Cristina Andersson

Näringslivsansvarig vid MC2 verksamhetsstöd

Källa: chalmers.se
Image of Cristina Andersson

Visar 52 publikationer

2011

Reliability of Microtechnology – Interconnects, Devices and Systems

Johan Liu, Olli Salmela, Jussi Särkkä et al
Bok
2009

Design of 50-70 GHz Planar Wideband Bandpass Filter on Liquid Crystal Polymer Substrate

Xia Zhang, Dan Kuylenstierna, Johan Liu et al
Journal of Infrared, Millimeter, and Terahertz Waves. Vol. 30 (2), p. 183-189
Artikel i vetenskaplig tidskrift
2009

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Xiangdong Zou, Yulai Gao, Qijie Zhai et al
Journal of Electronic Materials. Vol. 38 (2), p. 351-355
Artikel i vetenskaplig tidskrift
2009

Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages

Cristina Andersson, B. Vandevelde, C. Noritake et al
Soldering and Surface Mount Technology. Vol. 21 (2), p. 28-38
Artikel i vetenskaplig tidskrift
2009

Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles

C.-D. Zou, Y.-L. Gao, B. Yang et al
Soldering and Surface Mount Technology. Vol. 21 (2), p. 9-13
Artikel i vetenskaplig tidskrift
2008

Development of Nanomaterials and Devices for Electronics Cooling and Interconnect

Johan Liu, Teng Wang, Björn Carlberg et al
Proceedings of the Ecology in Electronics Conference in “Progress in Eco-Electronics”, as Monongraphies of Tele, Radio Institute, p. 33-47
Kapitel i bok
2008

Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder alloy for electronics applications

Cristina Andersson, Peng Sun, Johan Liu
Journal of Alloys and Compounds. Vol. 457 (1/2), p. 97-105
Artikel i vetenskaplig tidskrift
2008

Overview of Carbon Nanotubes as Off-Chip Interconnects

Xia Zhang, Teng Wang, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference
Paper i proceeding
2008

Effect of different temperature cycle profiles on the crack initiation and propagation of Sn3,5Ag wave soldered joints

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
Microelectronics Reliability. Vol. 47, p. 266-272
Artikel i vetenskaplig tidskrift
2008

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Xiangdong Zou, Yulai Gao, Qijie Zhai et al
Journal of Electronics Materials
Artikel i vetenskaplig tidskrift
2008

A Compact V-band Planar Wideband Bandpass Filter Based on Liquid Crystal Polymer Substrates

Xia Zhang, Dan Kuylenstierna, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 163-167
Paper i proceeding
2008

Thermal cycling aging effect on the shear strength, microstructure, IMC and initiation and propagation of surface mounted Sn-3.8Ag-0.7Cu and wave soldered Sn-3.5Ag ceramic chip components

Cristina Andersson, Per-Erik Tegehall, Dag R. Andersson et al
IEEE Transactions on Components and Packaging Technologies. Vol. 31 (2), p. 331-344
Artikel i vetenskaplig tidskrift
2008

The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish

Lili Zhang, Cristina Andersson, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1295-1300
Paper i proceeding
2008

Recent Advances in the Synthesis of Lead-free Solder Nanoparticle

Cristina Andersson, Changdong Zou, Bin Yang et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 915-922
Paper i proceeding
2008

Recent Development of Nano-solder Paste for Electronics Interconnect Applications

Johan Liu, Cristina Andersson, Yulai Gao et al
Proceedings of the IEEE 10th Electronics Packaging Technology Conference
Paper i proceeding
2008

Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles

Lili Zhang, Wenkai Tao, Johan Liu et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology &　High Density Packaging, p. E1-1 0
Paper i proceeding
2008

Effect of Corrosion on the Low Cycle Fatigue Behaviour of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints

Cristina Andersson, Johan Liu
International Journal of Fatigue, p. 917-930
Artikel i vetenskaplig tidskrift
2007

Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Sun Peng, Cristina Andersson, Johan Liu
Journal of Alloys and Compounds
Artikel i vetenskaplig tidskrift
2007

Effect of different temperature cycling profiles on the crack initiation and propagation and of Sn-3.5Ag wave soldered joints

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
Microelectronics and Reliability. Vol. 47 (2-3), p. 266-272
Artikel i vetenskaplig tidskrift
2007

Effect of Corrosion on the Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints

Cristina Andersson, Johan Liu
International Journal of Fatigue
Artikel i vetenskaplig tidskrift
2006

High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization

Peng Sun, Cristina Andersson, Xi-cheng Wei et al
Journal of Alloys and Compounds. Vol. 425 (1-2), p. 191-199
Artikel i vetenskaplig tidskrift
2006

Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions

Cristina Andersson
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany
Paper i proceeding
2006

Low Cycle Fatigue of Sn-based Lead-free Solder joints and the analysis of fatigue life prediction uncertainty

