Zhaonian Cheng

Visar 39 publikationer

2010

Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach

C. Yue, Y. Zhang, Z. L. Hu et al
Microsystem Technologies. Vol. 16 (4), p. 633-639
Artikel i vetenskaplig tidskrift
2009

Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA

Cong Yue, Yan Zhang, Zhili Hu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 851-855
Paper i proceeding
2009

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Yi Fan, Xiaolong Zhong, Johan Liu et al
Microsystem Technologies. Vol. 15 (3), p. 375-381
Artikel i vetenskaplig tidskrift
2009

Study of the filler effect of the effective thermal conductivity of thermal conductive adhesive

Yan Zhang, Cong Yue, Johan Liu et al
ICEP
Paper i proceeding
2009

FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives

Nabi Nabiollahi, Johan Liu, Zhili Hu et al
2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009; Genoa; Italy; 26 July 2009 through 30 July 2009, p. 422-425
Paper i proceeding
2009

Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging

Li Xu, Xiuzhen Lu, Johan Liu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1051-1053
Paper i proceeding
2009

The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder

Si Chen, Zhaonian Cheng, Johan Liu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1240-1245
Paper i proceeding
2009

A Study of the Heat Transfer Characteristics of the Micro-channel Heat Sink

Shun Wang, Yan Zhang, Yifeng Fu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 255-259
Paper i proceeding
2009

Influences of Filler Geometry and Content on Effective Thermal Conductivity of Thermal Conductive Adhesive

Cong Yue, Yan Zhang, Masahiro Inoue et al
2009 Electronic Components and Technology Conference, p. 2056-2059
Paper i proceeding
2009

Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging

Xiuzhen Lu, Li Xu, Huaxiang Lai et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1051-1053
Paper i proceeding
2008

A METHOD STUDY OF CFD SIMULATION FOR CNT MICROCOOLER

Xiao-long Zhong, Yan Zhang, Johan Liu et al
Proceedings of the Ecology Electronics Conference in “Progress in Eco-Electronics”
Kapitel i bok
2008

Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application

Li Xu, Cong Yue, Johan Liu et al
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008
Paper i proceeding
2008

A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers

Yi Fan, Yifeng Fu, Yan Zhang et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology &　High Density Packaging, p. D1-05
Paper i proceeding
2008

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Yi Fan, Xiaolong Zhong, Johan Liu et al
Microsystem Technologies
Artikel i vetenskaplig tidskrift
2008

A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers

Yi Fan, Yifeng Fu, Yan Zhang et al
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008
Paper i proceeding
2008

Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant

Yi Fan, Yifeng Fu, Teng Wang et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1391-1394
Paper i proceeding
2008

The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish

Lili Zhang, Cristina Andersson, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1295-1300
Paper i proceeding
2008

Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Thermal Interface Material

Cong Yue, Yan Zhang, Johan Liu et al
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008, p. C1-10
Paper i proceeding
2008

Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles

Lili Zhang, Wenkai Tao, Johan Liu et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology &　High Density Packaging, p. E1-1 0
Paper i proceeding
2006

Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application

Qi Zhang, Zonghe Lai, Urban Jevelstam et al
Proceedings of the International Conference on Electronic Packaging (ICEP 2006), p. 83-89
Paper i proceeding
2006

Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Si Chen, Peng Sun, Johan Liu et al
Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, p. 368-373
Paper i proceeding
2006

RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints

Xu Wang, Zhaonian Cheng, Johan Liu
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 123-127
Paper i proceeding
2006

High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization

Peng Sun, Cristina Andersson, Xi-cheng Wei et al
Journal of Alloys and Compounds. Vol. 425 (1-2), p. 191-199
Artikel i vetenskaplig tidskrift
2006

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization

Peng Sun, Cristina Andersson, Xicheng Wei et al
Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06), p. 1468-1475
Paper i proceeding
2006

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Chen, Zonghe Lai, Zhaonian Cheng et al
Journal of Electronic Packaging, Transactions of the ASME. Vol. 128 (3), p. 177-183
Artikel i vetenskaplig tidskrift
2006

Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint

C. Bailey, Peng Sun, Xicheng Wei et al
Soldering and Surface Mount Technology. Vol. 18 (2), p. 4-11
Artikel i vetenskaplig tidskrift
2006

Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering

Peng Sun, Cristina Andersson, Xicheng Wei et al
Materials Science & Engineering B: Solid-State Materials for Advanced Technology. Vol. 135 (2), p. 134-140
Artikel i vetenskaplig tidskrift
2006

Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 166-170
Paper i proceeding
2006

Computational Fluid Dynamics Simulation for On-chip Cooling with Carbon Nanotube Micro-fin Architectures

Xiaolong Zhong, Yan Zhang, Teng Wang et al
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), p. 117-123
Paper i proceeding
2005

Reliability analysis of embedded chip technique with design of experiment methods

Xiuzhen Lu, Liu Chen, Zhaonian Cheng et al
2005 International Symposium on Electronics Materials and Packaging, p. pp43-49
Paper i proceeding
2005

Low cycle fatigue testing and simulation of Sn8Zn-3Bi and Sn-37Pb solder joints

Peng Sun, Cristina Andersson, Xicheng Wei et al
Soldering and surface Mount Technology. Vol. 17 (4), p. pp38-45
Artikel i vetenskaplig tidskrift
2005

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Chen, Zonghe Lai, Zhaonian Cheng et al
Journal of Electronic Packaging. Vol. 3, p. pp343-349
Artikel i vetenskaplig tidskrift
2005

Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive

Liqiang Cao, Zhaonian Cheng, Zonghe Lai et al
Proceedings of the 2005 International Conference on Electronics Packaging (ICEP), p. pp48-55
Paper i proceeding
2005

Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint

Peng Sun, Cristina Andersson, Zhaonian Cheng et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp342-347
Paper i proceeding
2005

Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder Joint

Peng Sun, Cristina Andersson, Zhaonian Cheng et al
Proceedings of the IEEE CPMT Conference on Electronics Component Technology (ECTC55), p. 696-700
Paper i proceeding
2005

Microstructural evolution of Sn-Zn based lead-free solders after exposure to temperature and humidity

Peng Sun, Cristina Andersson, Zonghe Lai et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp197-202
Paper i proceeding
2005

Residual Stress in Flip Chip Joining Using Anisotropic Conductive Adhesive

Zhaonian Cheng, Lisa Ekstrand, Johan Liu
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp139-144
Paper i proceeding
2005

Microsystem Interconnections Modelling Using Micropolar Theory and Discontinuous Approximation

Yan Zhang, Ragnar Larsson, Jingyu Fan et al
Proceedings of 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2005), p. 176-179
Paper i proceeding
2004

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Chen, Zonghe Lai, Zhaonian Cheng et al
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´04)
Paper i proceeding

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