermally Scribed on Bare Polyimide Substrates

Fei Yang, Chen Yu, Johan Liu et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2020

Properties of Undoped Few-Layer Graphene-Based Transparent Heaters

Yong Zhang, H. Liu, L. Tan et al
Materials. Vol. 13 (1)
Journal article
2020

Thermally Conductive Graphene Film/Indium/Aluminum Laminated Composite by Vacuum Assisted Hot-pressing

Hao Liu, Maomao Zhang, Shujin Chen et al
2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
Paper in proceeding
2020

Characterterization of multi-scale nanosilver paste reinforced with SIC particles

Ziwei Jiang, Yongqian Sun, Qiaoran Zhang et al
China Semiconductor Technology International Conference 2020, CSTIC 2020
Paper in proceeding
2020

Graphene oxide for nonvolatile memory application by using electrophoretic technique

Hao Liu, Jun Li, S. Chen et al
Materials Today Communications. Vol. 25
Journal article
2020

Highly Oriented Graphite Aerogel Fabricated by Confined Liquid-Phase Expansion for Anisotropically Thermally Conductive Epoxy Composites

Mengxiong Li, Jiangwei Liu, Shaoxue Pan et al
ACS Applied Materials & Interfaces. Vol. 12 (24), p. 27476-27484
Journal article
2020

Scalable production of thick graphene films for next generation thermal management applications

Shujing Chen, Qianlong Wang, Maomao Zhang et al
Carbon. Vol. 167, p. 270-277
Journal article
2020

Thermally reduced graphene oxide/carbon nanotube composite films for thermal packaging applications

G. Yuan, Jie Fei Xie, Haohao Li et al
Materials. Vol. 13 (2)
Journal article
2020

Multiple growth of graphene from a pre-dissolved carbon source

Andrea Fazi, Andreas Nylander, Abdelhafid Zehri et al
Nanotechnology. Vol. 31 (34), p. 345601-
Journal article
2020

Synthesis of graphene quantum dots and their applications in drug delivery

Changhong Zhao, Xuebin Song, Ya Liu et al
Journal of Nanobiotechnology. Vol. 18 (1)
Review article
2020

High porosity and light weight graphene foam heat sink and phase change material container for thermal management

Abdelhafid Zehri, Majid Kabiri Samani, Martí Gutierrez Latorre et al
Nanotechnology. Vol. 31 (42)
Journal article
2020

Bipolar electrochemical capacitors using double-sided carbon nanotubes on graphite electrodes

Josef Hansson, Qi Li, Anderson David Smith et al
Journal of Power Sources. Vol. 451
Journal article
2020

Graphene based thermal management system for battery cooling in electric vehicles

Ya Liu, Torbjörn Thiringer, Nan Wang et al
Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020
Paper in proceeding
2020

Effects of high temperature treatment of carbon nanotube arrays on graphite: increased crystallinity, anchoring and inter-tube bonding

Josef Hansson, Andreas Nylander, Mattias Flygare et al
Nanotechnology. Vol. 31 (45)
Journal article
2020

Enhanced electrochemical performance of three-dimensional graphene/carbon nanotube composite for supercapacitor application

Ziyu Niu, Yong Zhang, Yan Zhang et al
Journal of Alloys and Compounds. Vol. 820
Journal article
2020

Improved Interfacial Bonding Strength and Reliability of Functionalized Graphene Oxide for Cement Reinforcement Applications

Nan Wang, Shuping Wang, Luping Tang et al
Chemistry - A European Journal. Vol. 26 (29), p. 6561-6568
Journal article
2020

Graphene related materials for thermal management

Yifeng Fu, Josef Hansson, Ya Liu et al
2D Materials. Vol. 7 (1)
Journal article
2020

Analysis of heat dissipation characteristics of three-dimensional graphene-carbon nanotube composite structures

Hang Yin, Yan Zhang, Pei Lu et al
2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
Paper in proceeding
2020

Electrical monitoring of concrete using a novel structural sensor based on conductive cementitious mortar

Emma Zhang, Sotirios Grammatikos, Ingemar Löfgren et al
ECCM 2018 - 18th European Conference on Composite Materials
Paper in proceeding
2020

Effect of Nanopowder Addition on the Sintering of Water-Atomized Iron Powder

Swathi Kiranmayee Manchili, Johan Wendel, Abdelhafid Zehri et al
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. Vol. 51 (9), p. 4890-4901
Journal article
2019

Highly thermal conductive and light-weight graphene-based heatsink

Nan Wang, Ya Liu, L. Ye et al
2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
Paper in proceeding
2019

Highly Thermal Conductive and Light -weight Craphene-based Heatsink

Nan Wang, Ya Liu, Lilei Ye et al
2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC)
Paper in proceeding
2019

Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

Ya Liu, Nan Wang, L. Ye et al
Advancing Microelectronics. Vol. 2019 (NOR), p. 1-5
Journal article
2019

Chemical Vapor Deposition of Vertically Aligned Carbon Nanotube Arrays: Critical Effects of Oxide Buffer Layers

Haohao Li, G. Yuan, B. Shan et al
Nanoscale Research Letters. Vol. 14
Journal article
2019

Thermal interface materials based on vertically aligned carbon nanotube arrays: A review

G. Yuan, Haohao Li, B. Shan et al
Micro and Nanosystems. Vol. 11 (1), p. 3-10
Review article
2019

Mechanical properties of a novel multi-scale silver paste for electronics interconnect application

Yongqian Sun, Xiuzhen Lu, Q. Zhang et al
2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019
Paper in proceeding
2019

Thermal conductivity enhancement of carbon@ carbon nanotube arrays and bonded carbon nanotube network

Majid Kabiri Samani, Congxiang Lu, Kong Qinyu et al
Materials Research Express. Vol. 6 (8)
Journal article
2019

Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles

Xu Long, Zhen Li, Xiuzhen Lu et al
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. Vol. 744, p. 406-414
Journal article
2019

Highly thermal conductive and electrically insulated graphene based thermal interface material with long-term reliability

Nan Wang, Ya Liu, S. Chen et al
Proceedings - Electronic Components and Technology Conference. Vol. 2019-May, p. 1564-1568
Paper in proceeding
2019

Effect of Boron Nitride Particle Geometry on the Thermal Conductivity of a Boron Nitride Enhanced Polymer Composite Film

Ya Liu, Nan Wang, L. Ye et al
THERMINIC 2019 - 2019 25th International Workshop Thermal Investigations of ICs and Systems
Paper in proceeding
2019

Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles

Q. Zhang, Abdelhafid Zehri, Jiawen Liu et al
Soldering and Surface Mount Technology. Vol. 31 (4), p. 193-202
Journal article
2019

Effect of Fiber Concentration on Mechanical and Thermal Properties of a Solder Matrix Fiber Composite Thermal Interface Material

Josef Hansson, Torbjörn Nilsson, L. Ye et al
IEEE Transactions on Components, Packaging and Manufacturing Technology. Vol. 9 (6), p. 1045-1053
Journal article
2019

Experimental Measurements of Thermal Performances of Carbon Nanomaterial with Vertical Structures in Hotspot Heat Dissipation

Y. Zhang, Longwang Tan, Hang Yin et al
Proceedings of the IEEE Conference on Nanotechnology. Vol. 2019-July, p. 370-373
Paper in proceeding
2019

Covalent anchoring of carbon nanotube-based thermal interface materials using epoxy-silane monolayers

Andreas Nylander, Yifeng Fu, Mingliang Huang et al
IEEE Transactions on Components, Packaging and Manufacturing Technology. Vol. 9 (3), p. 427-433
Journal article
2019

Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

Ya Liu, Nan Wang, L. Ye et al
Proceedings - 2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019, p. 1-5
Paper in proceeding
2019

Graphene-coated copper nanoparticles for thermal conductivity enhancement in water-based nanofluid

Abdelhafid Zehri, Andreas Nylander, L. Ye et al
2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
Paper in proceeding
2019

Atomic Layer Deposition of Buffer Layers for the Growth of Vertically Aligned Carbon Nanotube Arrays

Haohao Li, G. Yuan, B. Shan et al
Nanoscale Research Letters. Vol. 14
Journal article
2019

RF properties of carbon nanotube / Copper composite through silicon via based CPW structure for 3D integrated circuits

Andreas Nylander, Marlene Bonmann, Andrei Vorobiev et al
2019 IEEE 14th Nanotechnology Materials and Devices Conference, NMDC 2019
Paper in proceeding
2019

Reliability investigation of a carbon nanotube array thermal interface material

Andreas Nylander, Josef Hansson, Majid Kabiri Samani et al
Energies. Vol. 12 (11)
Journal article
2019

Surface modification of graphene for use as a structural Fortifier in water-borne epoxy coatings

Ya Liu, Chao Xia, Abdelhafid Zehri et al
Coatings. Vol. 9 (11)
Journal article
2019

Manufacturing Graphene-Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor

Shujing Chen, Abdelhafid Zehri, Qianlong Wang et al
ChemistryOpen. Vol. 8 (1), p. 58-63
Journal article
2019

Compact and low loss electrochemical capacitors using a graphite / carbon nanotube hybrid material for miniaturized systems

Qi Li, S. Sun, Anderson David Smith et al
Journal of Power Sources. Vol. 412, p. 374-383
Journal article
2019

Effect of pressure during graphitization on mechanical properties of graphene films

Maomao Zhang, S. Chen, Xiao Xin Zhang et al
2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019
Paper in proceeding
2019

Preparation of graphene/aligned carbon nanotube array composite films for thermal packaging applications

Bo Shan, Guangjie Yuan, Haohao Li et al
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes. Vol. 58
Journal article
2018

Conductive adhesive based on mussel-inspired graphene decoration with silver nanoparticles

Marcello Casa, Maria Sarno, Rosalba Liguori et al
Journal of Nanoscience and Nanotechnology. Vol. 18 (2), p. 1176-1185
Journal article
2018

Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering

Nan Wang, Majid Kabiri Samani, Hu Li et al
Small. Vol. 14 (29)
Journal article
2018

Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds

Majid Kabiri Samani, Shuangxi Sun, Yifeng Fu et al
Advanced Materials Interfaces. Vol. 5 (15)
Journal article
2018

Thermal Reliability Study of Polymer Bonded Carbon Nanotube Array Thermal Interface Materials

Andreas Nylander, Christian Chandra Darmawan, Ana Borta Boyon et al
THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
Paper in proceeding
2018