Cristina Andersson, Peng Sun, Johan Liu
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 19-26
Paper i proceeding
2006

Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles

Suresh Chand Verma, Wanbing Guan, Cristina Andersson et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 282-286
Paper i proceeding
2006

Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal ccling testing

Peng Sun, Cristina Andersson, Johan Liu et al
Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, p. 760-767
Paper i proceeding
2006

Low Cycle Fatigue of Sn-based Lead-free Solder joints and the analysis of fatigue life prediction uncertainty

Cristina Andersson
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China
Paper i proceeding
2006

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization

Peng Sun, Cristina Andersson, Xicheng Wei et al
Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06), p. 1468-1475
Paper i proceeding
2006

Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy

Cristina Andersson, L. Liu, Johan Liu
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany, p. 152-160
Paper i proceeding
2006

Characterization of Nanoparticles of Lead Free Solder Alloys

Wanbing Guan, Suresh Chand Verma, Yulai Gao et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 7-12
Paper i proceeding
2006

Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering

Peng Sun, Cristina Andersson, Xicheng Wei et al
Materials Science & Engineering B: Solid-State Materials for Advanced Technology. Vol. 135 (2), p. 134-140
Artikel i vetenskaplig tidskrift
2006

Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions

Cristina Andersson, Johan Liu
ESTC 2006 - 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006, p. 457-467
Paper i proceeding
2006

Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint

C. Bailey, Peng Sun, Xicheng Wei et al
Soldering and Surface Mount Technology. Vol. 18 (2), p. 4-11
Artikel i vetenskaplig tidskrift
2005

Low cycle fatigue testing and simulation of Sn8Zn-3Bi and Sn-37Pb solder joints

Peng Sun, Cristina Andersson, Xicheng Wei et al
Soldering and surface Mount Technology. Vol. 17 (4), p. pp38-45
Artikel i vetenskaplig tidskrift
2005

Lead-free soldering assessment using different board finishes

Cristina Andersson
New Exploratory Technologies 2005
Övrigt konferensbidrag
2005

Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings. Vol. 2005, p. 523-528
Paper i proceeding
2005

Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint

Peng Sun, Cristina Andersson, Zhaonian Cheng et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp342-347
Paper i proceeding
2005

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Cristina Andersson, Zonghe Lai, Johan Liu
Materials Science and Engineering A. Vol. 394, p. 20-27
Artikel i vetenskaplig tidskrift
2005

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Cristina Andersson
Materials Science and Engineering. Vol. A (394), p. 20-27
Artikel i vetenskaplig tidskrift
2005

Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder Joint

Peng Sun, Cristina Andersson, Zhaonian Cheng et al
Proceedings of the IEEE CPMT Conference on Electronics Component Technology (ECTC55), p. 696-700
Paper i proceeding
2005

Microstructural evolution of Sn-Zn based lead-free solders after exposure to temperature and humidity

Peng Sun, Cristina Andersson, Zonghe Lai et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp197-202
Paper i proceeding
2005

Thermal cycling and reliability of lead free BGA components

Cristina Andersson, Dag Andersson, Johan Liu
IMAPS Europe Brugge, p. pp101-108
Paper i proceeding
2005

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Cristina Andersson, Zonghe Lai, Johan Liu et al
Materials Science and Engineering. Vol. A (394), p. pp20-27
Artikel i vetenskaplig tidskrift
2004

Thermodynamic assessment of Sn-Co lead-free solder system

Libin Liu, Cristina Andersson, Johan Liu
Journal of Electronic Materials. Vol. 33 (9), p. p 935-
Artikel i vetenskaplig tidskrift
2004

Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
Proceedings of the 5th international conference on thermal, mechanical and thermo-mechanical simulation and experiments in micro-electronics and micro-systems (EuroSimE). Vol. May (10th to 12th), p. pp 455-464
Paper i proceeding
2003

Development of a web-based course on lead-free solders

Johan Liu, Cristina Andersson
ECTC´03, p. 739-742
Paper i proceeding
2003

Thermodynamic Assessment of Sn-Co-Cu Lead-free Solder Alloy

Libin Liu, Cristina Andersson, Johan Liu et al
Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition, p. 2003-35126
Paper i proceeding
2001

Low Cycle fatigue of lead-free solders

Cristina Andersson, Xitao Wang, Zonghe Lai et al
The Fourth International Symposium on Electronic Packaging Technology, p. 462-470
Paper i proceeding
2001

Low-Cycle fatigue life of SnAgBi and Sn-Ag lead-free solders

Cristina Andersson, Xitao Wang, Zonghe Lai et al
Proceedings of the IMAPS Nordic, p. 298-303
Paper i proceeding
2000

Fatigue properties of lead-free solders

Xitao Wang, Cristina Andersson, Zonghe Lai et al
Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis, p. 163-169
Paper i proceeding

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