Johan Liu

Novel Lightweight, Highly Thermally Conductive Graphene-Enhanced Heat Pipes for Electronics Cooling and Thermal Management Applications

Reliability of Graphene Enhanced Thermal Interface Material under Mechanical Cycling

Abrasion of Graphene-Enhanced Thermal Interface Materials for Electronics Thermal Management Applications

A Simulation Based Comparative Study on Thermal and Mechanical Performance of Silicone Grease and Graphene-enhanced Thermal Pad for Single-chip and Multi-chip Packaging Applications

2023

Toward ultrahigh thermal conductivity graphene films

A Critical Assessment of graphene based heat pipes for electronics and power module cooling applications

Characterization of a Novel Cost-efficient and Environmentally Friendly Graphene-enhanced Thermal Interface Material

Improved Thermal Properties of Three-Dimensional Graphene Network Filled Polymer Composites

Reliability Characterization of Graphene Enhanced Thermal Interface Material for Electronics Cooling Applications

2022

Reduction of thermal resistance of Ag-coated GFs/copper structure using nano-Ag paste as interconnection

A novel nano-Ag paste with Ag-rGO and its application in GF/Cu laminated structure

Enhanced Mechanical and Thermal Properties of Ag Joints Sintered by Spark Plasma Sintering

Transparent heaters based on CVD grown few-layer graphene

High-Performance Electrothermal Film Based on Laser-Induced Graphene

Graphene Oxide and Nitrogen-Doped Graphene Coated Copper Nanoparticles in Water-Based Nanofluids for Thermal Management in Electronics

MDS study on tensile properties of defective graphene sheet

A Critical Assessment of Nano Enhanced Vapor Chamber Wick Structures for Electronics Cooling

Fabrication and Characterization of Graphene/polyimide Composite Film

2021

A Novel Graphene Quantum Dot-Based mRNA Delivery Platform

Characterization of Longitudinal Thermal Conductivity of Graphene Film

Highly thermally conductive substrate based on graphene film

2021

Degradation of Carbon Nanotube Array Thermal Interface Materials through Thermal Aging: Effects of Bonding, Array Height, and Catalyst Oxidation

2021

Aerosol Jet Printing of Graphene and Carbon Nanotube Patterns on Realistically Rugged Substrates

Heat transfer analysis of phase change materials with metal foams

Exploring Graphene Coated Copper Nanoparticles as a multifunctional Nanofiller for Micro-Scaled Copper Paste

2021

Graphene-based films: Fabrication, interfacial modification, and applications

Thermal Conduction of Fiber-Reinforced Polymer under Loading

Thermal Analysis of an Au/Pt/Ti-Based Microheater

Synergistic Toughening of Graphene Films by Addition of Hydroxylated Carbon Nanotube

Thermal Properties of Laser Reduced Graphene Oxide Films

Thermal Properties of Laser-induced Graphene Films Photothermally Scribed on Bare Polyimide Substrates

2020

Properties of Undoped Few-Layer Graphene-Based Transparent Heaters

Thermally Conductive Graphene Film/Indium/Aluminum Laminated Composite by Vacuum Assisted Hot-pressing

Characterterization of multi-scale nanosilver paste reinforced with SIC particles

Graphene oxide for nonvolatile memory application by using electrophoretic technique

Highly Oriented Graphite Aerogel Fabricated by Confined Liquid-Phase Expansion for Anisotropically Thermally Conductive Epoxy Composites

Scalable production of thick graphene films for next generation thermal management applications

2020

Thermally reduced graphene oxide/carbon nanotube composite films for thermal packaging applications

2020

Multiple growth of graphene from a pre-dissolved carbon source

2020

Synthesis of graphene quantum dots and their applications in drug delivery

2020

High porosity and light weight graphene foam heat sink and phase change material container for thermal management

Bipolar electrochemical capacitors using double-sided carbon nanotubes on graphite electrodes

Graphene based thermal management system for battery cooling in electric vehicles

2020

Effects of high temperature treatment of carbon nanotube arrays on graphite: increased crystallinity, anchoring and inter-tube bonding

Enhanced electrochemical performance of three-dimensional graphene/carbon nanotube composite for supercapacitor application

Improved Interfacial Bonding Strength and Reliability of Functionalized Graphene Oxide for Cement Reinforcement Applications

2020

Graphene related materials for thermal management

Analysis of heat dissipation characteristics of three-dimensional graphene-carbon nanotube composite structures

Electrical monitoring of concrete using a novel structural sensor based on conductive cementitious mortar

2020

Effect of Nanopowder Addition on the Sintering of Water-Atomized Iron Powder

Highly thermal conductive and light-weight graphene-based heatsink

Highly Thermal Conductive and Light -weight Craphene-based Heatsink

Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

2019

Chemical Vapor Deposition of Vertically Aligned Carbon Nanotube Arrays: Critical Effects of Oxide Buffer Layers

Thermal interface materials based on vertically aligned carbon nanotube arrays: A review

Mechanical properties of a novel multi-scale silver paste for electronics interconnect application

2019

Thermal conductivity enhancement of carbon@ carbon nanotube arrays and bonded carbon nanotube network

Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles

Highly thermal conductive and electrically insulated graphene based thermal interface material with long-term reliability

Effect of Boron Nitride Particle Geometry on the Thermal Conductivity of a Boron Nitride Enhanced Polymer Composite Film

Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles

Effect of Fiber Concentration on Mechanical and Thermal Properties of a Solder Matrix Fiber Composite Thermal Interface Material

Experimental Measurements of Thermal Performances of Carbon Nanomaterial with Vertical Structures in Hotspot Heat Dissipation

