Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles
Paper i proceeding, 2008
Författare
Lili Zhang
Wenkai Tao
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
Yan Zhang
Zhaonian Cheng
Cristina Andersson
Chalmers, Teknisk fysik, Elektronikmaterial
Yulai Gao
Qijie Zhai
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging
E1-1 0
Ämneskategorier
Elektroteknik och elektronik