Anisotropic thermal conductivity of vertically self-ordered Nanocrystalline Boron Nitride thin films for thermal hotspot mitigation in electronics

S. H. Tsang, O. Cometto, Majid Kabiri Samani et al
2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018 - Proceedings, p. 25-27
Paper in proceeding
2018

Egg albumen templated graphene foams for high-performance supercapacitor electrodes and electrochemical sensors

Ya Liu, Xiaoli Zhao, Cancan Wang et al
Journal of Materials Chemistry A. Vol. 6 (37), p. 18267-18275
Journal article
2018

Elevated thermoelectric figure of merit of n-type amorphous silicon by efficient electrical doping process

Debashree Banerjee, Örjan Vallin, Majid Kabiri Samani et al
Nano Energy. Vol. 44, p. 89-94
Journal article
2018

Understanding noninvasive charge transfer doping of graphene: a comparative study

Ankit Nalin Mehta, Wei Mu, Murali Murugesan et al
Journal of Materials Science: Materials in Electronics. Vol. 29 (7), p. 5239-5252
Journal article
2018

Low-Temperature Sintering Bimodal Micro Copper-Nano Silver for Electrical Power Devices

Abdelhafid Zehri, L. Ye, Johan Liu
2018 7th Electronic System-Integration Technology Conference (ESTC)
Paper in proceeding
2018

The influence of sintering process on thermal properties of nano-silver paste

Xiuzhen Lu, Qianran Zhang, Abdelhafid Zehri et al
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), p. 1157-1160
Paper in proceeding
2018

Carbon Nanotubes for thermal management of Microsystems

Johan Liu, Teng Wang
Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition, p. 775-791
Book chapter
2018

Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications

Nan Wang, Shujing Chen, Amos Nkansah et al
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), p. 1588-1592
Paper in proceeding
2018

Reliability study on high thermally conductive graphene film as heat spreader in electronics cooling applications

Amos Nkansah, Nan Wang, L. Ye et al
IMAPS Nordic Annual Conference, NordPack 2018. Vol. 2018, p. 126-130
Paper in proceeding
2018

Finite Element Analysis to the Constitutive Behavior of Sintered Silver Nanoparticles Under Nanoindentation

Xu Long, Chongyang Du, Zhen Li et al
International Journal of Applied Mechanics. Vol. 10 (10)
Journal article
2018

Light-weight Compressible and Highly Thermal Conductive Graphene-based Thermal Interface Material

Nan Wang, S. Chen, Amos Nkansah et al
2018 7th Electronic System-Integration Technology Conference (ESTC)
Paper in proceeding
2018

MDS Investigation on the Melting and Solidification of Silver Nanoparticles

Yan Zhang, Guoqiang Zhang, Xiuzhen Lu et al
2018 19th International Conference on Electronic Packaging Technology (ICEPT) , p. 5-9
Paper in proceeding
2018

Surface analysis of iron and steel nanopowder

Swathi Kiranmayee Manchili, Ruslan Shvab, Abdelhafid Zehri et al
Surface and Interface Analysis. Vol. 50 (11), p. 1083-1088-10886
Journal article
2018

Critical atomic-level processing technologies: Remote plasma-enhanced atomic layer deposition and atomic layer etching

G. Yuan, Haohao Li, B. Shan et al
Micro and Nanosystems. Vol. 10 (2), p. 76-83
Review article
2018

Synthesis of a Graphene Carbon Nanotube Hybrid Film by Joule Self-heating CVD for Thermal Applications

Josef Hansson, Majid Kabiri Samani, Andreas Nylander et al
Proceedings - Electronic Components and Technology Conference. Vol. 2018-May
Paper in proceeding
2018

Vertically Aligned Graphene-based Thermal Interface Material with High Thermal Conductivity

Nan Wang, Shujing Chen, Amos Nkansah et al
THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings, p. 285-288
Paper in proceeding
2018

Novel nanostructured thermal interface materials: a review

Josef Hansson, Torbjörn M. J. Nilsson, L. Ye et al
International Materials Reviews. Vol. 63 (1), p. 22-45
Review article
2017

Fabrication and characterization of a carbon fiber solder composite thermal interface material

Josef Hansson, L. Ye, Johan Liu
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 97-100
Paper in proceeding
2017

Synthesis of tunable hydrogels based on O-acetyl-galactoglucomannans from spruce

Kajsa Markstedt, W. Xu, Johan Liu et al
Carbohydrate Polymers. Vol. 157, p. 1349-1357
Journal article
2017

Synthesis and characterization of three-dimensional graphene foams by chemical vapor deposition

Yong Zhang, Kabir Majid Samani, Johan Liu
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 139-142
Paper in proceeding
2017

A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Di Jiang, Shuangxi Sun, Michael Edwards et al
Flexible and Printed Electronics. Vol. 2 (2)
Journal article
2017

Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier

S. Huang, W. Ke, Y. Yang et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 143-146
Paper in proceeding
2017

Stretchable Thermoelectric Generators Metallized with Liquid Alloy

Seung Hee Jeong, Francisco Javier Cruz, Si Chen et al
ACS Applied Materials & Interfaces. Vol. 9 (18), p. 15791-15797
Journal article
2017

An overview of carbon nanotubes based interconnects for microelectronic packaging

S. Chen, B. Shan, Y. Yang et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 113-119
Paper in proceeding
2017

The large enriched germanium experiment for neutrinoless double beta decay (LEGEND)

N. Abgrall, A. Abramov, N. Abrosimov et al
AIP Conference Proceedings. Vol. 1894
Paper in proceeding
2017

Control of Nanoplane Orientation in voBN for High Thermal Anisotropy in a Dielectric Thin Film: A New Solution for Thermal Hotspot Mitigation in Electronics

O. Cometto, Majid Kabiri Samani, B. Liu et al
ACS Applied Materials & Interfaces. Vol. 9 (8), p. 7456-7464
Journal article
2017

Efficient surface modification of carbon nanotubes for fabricating high performance CNT based hybrid nanostructures

Nan Wang, Santosh Pandit, L. Ye et al
Carbon. Vol. 111, p. 402-410
Journal article
2017

Concrete setting and hardening monitoring using a novel graphene-based sensor

Sotirios Grammatikos, Ingemar Löfgren, Luping Tang et al
ICF 2017 - 14th International Conference on Fracture. Vol. 2, p. 1204-1205
Paper in proceeding
2017

Graphene-based heat spreading materials for electronics packaging applications

G. Yuan, B. Shan, S. Chen et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 172-174
Paper in proceeding
2017

Interface and interconnection stresses in electronic assemblies – A critical review of analytical solutions

E. H. Wong, Johan Liu
Microelectronics and Reliability. Vol. 79, p. 206-220
Review article
2017

Design analysis of adhesively bonded structures

Ee Hua Wong, Johan Liu
Polymers. Vol. 9 (12)
Journal article
2017

Evaluating CNT-Based Interconnects : A Nummerical Tool to Characterize Hybrid CNT-Copper Interconnects

Silvia Bistarelli, Shuangxi Sun, Luca Pierantoni et al
IEEE Microwave Magazine. Vol. 18 (4), p. 124-129
Journal article
2017

Investigation of thermal interface materials reinforced with micro- and nanoparticles

K. Janeczek, A. Arazna, Y. Zhang et al
China Semiconductor Technology International Conference 2017, CSTIC 2017
Paper in proceeding
2017

Graphene-CNT hybrid material as potential thermal solution in electronics applications

C. C. Darmawan, L. Ye, Majid Kabiri Samani et al
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 190-193
Paper in proceeding
2017

Thermal Conductivity Enhancement of Coaxial Carbon@Boron Nitride Nanotube Arrays

Lin Jing, Kabir Majid Samani, B. Liu et al
ACS Applied Materials & Interfaces. Vol. 9 (17), p. 14555-14560
Journal article
2017

Fabrication and characterization of graphene based film

Yuqing Shi, L. Ye, Abdelhafid Zehri et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 162-166
Paper in proceeding
2017

Finite element analysis of bond line thickness and fiber distribution in solder based thermal interface materials

Maulik Satwara, Josef Hansson, L. Ye et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 167-171
Paper in proceeding
2017

Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging

Y. Yang, H. Ye, W. Ke et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 125-128
Paper in proceeding
2017

Silver decorated graphene-polyvinyl alcohol hybrid hydrogel as catalyst for benzonitrile conversion

Marcello Casa, Maria Sarno, Johan Liu et al
Advanced Science Letters. Vol. 23 (6), p. 5980-5983
Journal article
2017

Sintering of SiC enhanced copper paste for high power applications

Martí Gutierrez, Nan Wang, Majid Kabiri Samani et al
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 151-156
Paper in proceeding
2017

Effect of sintering method on properties of nanosilver paste

Q. Zhang, Jiawen Liu, W. Ke et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 186-189
Paper in proceeding
2017

Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications

ANDREAS NYLANDER, Yifeng Fu, L. Ye et al
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 175-181
Paper in proceeding
2017

Chemical vapor deposition grown graphene on Cu-Pt alloys

Yong Zhang, Yifeng Fu, Michael Edwards et al
Materials Letters. Vol. 193, p. 255-258
Journal article
2016

Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation

Xin Luo, J. C. Peng, Carl Zandén et al
Acta Materialia. Vol. 104, p. 109-118
Journal article
2016

Graphene oxide based coatings on Nitinol for biomedical implant applications: Effectively promote mammalian cell growth but kill bacteria

Changhong Zhao, Santosh Pandit, Yifeng Fu et al
RSC Advances. Vol. 6 (44), p. 38124-38134
Journal article
2016

Synthesis of highly conductive and mechanically strong silver coated silk bundles for flexible electronic applications

Nan Wang, Hafid Zehri, Lilei Ye et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceeding
2016

Thermal conductivity measurement of densified carbon nanotube bundles by pulsed photothermal reflectance technique

Majid Kabiri Samani, Shuangxi Sun, Yifeng Fu et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceeding
2016

The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging

Shirong Huang, Jie Bao, N. Wang et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p. Art no 7583272; Pages 889-892
Paper in proceeding
2016

Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging

Shirong Huang, N. Wang, Jie Bao et al
6th Electronic System-integration Technology Conference (ESTC 2016), p. Article no 7764696-
Paper in proceeding
2016

FREESTANDING CARBON NANOFIBERS/GRAPHENE COMPOSITE ELECTRODES FOR SUPERCAPACITORS

Volodymyr Kuzmenko, Nan Wang, Arun Bhaskar et al
The World Conference on Carbon - Carbon 2016, July 10-15, State College, PA, USA
Paper in proceeding
2016

