Cristina Andersson

Showing 52 publications
Reliability of Microtechnology – Interconnects, Devices and Systems
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression
Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles
Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages
Design of 50-70 GHz Planar Wideband Bandpass Filter on Liquid Crystal Polymer Substrate
A Compact V-band Planar Wideband Bandpass Filter Based on Liquid Crystal Polymer Substrates
Overview of Carbon Nanotubes as Off-Chip Interconnects
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression
Recent Advances in the Synthesis of Lead-free Solder Nanoparticle
Development of Nanomaterials and Devices for Electronics Cooling and Interconnect
Recent Development of Nano-solder Paste for Electronics Interconnect Applications
Effect of Corrosion on the Low Cycle Fatigue Behaviour of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints
Effect of Corrosion on the Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints
Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions
Characterization of Nanoparticles of Lead Free Solder Alloys
Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal ccling testing
Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint
Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions
Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy
Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles
Low cycle fatigue testing and simulation of Sn8Zn-3Bi and Sn-37Pb solder joints
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Lead-free soldering assessment using different board finishes
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Thermal cycling and reliability of lead free BGA components
Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint
Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder Joint
Thermodynamic assessment of Sn-Co lead-free solder system
Low cycle fatigue and reliability characterisation of lead free solders
Thermodynamic Assessment of Sn-Co-Cu Lead-free Solder Alloy
Development of a web-based course on lead-free solders
Low-Cycle fatigue life of SnAgBi and Sn-Ag lead-free solders
Low Cycle fatigue of lead-free solders
Fatigue properties of lead-free solders
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