Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Thermal Interface Material
Paper i proceeding, 2008

Thermal interface materials have been widely adopted in the thermal management for electronics system. Most of the thermal interface materials are made of polymers with thermally conductive particles distributed inside to enhance the thermal conductivity. Thus it is essential to figure out the effective thermal conductivity of this composite material. In the present paper, a parameterized cubic cell model had been developed and implemented by the finite element method. The numerical simulations were carried out to investigate the effect of the filler distributions on the effective thermal conductivity of the thermal interface materials. The volume percentage loadings of the particles ranging from 13% to 74% had been considered, and different particle distribution patterns had also been analyzed. The simulation results were compared with the experimental data as well as other models. A fairly good agreement was obtained for the particle volume percentage loading under consideration, which verified the developed cubic cell model.

Författare

Cong Yue

Shanghai University

Yan Zhang

Shanghai University

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Zhaonian Cheng

Chalmers University of Technology

Jing-yu Fan

Shanghai University

2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008

C1-10 4606971

Ämneskategorier

Elektroteknik och elektronik

DOI

10.1109/ICEPT.2008.4606971

ISBN

978-142442740-6