Carbon nanotube growth on different underlayers for thermal interface material application

Yifeng Fu, Shuangxi Sun, Wei Mu et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceeding
2016

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability. Vol. 56, p. 129-135
Journal article
2016

Nanophotonics-based low-temperature PECVD epitaxial crystalline silicon solar cells

W. H. Chen, R. Cariou, M. Foldyna et al
Journal of Physics D: Applied Physics. Vol. 49 (12)
Journal article
2016

Application of two-dimensional layered hexagonal boron nitride in chip cooling

Jie Bao, Y. Zhang, S. Huang et al
Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering. Vol. 24 (1), p. 210-217
Journal article
2016

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Di Jiang, Nan Wang, Michael Edwards et al
Small. Vol. 12 (11), p. 1521-1526
Journal article
2016

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Shuangxi Sun, Wei Mu, Michael Edwards et al
Nanotechnology. Vol. 27 (33), p. Art no335705-
Journal article
2016

Finite element simulation of 2D-based materials as heat spreaders

Michael Edwards, Yong Zhang, Jie Bao et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceeding
2016

Graphene Fibres: Towards high mechanical, thermal and electrical properties state of art

Abdelhafid Zehri, Josef Hansson, Lilei Ye et al
IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016
Paper in proceeding
2016

Functionalization mediates heat transport in graphene nanoflakes

H. X. Han, Yong Zhang, Nan Wang et al
Nature Communications. Vol. 7
Journal article
2016

Enhanced cooling properties of radar antenna electronics using novel materials

Torbjörn Nilsson, Lilei Ye, Johan Liu
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceeding
2016

Review of Current Progress of Thermal Interface Materials for Electronics Thermal Management Applications

Josef Hansson, Carl Zandén, L. Ye et al
2016 Ieee 16th International Conference on Nanotechnology (Ieee-Nano), p. 371-374
Paper in proceeding
2016

Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review

Yifeng Fu, Wei Mu, Shuangxi Sun et al
2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764713-
Paper in proceeding
2016

2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS

Yong Zhang, S. Huang, Nan Wang et al
China Semiconductor Technology International Conference 2016, CSTIC 2016
Paper in proceeding
2016

Heat dissipation of a hybrid CNT/Graphene based heat spreader

Shuangxi Sun, Peng Su, Nan Wang et al
IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016
Paper in proceeding
2016

Thermal properties of TIM using CNTs forest in electronics packaging

Dongsheng Zhang, Jiawen Liu, Johan Liu et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016; Wuhan Optics Valley Kingdom Hotel Wuhan; China; 16 August 2016 through 19 August 2016, p. 1355-1359
Paper in proceeding
2016

Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

Wei Mu, Josef Hansson, Shuangxi Sun et al
Proceedings - Electronic Components and Technology Conference. Vol. 2016-August, p. 211-216
Paper in proceeding
2016

Mechanical characterization ofnanoparticleenhancedSn-3.0Ag-0.5Cu solder

Lilei Ye, Si Chen, Johan Liu
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceeding
2016

Experimental investigation of paraffin wax with graphene enhancement as thermal management materials for batteries

Yan Zhang, Wang Yue, Shaochun Zhang et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p. 1401-1405
Paper in proceeding
2016

Development of bulk-nanostructuring methods for BiSbTe Thermoelectric

ANDREAS NYLANDER, Nikolaos Logothetis, Johan Liu
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceeding
2016

Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications

Yong Zhang, Michael Edwards, Kabir Majid Samani et al
Carbon. Vol. 106, p. 195-201
Journal article
2016

A review of recent progress of thermal interface materials: from research to industrial applications

Josef Hansson, Liley Ye, Henric Rhedin et al
IMAPS Nordic Annual Conference 2016 Proceedings; Tonsberg; Norway; 5 - 7 June 2016
Paper in proceeding
2016

Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging

Jie Bao, Michael Edwards, Shirong Huang et al
Journal of Physics D: Applied Physics. Vol. 49 (July 2016), p. 265501-
Journal article
2016

Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing

Jie Bao, Kjell Jeppson, Michael Edwards et al
Electronic Materials Letters. Vol. 12 (1), p. 1-16
Review article
2016

Graphene-based heater

Yong Zhang, Michael Edwards, Yifeng Fu et al
IMAPS Nordic Annual Conference 2016; Tonsberg; Norway; 5-7 June 2016
Paper in proceeding
2016

Preventing Aging of Electrically Conductive Adhesives on Metal Substrate Using Graphene-Based Barrier

Hui Ye, Shirong Huang, Zhichao Yuan et al
China Semiconductor Technology International Conference 2016, CSTIC 2016
Paper in proceeding
2016

Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes

Wei Mu, Eun-Hye Kwak, Bingan Chen et al
Electronic Materials Letters. Vol. 12 (3), p. 329-337
Journal article
2016

Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives

Nan Wang, Nikolaos Logothetis, Wei Mu et al
2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764682-
Paper in proceeding
2016

Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders

Kjell Jeppson, Jie Bao, S. Huang et al
29th IEEE International Conference on Microelectronic Test Structures (ICMTS), Yokohama, Japan, Mar 28-31, 2016. Vol. 2016-May, p. 32-36
Paper in proceeding
2016

A brief overview of atomic layer deposition and etching in the semiconductor processing

G. Yuan, N. Wang, Shirong Huang et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p. 1365-1368
Paper in proceeding
2016

Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor

Wei Mu, Yifeng Fu, Michael Edwards et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceeding
2016

Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

Wei Mu, Yifeng Fu, Shuangxi Sun et al
Chemical Engineering Journal. Vol. 304 (15 November 2016), p. 106-114
Journal article
2015

Reliability of Graphene-based Films Used for High Power Electronics Packaging

Shirong Huang, Yong Zhang, Nan Wang et al
16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11-14 August 2015, p. 852-855
Paper in proceeding
2015

Flexible Multi-functionalized Carbon Nanotubes Based Hybrid Nanowires

Nan Wang, Di Jiang, Lilei Ye et al
Advanced Functional Materials
Journal article
2015

Unusual tensile behavior of fiber-reinforced indium matrix composite and its in-situ TEM straining observation

Xin Luo, Jianchao Peng, Carl Zandén et al
Acta Materialia
Journal article
2015

Liquid Phase Exfoliated Graphene for Thermal Management in Electronic Packaging

Yong Zhang, Yifeng Fu, Ye Lilei et al
Graphene Week in Manchester
Paper in proceeding
2015

Measurement of Dielectric Properties of Ultrafine BaTiO3 Using an Organic-Inorganic Composite Method

Jie Bao, W. W. Wang, S. T. Li et al
Journal of Electronic Materials. Vol. 44 (7), p. 2300-2307
Journal article
2015

The promising application of graphene oxide as coating materials in orthopedic implants: preparation, characterization and cell behavior

C. H. Zhao, X. Lu, Carl Zandén et al
Biomedical Materials (Bristol). Vol. 10 (1), p. Art.no. 015019-
Journal article
2015

Photonic nanostructures for advanced light trapping in thin crystalline silicon solar cells

C. Trompoukis, I. Abdo, R. Cariou et al
Physica Status Solidi (A) Applications and Materials Science. Vol. 212 (1), p. 140-155
Journal article
2015

Cooling hot spots by hexagonal boron nitride heat spreaders

Shuangxi Sun, Jie Bao, Wei Mu et al
Proceedings - Electronic Components and Technology Conference. Vol. 2015-July, p. 1658-1663
Paper in proceeding
2015

Flexible Multifunctionalized Carbon Nanotubes-Based Hybrid Nanowires

Nan Wang, Di Jiang, L. Ye et al
Advanced Functional Materials. Vol. 25 (26), p. 4135-4143
Journal article
2015

Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging

Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability
Journal article
2015

Vertically stacked carbon nanotube-based interconnects for through silicon via application

Di Jiang, Wei Mu, Si Chen et al
IEEE Electron Device Letters. Vol. 36 (5), p. 499-501
Journal article
2015

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Wei Mu, Shuangxi Sun, Di Jiang et al
Journal of Electronic Materials. Vol. 44 (8), p. 2898-2907
Journal article
2015

Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application

Yong Zhang, H. X. Han, Nan Wang et al
Advanced Functional Materials. Vol. 25 (28), p. 4430-4435
Journal article
2015

Chemically enhanced carbon nanotubes based Thermal Interface Materials

J. Daon, Shuangxi Sun, Di Jiang et al
THERMINIC 2015 - 21st International Workshop on Thermal Investigations of ICs and Systems 2015
Paper in proceeding
2015

Combination of positive charges and honeycomb pores to promote MC3T3-E1 cell behaviour

C. H. Zhao, C. J. Pan, Joakim Sandstedt et al
RSC Advances. Vol. 5 (53), p. 42276-42286
Journal article
2015

Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles

Si Chen, Xin Luo, Di Jiang et al
IEEE Transactions on Components, Packaging and Manufacturing Technology. Vol. 5 (8), p. 1186-1196
Journal article
2015

The promising application of graphene oxide coatings in orthopedic implants: preparation, characterization, cell behavior, and antimicrobial activity

Johan Liu, Changhong Zhao, Xiuzhen Lu et al
Journal of Biomedical Materials Research - Part A
Journal article
2015

Thermal elastomer composites for soft transducers

Seung Hee Jeong, Si Chen, Jinxing Huo et al
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015, p. 1873-1876
Paper in proceeding
2015

A High Performance Ag Alloyed Nano-scale n-type Bi2Te3 Based Thermoelectric Material

Si Chen, Nikolaos Logothetis, L. Ye et al
Materials Today: Proceedings. Vol. 2 (2), p. 610-619
Paper in proceeding
2015

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment

Seung Hee Jeong, Si Chen, Jinxing Huo et al
Scientific Reports. Vol. 5, p. 18257-
Journal article
2014

Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications

Xin Luo, Yong Zhang, Carl Zandén et al
Journal of Materials Science: Materials in Electronics. Vol. 25 (5), p. 2333-2338
Journal article
2014

Energy efficient nano metal polymer composites for cooling applications

Johan Liu, Carl Zandén, Lilei Ye
Chinese Conference on Functional Materials, Sept 25-27, 2014,
Paper in proceeding
2014

A solder joint structure with vertically aligned carbon nanofibres as reinforcements

S. Chen, Di Jiang, L. Ye et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962851-
Paper in proceeding
2014

A Novel Method for Three-Dimensional Culture of Central Nervous System Neurons.

