Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints
Paper in proceedings, 2005

Author

Cristina Andersson

Chalmers, Microtechnology and Nanoscience (MC2)

Dag R. Andersson

Per-Erik Tegehall

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the IMAPS 2005

523-528

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017