The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish
Paper in proceedings, 2008

Author

Lili Zhang

Cristina Andersson

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Zhaonian Cheng

Proceedings of the 2nd Electronics Systemintegration Technology Conference

1295-1300

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

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Created

10/6/2017