Till B. Puschmann, Yolanda de Pablo, Carl Zandén et al
Tissue Engineering - Part C: Methods. Vol. 20 (6), p. 485-492
Journal article
2014

Carbon nanotube/solder hybrid structure for interconnect applications

Di Jiang, Shuangxi Sun, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962751-
Paper in proceeding
2014

Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application

J. Sitek, M. Koscielski, Y. Zhang et al
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014 (Art. no. 6922625), p. 151-154
Paper in proceeding
2014

Use of graphene-based films for hot spot cooling

Yong Zhang, Pengtu Zhang, Nan Wang et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962834-
Paper in proceeding
2014

CHEMICALLY VAPOR DEPOSITED CARBON NANOTUBES FOR VERTICAL ELECTRONICS INTERCONNECT IN PACKAGING APPLICATIONS

Johan Liu, Yifeng Fu, Di Jiang
Proceedings of the 12th international conference on Solid States and Integrated Circuits, ICSICT2014, p. 47-50
Paper in proceeding
2014

A carbon fiber solder matrix composite for thermal management of microelectronic devices

Murali Murugesan, Carl Zandén, Xin Luo et al
Journal of Materials Chemistry C. Vol. 2 (35), p. 7184-7187
Journal article
2014

Development and characterization of graphene-enhanced thermal conductive adhesives

Marcello Casa, S. Huang, Paolo Ciambelli et al
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014 (Art. no. 6922700), p. 480-483
Paper in proceeding
2014

Pre-Study of Graphene-Enhanced Cementitious Materials

Luping Tang, Johan Liu, Nan Wang et al
Report
2014

Stem cell responses to plasma surface modified electrospun polyurethane scaffolds.

Carl Zandén, Nina Hellström Erkenstam, Thomas Padel et al
Nanomedicine: Nanotechnology, Biology, and Medicine. Vol. 10 (5), p. 949-958
Journal article
2014

A new solder matrix nano polymer composite for thermal management and die attach applications

Johan Liu, Carl Zandén, Xin Luo et al
Composites Science and Technology. Vol. 94, p. 54-61
Journal article
2014

Enhanced Heat Spreader Based on Few-Layer Graphene Intercalated With Silane-Functionalization Molecules

Hao xue han, Y. A. Kosevich, Yong Zhang et al
IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014, p. 1-4
Paper in proceeding
2014

Reliability of carbon nanotube bumps for chip on glass application

X. Fan, X. Li, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962753-
Paper in proceeding
2014

Boron nitride nanofiber and indium composite based thermal interface materials for electronics heat dissipation applications

Xin Luo, Yong Zhang, Carl Zandén et al
Journal of Materials Science: Materials in Electronics. Vol. 25 (5), p. 2333-2338
Journal article
2014

Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats

J. Daon, Shuangxi Sun, Di Jiang et al
IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014
Paper in proceeding
2014

Study on the verification of IR and RTD methods applied in the thermal measurement of high power chips

Yan Zhang, C. He, Yong Zhang et al
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014, p. 1507-1511
Paper in proceeding
2014

HB-EGF affects astrocyte morphology, proliferation, differentiation, and the expression of intermediate filament proteins

Till B. Puschmann, Carl Zandén, Isabell Lebkuechner et al
Journal of Neurochemistry. Vol. 128 (6), p. 878-889
Journal article
2014

A new solder matrix nano polymer composite for thermal management applications

Carl Zandén, Xin Luo, L. Ye et al
Composites Science and Technology. Vol. 94, p. 54-61
Journal article
2014

Characterization of nano-enhanced interconnect materials for fine pitch assembly

Y. Zhang, J. Sitek, J. Fan et al
Soldering and Surface Mount Technology. Vol. 26 (1), p. 12-17
Journal article
2014

Carbon fiber solder matrix composite for thermal management of high power electronics

Murali Murugesan, Carl Zandén, Xin Luo et al
Journal of Materials Chemistry. Vol. 2 (35), p. 7184-7187
Journal article
2014

1. Thermal Characterization of Power Devices Using Graphene-based Film

Johan Liu, Pengtu Zhang, Nan Wang et al
Proceedings - Electronic Components and Technology Conference, p. 459 - 463
Paper in proceeding
2014

Experimental results versus numerical simulations of In/Cu intermetallic compounds growth

T. Fałat, B.T. Płatek, P.K. Matkowski et al
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, Marina Bay Sands, Singapore, 3-5 December 2014, p. 797-800
Paper in proceeding
2013

Experimental Study on the Mechanical Reliability of Carbon Nanotubes

Yan Zhang, Ling Wang, Jingyu Fan et al
Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT), p. 105-108
Paper in proceeding
2013

Experimental study of Electrical properties and stability of CNT bumps in high density interconnects

Yan Zhang, Yingjie Zhou, Jingyu Fan et al
Proceedings of the IEEE Conference on Nanotechnology, p. 1085-1088
Paper in proceeding
2013

Controlling the Density of CNTs by Different UnderlayerMaterials in PECVD Growth

Liang Xu, Di Jiang, Yifeng Fu et al
Proceedings of the 19th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems, September 25-27 2013, Berlin, Germany, IEEE / Therminic 2013, p. 248-252
Paper in proceeding
2013

Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD

Liang Xu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (3), p. 236-240
Journal article
2013

Bioactive 3D cell culture system minimizes cellular stress and maintains the in vivo-like morphological complexity of astroglial cells

Till B. Puschmann, Carl Zandén, Yolanda de Pablo et al
GLIA. Vol. 61 (3), p. 432-440
Journal article
2013

Investigation on interaction between indium based thermal interface material and copper and silicon substrates

Fatat Tomasz, Ptatek Barotsz, Matkowski Przemystaw et al
19th European Microelectronics and Packaging Conference, EMPC 2013; Grenoble; France; 9 September 2013 through 12 September 2013
Paper in proceeding
2013

Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application

Di Jiang, Teng Wang, Si Chen et al
Microelectronic Engineering. Vol. 103, p. Pages 177-180
Journal article
2013

Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration

Johan Liu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (1), p. 13-27
Review article
2013

Characterization for Graphene as Heat Spreader Using Thermal Imaging Method

Shirong Huang, Yong Zhang, Shuangxi Sun et al
Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT), p. 403-408
Paper in proceeding
2013

Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots

Zhaoli Gao, Yong Zhang, Y. F. Fu et al
Carbon. Vol. 61, p. 342-348
Journal article
2013

Reliability of Carbon Nanotube Bumps for Chip on Film Application

X. Li, Wei Mu, Di Jiang et al
Proceedings of the IEEE Conference on Nanotechnology, p. 845-848
Paper in proceeding
2013

Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology

Shirong Huang, Yong Zhang, Shuangxi Sun et al
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), p. 347-352
Paper in proceeding
2013

Graphene Heat Spreader for Thermal Management of Hot Spots

Zhaoli Gao, Yong Zhang, Yifeng Fu et al
Proceedings - Electronic Components and Technology Conference, p. 2075-2078
Paper in proceeding
2013

Surface oxide analysis of lead-free solder particles

Xin Luo, W. Du, X. Lu et al
Soldering and Surface Mount Technology. Vol. 25 (1), p. 39-44
Journal article
2013

Mechanical properties of a novel Nano-Thermal Interface Material

Wangli Peng, Carl Zandén, Lilei Ye et al
Proceedings of the IEEE Conference on Nanotechnology, p. 942-945
Paper in proceeding
2013

Molecular dynamics simulation of inertial trapping-induced atomic scale mass transport inside single walled carbon nanotubes

Z. L. Hu, Gustaf Mårtensson, Murali Murugesan et al
Applied Physics Letters. Vol. 102 (8)
Journal article
2013

Fabrication and Characterization of a Metal Matrix Polymer Fibre Composite for Thermal Interface Material Applications

Carl Zandén, Xin Luo, Lilei Ye et al
19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013; Berlin; Germany; 25 September 2013 through 27 September 2013, p. 286-292
Paper in proceeding
2013

Experimental measurements for mechanical and electrical conductive properties of CNT bundles

Y. Zhang, Yingjie Zhou, Jing-yu Fan et al
6th International Conference on Nonlinear Mechanics, ICNM 2013; Shanghai; China; 12 August 2013 through 15 August 2013, p. 454-457
Paper in proceeding
2012

Thermal performance characterization of nano thermal interface materials after power cycling

S. Sun, L. Xin, Carl Zandén et al
Proceedings - Electronic Components and Technology Conference, p. 1426-1430
Paper in proceeding
2012

Direct Chemical Vapor Deposition of Large-Area Carbon Thin Films on Gallium Nitride for Transparent Electrodes: A First Attempt

Jie Sun, M. T. Cole, S. Awais Ahmad et al
IEEE Transactions on Semiconductor Manufacturing. Vol. 25 (3), p. 494-501
Journal article
2012

Development and Characterization of Nano-Composite Solder

Johan Liu, Si Chen, Lilei Ye
Lead-Free Solders: Materials Reliability for Electronics, p. 161-177
Book chapter
2012

Selective growth of double-walled carbon nanotubes on gold films

Yifeng Fu, Si Chen, Johan Bielecki et al
Materials Letters. Vol. 72, p. 78-80
Journal article
2012

Characterization of CNT Enhanced Conductive Adhesives in Terms of Thermal Conductivity

Zhfei Zhang, Lilei Ye, Akos Kukovecz et al
ECS Transactions. Vol. 44 (1), p. 1011-1017
Paper in proceeding
2012

A method to integrate patterned electrospun fibers with microfluidic systems to generate complex microenvironments for cell culture applications

Patric Wallin, Carl Zandén, Björn Carlberg et al
Biomicrofluidics. Vol. 6 (2)
Journal article
2012

Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler

Yan Zhang, Huifeng Lv, Jing-yu Fan et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 1573-1577
Paper in proceeding
2012

Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate

Di Jiang, Yifeng Fu, Yan Zhang et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, Budapest, 25-27 September 2012, p. 213-216
Paper in proceeding
2012

Microstructural evolution in electrically conductive adhesives containing Ag micro-fillers during curing and annealing

Masahiro Inoue, Hiroaki Muta, Shinsuke Yamanaka et al
CD Proceedings of the 4th Electronics System Integration Technologies Conference (ESTC 2012), p. 27-
Paper in proceeding
2012

Effect of microstructural evolution in electrically conductive adhesives containing Ag micro-fillers

Masahiro Inoue, Hiroaki Muta, Johan Liu
Proceedings of the ICEP-IAAC Conference, p. 676-680
Paper in proceeding
2012

Thick film patterning by lift-off process using double-coated single photoresists

Yifeng Fu, L. Ye, Johan Liu
Materials Letters. Vol. 76, p. 117-119
Journal article
2012

Surface characterisation of oxygen plasma treated electrospun polyurethane fibres and their interaction with red blood cells

Carl Zandén, Marina Voinova, Julie Gold et al
European Polymer Journal. Vol. 48 (3), p. 472-482
Journal article
2012

Formation of three-dimensional carbon nanotube structures by controllable vapor densification

Teng Wang, Di Jiang, Si Chen et al
Materials Letters. Vol. 78, p. 184-187
Journal article
2012

Patterned electrospun microfibers integrated in a microfluidic system to study cells in complex microenvironments

Patric Wallin, Carl Zandén, Björn Carlberg et al
eCM Journal. Vol. 23 (Supplement 5), p. 65-
Conference poster
2012

Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology

Di Jiang, Teng Wang, Lilei Ye et al
ECS Transactions. Vol. 44 (1), p. 683-692
Paper in proceeding
2012

TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder

Manman Rui, Xiuzhen Lu, Si Chen et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 203-207
Paper in proceeding
2012

Polymer-metal nanofibrous composite for thermal management of microsystems

Björn Carlberg, L. Ye, Johan Liu
Materials Letters. Vol. 75, p. 229-232
Journal article
2012

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Yifeng Fu, N. Nabiollahi, Teng Wang et al
Nanotechnology. Vol. 23 (4)
Journal article
2012

Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material

Shuangxi Sun, Wei Mu, Yan Zhang et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging (Article number 6474593), p. 171-176
Paper in proceeding
2012

Environmental reliability of nano-structured polymer-metal composite thermal interface material

Xiuzhen Lu, Mengke Zhuang, Lei Zhang et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 1326-1328
Paper in proceeding
2012

Reliability investigation of nano-enhanced thermal conductive adhesives

Nan Wang, Murali Murugesan, L. Ye et al
Proceedings of the IEEE Conference on Nanotechnology
Paper in proceeding
2012

Low Partial Pressure Chemical Vapor Deposition of Graphene on Copper

Jie Sun, Niclas Lindvall, Matthew Cole et al
IEEE Transactions on Nanotechnology. Vol. 11 (2), p. 255-260
Journal article
2012

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

Kjell Jeppson, Teng Wang, Di Jiang et al
IEEE Electron Device Letters. Vol. 33 (3), p. 420-422
Journal article
2012

Detecting single molecules inside a carbon nanotube to control molecular sequences using inertia trapping phenomenon

Zhili Hu, Gustaf Mårtensson, Murali Murugesan et al
Applied Physics Letters. Vol. 101 (13), p. Art. no. 133105-
Journal article
2012

Electrical Interconnects Made of Carbon Nanotubes: Applications in 3D Chip Stacking

Di Jiang, Lilei Ye, Kjell Jeppson et al
IMAPS Nordic Annual Conference Proceedings 2012, Helsingor, 2 - 4 September 2012, p. 150-159
Paper in proceeding
2012

Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene

Yifeng Fu, Björn Carlberg, Niklas Lindahl et al
Advanced Materials. Vol. 24 (12), p. 1576-1581
Journal article
2012

Graphene Heat Spreader for Thermal Management of Hot Spots in Electronic Packaging

Zhaoli Gao, Yong Zhang, Yifeng Fu et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, p. 217-220
Paper in proceeding
2012

Organic Thin-Film Transistors with Anodized Gate Dielectric Patterned by Self-Aligned Embossing on Flexible Substrates

Yiheng Qin, D. H. Turkenburg, I. Barbu et al
Advanced Functional Materials. Vol. 22 (6), p. 1209-1214
Journal article
2012

A New Thermally Conductive Thermoplastic Die Attach Film

Y. Duan, Lilei Ye, H. Cui et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 212-215
Paper in proceeding
2012

Controllable chemical vapor deposition of large area uniform nanocrystalline graphene directly on silicon dioxide

Jie Sun, Niclas Lindvall, M. T. Cole et al
Journal of Applied Physics. Vol. 111 (4)
Journal article
2011

Molecular dynamics simulation for the bonding energy of metal-SWNT interface

Y. Zhang, Zhili Hu, L. Ye et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 506-509
Paper in proceeding
2011

Numerical study of thermal transfer between adhesive and CNTs

Yan Zhang, Shun Wang, Zhili Hu et al
Proceedings of the International Conference on Electronics Packaging (ICEP), Japan, Nara 2011 April 13-15, p. 133 - 137
Paper in proceeding
2011

Reliability of Microtechnology – Interconnects, Devices and Systems

Johan Liu, Olli Salmela, Jussi Särkkä et al
Book
2011

Electrical and thermal conductivities of thermally conductive adhesives composed of a multi-functional epoxy resin containing Ag-plated Cu fillers

M. Inoue, H. Muta, S. Yamanaka et al
Proceedings of the International Conference on Electronics Packaging (ICEP), Japan, Nara 2011 April 13-15, p. 941 - 946
Paper in proceeding
2011

Numerical investigation on thermal properties of micro-pin-fin cooler

Yan Zhang, Yangmin Liu, Jing-yu Fan et al
Journal of Shanghai University. Vol. 15 (4), p. 273 - 278
Journal article
2011

Numerical study of the interface heat transfer characteristics of micro-cooler with CNT structures

Yan Zhang, Shun Wang, Shiwei Ma et al
CD proceedings of IMAPS Poland 2011
Paper in proceeding
2011

Benchmarking assembly materials for vertically aligned carbon nanotubes into microsystems

Teng Wang, Nabi Nabiollahi, Kjell Jeppson et al
CD Proceedings of the Annual World Conference on Carbon, ECUST, Shanghai, China, July 25-29, 2011, Paper no: 740
Paper in proceeding
2011

Influence of substrate on electrical conductivity of isotropic conductive adhesive

Zhili Hu, Wenhui Du, Cong Yue et al
Proceedings of the IEEE International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011, p. 330 - 335
Paper in proceeding
2011

Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration

Teng Wang, Kjell Jeppson, L. Ye et al
Small. Vol. 7 (16), p. 2313-2317
Journal article
2011

Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers

D. Wang, J. He, X. Wang et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 560-563
Paper in proceeding
2011

Cell road - biomaterials for neural stem cell migration

Nina Hellström Erkenstam, Carl Zandén, R. Mottaleb et al
European Cells and Materials. Vol. 21 (SUPPL.1), p. 6-
Paper in proceeding
2011

Study on the reliability of nano-structured polymer-metal composite for thermal interface material

Lei Zhang, Xin Luo, Xiuzhen Lu et al
ECS Transactions. Vol. 34 (1), p. 991- 995
Paper in proceeding
2011

The effect of functionalized silver on properties of conductive adhesives

Q. Fan, H. Cui, D. Li et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 423-425
Paper in proceeding
2011

Printed monopole antenna with extremely wide bandwidth on liquid crystal polymer substrates

X. Zhang, X. Yan, Johan Liu et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 1157-1159
Paper in proceeding
2011

Study on the reliability of fast curing isotropic conductive adhesive

Wenhui Du, Huiwang Cui, Si Chen et al
ECS Transactions. Vol. 34 (1), p. 805 - 810
Paper in proceeding
2011

Investigation of accelerated surface oxidation of Sn-3,5Ag-0,5Cu solder particles by TEM and STEM

Xin Luo, Wenhui Du, Xiuzhen Lu et al
Proceedings of the IEEE 2011 International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011, p. 73 - 79
Paper in proceeding
2011

Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures

L. Zhang, X. Lu, Xin Luo et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 426-429
Paper in proceeding
2011

Characterization of surface oxide of lead-free solder particle by TEM and STEM

Xin Luo, Wenhui Du, Xiuzhen Lu et al
ICEP, Japan, Nara 2011 April 13-15
Paper in proceeding
2011

Study into high temperature reliability of isotropic conductive adhesive

W. Du, H. Cui, S. Chen et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 1053-1055
Paper in proceeding
2011

The effect of functionalized silver on rheological and electrical properties of conductive adhesives

Q. Fan, H. Cui, C. Fu et al
ECS Transactions. Vol. 34 (1), p. 811-816
Paper in proceeding
2011

Molecular Gun Composed of Carbon Nanotube

Zhili Hu, X. Guo, Johan Liu
Journal of Computational and Theoretical Nanoscience. Vol. 8 (9), p. 1716-1719
Journal article
2011

Comparisons of nano-additives influence on properties of the bi-modal solder pastes for special applications

J. Sitek, Y. Zhang, S. Ma et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 183-187
Paper in proceeding
2011

A highly conductive bimodal isotropic conductive adhesive and its reliability

Dongsheng Li, Huiwang Cui, Si Chen et al
ECS Transactions. Vol. 34 (1), p. 583 - 588
Paper in proceeding
2011

Surface-Confined Synthesis of Silver Nanoparticle Composite Coating on Electrospun Polyimide Nanofibers

Björn Carlberg, L. Ye, Johan Liu
Small. Vol. 7 (21), p. 3057-3066
Journal article
2011

Study on the bimodal filler influence on the effective thermal conductivity of thermal conductive adhesive

Y. Zhang, Jing-yu Fan, C. Yue et al
Microsystem Technologies. Vol. 17 (1), p. 93-99
Journal article
2011

Study into the application of single-wall carbon nanotubes in isotropic conductive adhesives

D. Li, H. Cui, Q. Fan et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 430-435
Paper in proceeding
2011

Electrospun polyurethane-based elastomer fibers for biomedical applications

Carl Zandén, Marina Voinova, C. T. Wang et al
European Cells and Materials. Vol. 21 (SUPPL.1), p. 36-
Paper in proceeding
2011

Development and characterisation of nanofiber films with high adhesion

X. Tang, H. Cui, Xiuzhen Lu et al
Proceedings - Electronic Components and Technology Conference, p. 673-677
Paper in proceeding
2011

Surface properties of electrospun polyurethane-based elastomer networks for biomedical applications

Carl Zandén, Marina Voinova, Chi-Ting Wang et al
Poster at the Second International Conference on Multifunctional, Hybrid and Nanomaterials, Strasbourg, 6-10 March, 2011
Conference poster
2010

Anisotropic Thermal Conductivity in Electrically Conductive Adhesives with Single- and Bimodal Filler-size Distributions Containing Ag Flakes and Micro-particles

Masahiro Inoue, Hiroaki Muta, Shinsuke Yamanaka et al
3rd Electronics System Integration Technology Conference, ESTC 2010; Berlin; Germany; 13 September 2010 through 16 September 2010
Paper in proceeding
2010

Direct Photolithographic Patterning of Electrospun Films for Defined Nanofibrillar Microarchitectures

Björn Carlberg, Teng Wang, Johan Liu
Langmuir. Vol. 26 (4), p. 2235-2239
Journal article
2010

3D computational fluid dynamics simulation of carbon nanotube based microchannel on-chip cooler

N. Nabiollahi, Yifeng Fu, Johan Liu
IMAPS Nordic Annual Conference 2010, Proceedings, p. 44-47
Paper in proceeding
2010

MDS study on the adhesive heat transfer in micro-channel cooler

Shun Wang, Y. Zhang, Zhili Hu et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5583859), p. 630-633
Paper in proceeding
2010

A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles

H. Lai, X. Lu, Si Chen et al
2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 49-53
Other conference contribution
2010

Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film

Xia Zhang, Teng Wang, Pär Berggren et al
ECS Transactions. Vol. 27 (1), p. 825-830
Paper in proceeding
2010

Numerical investigation on the thermal properties of the micro-cooler

Yangming Liu, Y. Zhang, S. Wang et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5583917), p. 634-638
Paper in proceeding
2010

Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly

Yifeng Fu, Yiheng Qin, Teng Wang et al
Advanced Materials. Vol. 22 (44), p. 5039-5042
Journal article
2010

Effects of BN and SiC nanoparticles on properties of conductive adhesive

Huaxiang Lai, Xiuzhen Lu, H. Cui et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582434), p. 235-239
Paper in proceeding
2010

Polymer nanofiber based continuous metal phase composite for thermal management applications

Björn Carlberg, Johan Liu, L. Ye
3rd Electronics System Integration Technology Conference, ESTC 2010; Berlin; Germany; 13 September 2010 through 16 September 2010, p. Art. no. 5642950-
Paper in proceeding
2010

MDS Investigation on the Heat Transfer Properties of CNT Micro-Channel Cooler

Yan Zhang, Shun Wang, Jingyu Fan et al
IEEE CPMT Electronics System Integration Conference (ESTC)
Other conference contribution
2010

Thermal Conductivity in the Vertical Direction of Heat-Resistant Epoxy Based Conductive Adhesives with Multimodal Filler Size Distributions

Masahiro Inoue, H Muta, S Yamanaka et al
IEEE CPMT Electronics System Integration Conference (ESTC)
Other conference contribution
2010

Reliability characterisation of bi-modal high temperature stable Isotropic Conductive Adhesives

W. Tao, S. Chen, X. Liu et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xian, 16-19 August 2010 (Article number 5582437), p. 225-228
Paper in proceeding
2010

A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

S. Chen, L. L. Zhang, Johan Liu et al
Materials Transactions. Vol. 51 (10), p. 1720-1726
Journal article
2010

Interpenetrating phase polymer-metal composite for thermal interface material applications

Björn Carlberg, Johan Liu
IEEE CPMT Electronics System Integration Conference (ESTC)
Other conference contribution
2010

Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach

C. Yue, Y. Zhang, Z. L. Hu et al
Microsystem Technologies. Vol. 16 (4), p. 633-639
Journal article
2010

New fast curing isotropic conductive adhesive for electronic packaging application

Wenhui Du, C. Fu, Si Chen et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582446), p. 199-201
Paper in proceeding
2010

Optimization of stiffness for isotropic conductive adhesives

C. Fu, Si Chen, Pär Berggren et al
2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 29-33
Other conference contribution
2010

Application of through silicon via technology for in situ temperature monitoring on thermal interfaces

Yifeng Fu, Teng Wang, Ove Jonsson et al
Journal of Micromechanics and Microengineering. Vol. 20 (2), p. id 025027 (5 pp)-
Journal article
2010

Design of Printed Monopole Antennas on Liquid Crystal Polymer Substrates

Xia Zhang, X. Yan, Johan Liu et al
Journal of Infrared, Millimeter, and Terahertz Waves. Vol. 31 (4), p. 469-480
Journal article
2010

Nanofiber based composites for thermal management

Johan Liu, Björn Carlberg
International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference
Other conference contribution
2010

Dry densification of carbon nanotube bundles

Teng Wang, Kjell Jeppson, Johan Liu
Carbon. Vol. 48 (13), p. 3795-3801
Journal article
2010

Future Emerging Packaging Technology Using Carbon Nanotubes

Johan Liu, Yiheng Qin, Carl Zandén et al
ELTE 2010 & 34th IMAPS-CPMT
Other conference contribution
2010

Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill

Xingrui Chen, Teng Wang, Joachim Nurnus et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582779), p. 1250-1254
Paper in proceeding
2010

Reliability of isotropic conductive adhesive joints

Lilei Ye, Johan Liu
Electronics Environment
Magazine article
2010

Use of carbon nanotubes in potential electronics packaging applications

Johan Liu, Teng Wang, Yifeng Fu et al
2010 10th IEEE Conference on Nanotechnology, NANO 2010, p. 160-166
Other conference contribution
2010

The effect of modulus on the performance of thermal conductive adhesives

Zhili Hu, Cong Yue, X. Guo et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582884), p. 648-651
Paper in proceeding
2010

Reliability study for high temperature stable conductive adhesives

W. Tao, Si Chen, Pär Berggren et al
2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 74-77
Other conference contribution
2009

Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging

Li Xu, Xiuzhen Lu, Johan Liu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1051-1053
Paper in proceeding
2009

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Yi Fan, Xiaolong Zhong, Johan Liu et al
Microsystem Technologies. Vol. 15 (3), p. 375-381
Journal article
2009

Design of 50-70 GHz Planar Wideband Bandpass Filter on Liquid Crystal Polymer Substrate

Xia Zhang, Dan Kuylenstierna, Johan Liu et al
Journal of Infrared, Millimeter, and Terahertz Waves. Vol. 30 (2), p. 183-189
Journal article
2009

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Xiangdong Zou, Yulai Gao, Qijie Zhai et al
Journal of Electronic Materials. Vol. 38 (2), p. 351-355
Journal article
2009

Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect Based on Micropolar Theory and Cohesive Zone Model

Yan Zhang, Jinyu Fan, Johan Liu
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 160-163
Paper in proceeding
2009

Study of the filler effect of the effective thermal conductivity of thermal conductive adhesive

Yan Zhang, Cong Yue, Johan Liu et al
ICEP
Paper in proceeding
2009

Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells.

Björn Carlberg, Mathilda Zetterström Axell, Ulf Nannmark et al
Biomedical Materials (Bristol). Vol. 4 (4), p. 45004-
Journal article
2009

Modeling of Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications

Zhili Hu, Björn Carlberg, Cong Yue et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 481-484
Paper in proceeding
2009

Through silicon vias filled with planarized carbon nanotube bundles

Teng Wang, Kjell Jeppson, Niklas Olofsson et al
Nanotechnology. Vol. 20 (48), p. 485203-
Journal article
2009

Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA

Cong Yue, Yan Zhang, Zhili Hu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 851-855
Paper in proceeding
2009

FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives

Nabi Nabiollahi, Johan Liu, Zhili Hu et al
2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009; Genoa; Italy; 26 July 2009 through 30 July 2009, p. 422-425
Paper in proceeding
2009

Stem Cell Growth and Migration on Nanofibrous Polymer Scaffolds and Micro-Fluidic Channels on Silicon-Chip

Johan Liu, Hans-Georg Kuhn, Jing Yujia et al
Proceedings of the 2009 Electronic Components and Technology Conference, p. 1080-1085
Paper in proceeding
2009

Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages

Cristina Andersson, B. Vandevelde, C. Noritake et al
Soldering and Surface Mount Technology. Vol. 21 (2), p. 28-38
Journal article
2009

Evaluation of new and improved thermal interface materials and surface roughness effect on thermal interface resistance

Carl Zandén, Björn Carlberg, Johan Liu
Proceedings of the The International 3rd Swedish Production Symposium (SPS), p. 88-96
Paper in proceeding
2009

Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy

Yulai Gao, Changdong Zou, Bin Yang et al
Journal of Alloys and Compounds. Vol. 484 (1-2), p. 777-781
Journal article
2009

Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging

Xiuzhen Lu, Li Xu, Huaxiang Lai et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1051-1053
Paper in proceeding
2009

Carbon Nanotubes as Cooling Fins in Microelectronic Systems

Yifeng Fu, Teng Wang, Johan Liu et al
Proceedings of the 9th Nanotechnology Conference, p. 10-14
Paper in proceeding
2009

Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg

Yifeng Fu, Teng Wang, Johan Liu
Proceedings of the Annual Nordic Conference, p. 35-38
Paper in proceeding
2009

Coffin-Mansson equation of Sn-4.0Ag-0.5Cu solder joint

S. Chen, Peng Sun, Xi-cheng Wei et al
Soldering and Surface Mount Technology. Vol. 21 (2), p. 48-54
Journal article
2009

Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles

C.-D. Zou, Y.-L. Gao, B. Yang et al
Soldering and Surface Mount Technology. Vol. 21 (2), p. 9-13
Journal article
2009

The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder

Si Chen, Zhaonian Cheng, Johan Liu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1240-1245
Paper in proceeding
2009

Polymer-metal nano-composite films for thermal management

Björn Carlberg, Teng Wang, Johan Liu et al
Microelectronics International. Vol. 26 (2), p. 28-36
Journal article
2009

Development of a test platform for thermal characterization using through-silicon-via technology

Yifeng Fu, Teng Wang, Johan Liu
IMAPS Nordic Annual Conference 2009; Tonsberg; Norway; 13 September 2009 through 15 September 2009, p. 35-38
Paper in proceeding
2009

A Compact Ultra-Wideband Bandpass Filter with Ultra-Fine Conductor Trace based on Liquid Crystal Polymer Substrates

Xia Zhang, Johan Liu, Camilla kärnfeldt et al
Circuit World. Vol. 35 (1), p. 16-21
Journal article
2009

3D chip stacking using planarized carbon nanotubes as through-silicon-vias

Kjell Jeppson, Teng Wang, Johan Liu et al
Swedish System on Chip Conference
Other conference contribution
2008

Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection

Yan Zhang, Johan Liu, Ragnar Larsson et al
Journal of Adhesion Science and Technology. Vol. 22 (14), p. 1717-1731
Journal article
2008

Nanostructured Polymer-metal Composite for Thermal Interface Material Applications

Björn Carlberg, Teng Wang, Yifeng Fu et al
proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC), p. 191-197
Paper in proceeding
2008

Vibration and Bucling of a carbon nanotbue inserted with a carbon chain

Zhili Hu, Ximing Guo, Johan Liu
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. D1-09
Paper in proceeding
2008

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Yi Fan, Xiaolong Zhong, Johan Liu et al
Microsystem Technologies
Journal article
2008

Development of Nanomaterials and Devices for Electronics Cooling and Interconnect

Johan Liu, Teng Wang, Björn Carlberg et al
Proceedings of the Ecology in Electronics Conference in “Progress in Eco-Electronics”, as Monongraphies of Tele, Radio Institute, p. 33-47
Book chapter
2008

A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers

Yi Fan, Yifeng Fu, Yan Zhang et al
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008
Paper in proceeding
2008

Effect of Encapsulation on OLED Characteristics with Anisotropic Conductive Adhesive

Yan Zhang, Måns Andreasson, Johan Liu
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 613-616
Paper in proceeding
2008

Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application

Li Xu, Cong Yue, Johan Liu et al
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008
Paper in proceeding
2008

Vibration and buckling of a carbon nanotube inserted with a carbon chain

Zili Hu, X. Guo, Johan Liu
Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
Paper in proceeding
2008

Heat transfer simulation of nanofluids in microfluidic channels

Hongjun Liu, X Wang, Minliang Zhang et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging
Paper in proceeding
2008

Preparation of Polymer-metal Nanocomposite Films and Performance Evaluation as Thermal Interface Material

Björn Carlberg, Teng Wang, Yifeng Fu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1395-1400
Paper in proceeding
2008

Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder alloy for electronics applications

Cristina Andersson, Peng Sun, Johan Liu
Journal of Alloys and Compounds. Vol. 457 (1/2), p. 97-105
Journal article
2008

Preparation of polysulfoneamide electrospinning nanofibers

Liu Li, Ying Shi, Qinghua Jiao et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging
Paper in proceeding
2008

A METHOD STUDY OF CFD SIMULATION FOR CNT MICROCOOLER

Xiao-long Zhong, Yan Zhang, Johan Liu et al
Proceedings of the Ecology Electronics Conference in “Progress in Eco-Electronics”
Book chapter
2008

Overview of Carbon Nanotubes as Off-Chip Interconnects

Xia Zhang, Teng Wang, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference
Paper in proceeding
2008

Understanding BGA interconnect interface behaviour using Micropolar theory

Yan Zhang, Ragnar Larsson, Johan Liu
Journal of Electronics Packaging
Journal article
2008

A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers

Yi Fan, Yifeng Fu, Yan Zhang et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. D1-05
Paper in proceeding
2008

Recent Progress of Thermal Interface Materials

Johan Liu, Teng Wang, Björn Carlberg et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 351-358
Paper in proceeding
2008

Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant

Yi Fan, Yifeng Fu, Teng Wang et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1391-1394
Paper in proceeding
2008

Development of High Temperature Stable Isotropic Conductive Adhesives

Zhikun Zhang, Sijia Jiang, Johan Liu et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. E3-04
Paper in proceeding
2008

Effect of different temperature cycle profiles on the crack initiation and propagation of Sn3,5Ag wave soldered joints

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
Microelectronics Reliability. Vol. 47, p. 266-272
Journal article
2008

Micropolar Cohesive Zone Model for Delamination Failure in Microsystem Interconnects

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Proceedings of the 22nd International Congress of Theoretical and Applied Mechanics
Paper in proceeding
2008

Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Thermal Interface Material

Cong Yue, Yan Zhang, Johan Liu et al
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008, p. C1-10
Paper in proceeding
2008

Recent Progress of Thermal Interface Material Research – An Overview

Johan Liu, Bruno Michel, Marta Rencz et al
Therminic 2008, p. 156-162
Paper in proceeding
2008

Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load

Yan Zhang, Johan Liu, Ragnar Larsson
Journal of Electronic Packaging, Transactions of the ASME. Vol. 130 (2), p. 0210101-0210107
Journal article
2008

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Xiangdong Zou, Yulai Gao, Qijie Zhai et al
Journal of Electronics Materials
Journal article
2008

A Compact V-band Planar Wideband Bandpass Filter Based on Liquid Crystal Polymer Substrates

Xia Zhang, Dan Kuylenstierna, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 163-167
Paper in proceeding
2008

The Comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu) joints during isothermal aging and their tensile strengths

Guo-Kui Ju, Xi-cheng Wei, Peng Sun et al
Soldering and Surface Mount Technology. Vol. 20 (3), p. 4-10
Journal article
2008

Thermal cycling aging effect on the shear strength, microstructure, IMC and initiation and propagation of surface mounted Sn-3.8Ag-0.7Cu and wave soldered Sn-3.5Ag ceramic chip components

Cristina Andersson, Per-Erik Tegehall, Dag R. Andersson et al
IEEE Transactions on Components and Packaging Technologies. Vol. 31 (2), p. 331-344
Journal article
2008

The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish

Lili Zhang, Cristina Andersson, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1295-1300
Paper in proceeding
2008

Millimeter-wave ultra-wideband bandpass filter based on LCP substrates for automotive radar systems

Xia Zhang, Johan Liu, Peng Cai et al
Journal of Microwave and Optical Technology Letters, p. 2276-2280
Journal article
2008

RF Performance of Flip Chip ACA Joints for CPW Transmission Lines

Xu Wang, Xia Zhang, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 501-506
Paper in proceeding
2008

Recent Advances in the Synthesis of Lead-free Solder Nanoparticle

Cristina Andersson, Changdong Zou, Bin Yang et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 915-922
Paper in proceeding
2008

Recent Development of Nano-solder Paste for Electronics Interconnect Applications

Johan Liu, Cristina Andersson, Yulai Gao et al
Proceedings of the IEEE 10th Electronics Packaging Technology Conference
Paper in proceeding
2008

Electrical and Thermal Properties of Electrically Conductive Adhesives Using A Heat-resistant Epoxy Binder

Masahiro Inoue, Johan Liu
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1147-1152
Paper in proceeding
2008

Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles

Lili Zhang, Wenkai Tao, Johan Liu et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. E1-1 0
Paper in proceeding
2008

Experimental investigation and micropolar modelling of the anisotropic conductive adhesive flip-chip interconnection

Y. Zhang, Johan Liu, Ragnar Larsson et al
Electrically Conductive Adhesives, p. 411-425
Book chapter
2008

Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging

Johan Liu, Yifeng Fu, Teng Wang
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. E3-01
Paper in proceeding
2008

Effect of Corrosion on the Low Cycle Fatigue Behaviour of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints

Cristina Andersson, Johan Liu
International Journal of Fatigue, p. 917-930
Journal article
2007

Interface modelling microsystem interconnections using micropolar theory and discontinuous approximation

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Computers & Structures. Vol. 85 (19-20), p. 1500-1513
Journal article
2007

A method for determining elastic properties of micron-sized polymer particles by using flat punch test

Johan Liu
Computational Materials Science. Vol. 39 (2), p. 305-314
Journal article
2007

Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive

Teng Wang, Björn Carlberg, Martin Jonsson et al
Applied Physics Letters. Vol. 91 (9), p. 093123-
Journal article
2007

PBGA Interconnect Behavior under Thermal Effects

Yan Zhang, Johan Liu, Ragnar Larsson
Proceedings of International Conference on Electronics Packaging (ICEP2007), Tokyo, Japan, p. 329-334
Paper in proceeding
2007

Advances in Europe - China Green Electronics Collaboration

Johan Liu
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceeding
2007

Tensile fracture behaviour of Sn-3.0Ag-0.5Cu solder joints on copper

Johan Liu, Peng Sun
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceeding
2007

Electrically Conductive Adhesives

James E. Morris, Johan Liu
Micro- and Opto-Electronic Materials and Structures – Physics, Mechanics, Design, Reliability, Packaging, Volume II: Physics Design – Reliability and Packaging, p. 527-570
Book chapter
2007

Realization of A Ultra Wideband BPF based on LCP Substrate for Wireless Application

Xia Zhang, Herbert Zirath, Johan Liu
International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceeding
2007

Encapsulation of OLED device by Using Anisotropic Conductive Adhesive

Yan Zhang, Måns Andreasson, Hua Zhou et al
Proceedings of 2007 International Symposium on High Density Packaging and Microsystem Integration, p. 314-317
Paper in proceeding
2007

Reliability characterisation of lead free solder joints using three point bending test

Johan Liu
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceeding
2007

Second order multi-scale micropolar model for microsystem interconnections

Yan Zhang, Johan Liu, Jing-yu Fan et al
Proceedings of the Fifth International Conference on Nonlinear Mechanics (ICNM-V), p. 1434-1439
Paper in proceeding
2007

Reliability aspects of electronics packaging technology using anisotropic conductive adhesives

Johan Liu, Liqiang Cao
Journal of Shanghai University (English Edition). Vol. 11, p. 1-16
Journal article
2007

Effect of Corrosion on the Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints

Cristina Andersson, Johan Liu
International Journal of Fatigue
Journal article
2007

A Study of Effects of Different Coolants on On-chip Cooling with Carbon Nanotube Micro-fin Architectures by Using Computational Fluid Dynamics Simulation

Johan Liu, Yan Zhang, Teng Wang
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceeding
2007

A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

Johan Liu, Yan Zhang, Teng Wang
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceeding
2007

Effect of different temperature cycling profiles on the crack initiation and propagation and of Sn-3.5Ag wave soldered joints

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
Microelectronics and Reliability. Vol. 47 (2-3), p. 266-272
Journal article
2007

Development and Characterization of Carbon Nanotube-based Bumps for Ultra Fine Pitch Flip Chip Interconnection

Teng Wang, Björn Carlberg, Johan Liu
Proceedings of the 16th European Microelectronics and Packaging Conference & Exhibition: EMPC2007
Paper in proceeding
2007

Manufacturing and Characterisation of Silver nano particles based Nano Thermal Interface material

Johan Liu
proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC)
Paper in proceeding
2007

Investigation of the Effect of Processing Variables on the Structure and Morphology of Nano-TIM

Johan Liu
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceeding
2007

An aging study of intermetallic compounds formation in Sn-0.4Co-0.7Cu

Johan Liu
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceeding
2007

Preparation Techniques and Characterization for Sn-3.0Ag-0.5Cu Nanopowders

Johan Liu
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceeding
2007

Investigation of Dielectric Strength of Electrospun Nanofiber Based Thermal Interface Material

Johan Liu, Björn Carlberg
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceeding
2007

Process and pad design optimization for 01005 passive component surface mount assembly

Johan Liu
Soldering and Surface Mount Technology. Vol. 19, p. 34-44
Journal article
2007

Electrospun Nano-fibrous Polymer Films with Barium Titanate Nanoparticles for Embedded Capacitor Applications

Björn Carlberg, Jonas Norberg, Johan Liu
proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC)
Paper in proceeding
2006

Integrated inductors on liquid crystal polymer substrate for RF applications

Gang Zou, Hans Gronqvist, Johan Liu
Circuit World. Vol. 32 (1), p. pp41-44
Journal article
2006

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Chen, Zonghe Lai, Zhaonian Cheng et al
Journal of Electronic Packaging, Transactions of the ASME. Vol. 128 (3), p. 177-183
Journal article
2006

New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications

Wen Xuan Wang, Xiuzhen Lu, Johan Liu et al
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), p. 631-635
Paper in proceeding
2006

High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization

Peng Sun, Cristina Andersson, Xi-cheng Wei et al
Journal of Alloys and Compounds. Vol. 425 (1-2), p. 191-199
Journal article
2006

Interface Modelling of ACA Interconnects Using Micropolar Theory

Yan Zhang, Ragnar Larsson, Johan Liu
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05; Shanghai; China; 27 June 2005 through 29 June 2005, p. Art. no. 4017426-
Paper in proceeding
2006

Assessment of Lead-Free Inert Gas Soldering Using a Novel Reflow Technology

Oyebode Ayoade, Andersson Cristina, Hjertkvist Tobias et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 428-437
Paper in proceeding
2006

Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application

Qi Zhang, Zonghe Lai, Urban Jevelstam et al
Proceedings of the International Conference on Electronic Packaging (ICEP 2006), p. 83-89
Paper in proceeding
2006

Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Si Chen, Peng Sun, Johan Liu et al
Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, p. 368-373
Paper in proceeding
2006

RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints

Xu Wang, Zhaonian Cheng, Johan Liu
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 123-127
Paper in proceeding
2006

Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection

Teng Wang, Martin Jönsson, Eleanor E B Campbell et al
1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. Vol. 2, p. 892-895
Paper in proceeding
2006

Development and Characterization of Microcoolers using Carbon Nanotubes

Teng Wang, Martin Jönsson, Zhimin Mo et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006). Vol. 2, p. 881-885
Paper in proceeding
2006

Analysis of Mechanical Strength for Flip-chip Bonding of GaAs MMIC

Bo Zhang, Vignesh Murugesan, Niklas Billström et al
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 325-328
Paper in proceeding
2006

Low Cycle Fatigue of Sn-based Lead-free Solder joints and the analysis of fatigue life prediction uncertainty

Cristina Andersson, Peng Sun, Johan Liu
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 19-26
Paper in proceeding
2006

Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles

Suresh Chand Verma, Wanbing Guan, Cristina Andersson et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 282-286
Paper in proceeding
2006

Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal ccling testing

Peng Sun, Cristina Andersson, Johan Liu et al
Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, p. 760-767
Paper in proceeding
2006

Development of High Adhesion Nano-Thermal Interface Materials for Electronics Packaging Applications

Tomas Aronsson, Wen Xuan Wang, Michael Olugbenga Olorunyomi et al
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), p. 196-199
Paper in proceeding
2006

Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Proc. 1 st Electronics Systemintegration Technology Conference, 2006 (ESTC 2006), 5 - 7 Sept. 2006, Dresden, Germany. Vol. 2, p. 757-761
Paper in proceeding
2006

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization

Peng Sun, Cristina Andersson, Xicheng Wei et al
Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06), p. 1468-1475
Paper in proceeding
2006

Computational Fluid Dynamics Simulation for On-chip Cooling with Carbon Nanotube Micro-fin Architectures

Xiaolong Zhong, Yan Zhang, Teng Wang et al
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), p. 117-123
Paper in proceeding
2006

Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 166-170
Paper in proceeding
2006

Development of SOP Module Technology Based on LCP Substrate for High Frequency Electronics Applications

Xia Zhang, Qi Zhang, Gang Zou et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 118-125
Paper in proceeding
2006

Flow Behaviour of Anisotropic Conductive Adhesive Film during COG Bonding Process in Flat Panel Display Assembly

Fabien Raugi, Mohammad Kamruzzaman Chowdhury, Helge Kristiansen et al
1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. Vol. 2, p. 828-833
Paper in proceeding
2006

Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy

Cristina Andersson, L. Liu, Johan Liu
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany. Vol. 1, p. 152-160
Paper in proceeding
2006

Development of nanosolders and nanothermal interface materials and cooling devices based on nanocarbon tubes

Johan Liu
Proceedings of International Microelectronics and Packaging Conference (IMAPS) Nordic, September 17-19, 2006, Göteborg, Sweden
Paper in proceeding
2006

Design for Embedded Chinese Display Smart Card

Hua Zhou, Yang Liu, Dimitar Antonov Kolev et al
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06; Shanghai; China; 27 June 2006 through 28 June 2006, p. 152-156
Paper in proceeding
2006

Characterization of Nanoparticles of Lead Free Solder Alloys

Wanbing Guan, Suresh Chand Verma, Yulai Gao et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 7-12
Paper in proceeding
2006

On the heat transfer enhancement based on micro-scale air impingingment jets with microstructure heat sink in electronics cooling

Jingyu Fan, Yan Zhang, Johan Liu
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06; Shanghai; China; 27 June 2006 through 28 June 2006, p. 120-124
Paper in proceeding
2006

Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering

Peng Sun, Cristina Andersson, Xicheng Wei et al
Materials Science & Engineering B: Solid-State Materials for Advanced Technology. Vol. 135 (2), p. 134-140
Journal article
2006

Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions

Cristina Andersson, Johan Liu
ESTC 2006 - 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. Vol. 1, p. 457-467
Paper in proceeding
2006

Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint

C. Bailey, Peng Sun, Xicheng Wei et al
Soldering and Surface Mount Technology. Vol. 18 (2), p. 4-11
Journal article
2006

Consequential toxicity assessment of the global shift to Pb free solder paste

Anders Andrae, Johan Liu
Proceedings of the International Conference on Electronic Packaging (ICEP 2006), p. 298-303
Paper in proceeding
2006

New Nano-Thermal Interface Material for Heat Removal in Electronics Packaging

Johan Liu
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany
Paper in proceeding
2005

Low cycle fatigue testing and simulation of Sn8Zn-3Bi and Sn-37Pb solder joints

Peng Sun, Cristina Andersson, Xicheng Wei et al
Soldering and surface Mount Technology. Vol. 17 (4), p. pp38-45
Journal article
2005

Adhesion study of copper layer deposited and liquid crystalline polymer for electronics packaging

Qi Zhang, Johan Liu, Lars Nyborg
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp109-114
Paper in proceeding
2005

Numerical Simulation Based on CFD for Impingement Heat Transfer in Electronics Cooling

Yan Zhang, Jingyu Fan, Johan Liu
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp360-364
Paper in proceeding
2005

Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings. Vol. 2005, p. 523-528
Paper in proceeding
2005

Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint

Peng Sun, Cristina Andersson, Zhaonian Cheng et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp342-347
Paper in proceeding
2005

Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate

Liqiang Cao, Zonghe Lai, Johan Liu
Journal of Electronics packaging. Vol. 127, p. pp43-46
Journal article
2005

THERMAL MODELING FOR SYSTEM-IN-A-PACKAGE BASED ON EMBEDDED CHIP STRUCTURE

Liu Chen, Lisa Ekstrand, Johan Liu
Proceedings of the 5th IEEE International Conferences on Adhesives and Polymers (POLYTRONIK05), p. 224-227
Paper in proceeding
2005

Reliability of Conductive adhesives

Johan Liu, Zhimin Mo
Lead-Free Solder Interconnect Reliability
Book chapter
2005

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Cristina Andersson, Zonghe Lai, Johan Liu
Materials Science and Engineering A. Vol. 394, p. 20-27
Journal article
2005

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Chen, Zonghe Lai, Zhaonian Cheng et al
Journal of Electronic Packaging. Vol. 3, p. pp343-349
Journal article
2005

Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive

Liqiang Cao, Zhaonian Cheng, Zonghe Lai et al
Proceedings of the 2005 International Conference on Electronics Packaging (ICEP), p. pp48-55
Paper in proceeding
2005

Reliability analysis of embedded chip technique with design of experiment methods

Xiuzhen Lu, Liu Chen, Zhaonian Cheng et al
2005 International Symposium on Electronics Materials and Packaging, p. pp43-49
Paper in proceeding
2005

A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic Conductive Adhesive Joining Technology

Johan Liu, Liqiang Cao, Min Xie et al
IEEE Transactions on Electronics Packaging Manufacturing (TEPM). Vol. 28 (4), p. 322-327
Journal article
2005

Characterisation of Mechanical Properties of Metal-coated Polymer Spheres for Anisotropic Conductive Adhesive

H. Kristiansen, Z. Zhang, Johan Liu
10th International Symposium and Exhibition on, Advanced Packaging Materials. Vol. 8 (2)
Paper in proceeding
2005

Characterization of thermally conductive epoxy nano-composites

Lisa Ekstrand, Helge Kristiansen, Johan Liu
28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005; Wiener Neustadt; Austria; 19 May 2005 through 20 May 2005. Vol. 2005, p. 35-39
Paper in proceeding
2005

Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder Joint

Peng Sun, Cristina Andersson, Zhaonian Cheng et al
Proceedings of the IEEE CPMT Conference on Electronics Component Technology (ECTC55), p. 696-700
Paper in proceeding
2005

Development of an ontology for the ACA technology in electronics applications

Johan Liu, Yu Wang, James Morris
10th International Symposium and Exhibition on, Advanced Packaging Materials. Vol. 8 (1)
Paper in proceeding
2005

Integrated Nanotube Microcooler for Microelectronics Applications

Zhimin Mo, Raluca Morjan, Johan Anderson et al
Proceedings of the IEEE CPMT Conference on Electronics Component Technology (ECTC55), p. pp51-54
Paper in proceeding
2005

Microst