Covalent anchoring of carbon nanotube-based thermal interface materials using epoxy-silane monolayers

Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

Graphene-coated copper nanoparticles for thermal conductivity enhancement in water-based nanofluid

2019

Atomic Layer Deposition of Buffer Layers for the Growth of Vertically Aligned Carbon Nanotube Arrays

RF properties of carbon nanotube / Copper composite through silicon via based CPW structure for 3D integrated circuits

2019

Reliability investigation of a carbon nanotube array thermal interface material

2019

Surface modification of graphene for use as a structural Fortifier in water-borne epoxy coatings

2019

Manufacturing Graphene-Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor

Compact and low loss electrochemical capacitors using a graphite / carbon nanotube hybrid material for miniaturized systems

Effect of pressure during graphitization on mechanical properties of graphene films

2019

Preparation of graphene/aligned carbon nanotube array composite films for thermal packaging applications

Conductive adhesive based on mussel-inspired graphene decoration with silver nanoparticles

Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering

Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds

Thermal Reliability Study of Polymer Bonded Carbon Nanotube Array Thermal Interface Materials

Anisotropic thermal conductivity of vertically self-ordered Nanocrystalline Boron Nitride thin films for thermal hotspot mitigation in electronics

Egg albumen templated graphene foams for high-performance supercapacitor electrodes and electrochemical sensors

Elevated thermoelectric figure of merit of n-type amorphous silicon by efficient electrical doping process

2018

Understanding noninvasive charge transfer doping of graphene: a comparative study

Low-Temperature Sintering Bimodal Micro Copper-Nano Silver for Electrical Power Devices

The influence of sintering process on thermal properties of nano-silver paste

Carbon Nanotubes for thermal management of Microsystems

Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications

Reliability study on high thermally conductive graphene film as heat spreader in electronics cooling applications

Finite Element Analysis to the Constitutive Behavior of Sintered Silver Nanoparticles Under Nanoindentation

Light-weight Compressible and Highly Thermal Conductive Graphene-based Thermal Interface Material

MDS Investigation on the Melting and Solidification of Silver Nanoparticles

Surface analysis of iron and steel nanopowder

Critical atomic-level processing technologies: Remote plasma-enhanced atomic layer deposition and atomic layer etching

Synthesis of a Graphene Carbon Nanotube Hybrid Film by Joule Self-heating CVD for Thermal Applications

Vertically Aligned Graphene-based Thermal Interface Material with High Thermal Conductivity

Novel nanostructured thermal interface materials: a review

Fabrication and characterization of a carbon fiber solder composite thermal interface material

Synthesis of tunable hydrogels based on O-acetyl-galactoglucomannans from spruce

Synthesis and characterization of three-dimensional graphene foams by chemical vapor deposition

A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier

Stretchable Thermoelectric Generators Metallized with Liquid Alloy

An overview of carbon nanotubes based interconnects for microelectronic packaging

2017

The large enriched germanium experiment for neutrinoless double beta decay (LEGEND)

Control of Nanoplane Orientation in voBN for High Thermal Anisotropy in a Dielectric Thin Film: A New Solution for Thermal Hotspot Mitigation in Electronics

Efficient surface modification of carbon nanotubes for fabricating high performance CNT based hybrid nanostructures

Concrete setting and hardening monitoring using a novel graphene-based sensor

Graphene-based heat spreading materials for electronics packaging applications

Interface and interconnection stresses in electronic assemblies – A critical review of analytical solutions

2017

Design analysis of adhesively bonded structures

Evaluating CNT-Based Interconnects : A Nummerical Tool to Characterize Hybrid CNT-Copper Interconnects

Investigation of thermal interface materials reinforced with micro- and nanoparticles

Graphene-CNT hybrid material as potential thermal solution in electronics applications

Thermal Conductivity Enhancement of Coaxial Carbon@Boron Nitride Nanotube Arrays

Fabrication and characterization of graphene based film

Finite element analysis of bond line thickness and fiber distribution in solder based thermal interface materials

Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging

Silver decorated graphene-polyvinyl alcohol hybrid hydrogel as catalyst for benzonitrile conversion

Sintering of SiC enhanced copper paste for high power applications

Effect of sintering method on properties of nanosilver paste

Chemical vapor deposition grown graphene on Cu-Pt alloys

Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications

Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation

Graphene oxide based coatings on Nitinol for biomedical implant applications: Effectively promote mammalian cell growth but kill bacteria

Synthesis of highly conductive and mechanically strong silver coated silk bundles for flexible electronic applications

Thermal conductivity measurement of densified carbon nanotube bundles by pulsed photothermal reflectance technique

The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging

Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging

FREESTANDING CARBON NANOFIBERS/GRAPHENE COMPOSITE ELECTRODES FOR SUPERCAPACITORS

Carbon nanotube growth on different underlayers for thermal interface material application

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Nanophotonics-based low-temperature PECVD epitaxial crystalline silicon solar cells

Application of two-dimensional layered hexagonal boron nitride in chip cooling

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Finite element simulation of 2D-based materials as heat spreaders

Graphene Fibres: Towards high mechanical, thermal and electrical properties state of art

2016

Functionalization mediates heat transport in graphene nanoflakes

Enhanced cooling properties of radar antenna electronics using novel materials

Review of Current Progress of Thermal Interface Materials for Electronics Thermal Management Applications

Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review

2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS

Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

Heat dissipation of a hybrid CNT/Graphene based heat spreader

Thermal properties of TIM using CNTs forest in electronics packaging

Mechanical characterization ofnanoparticleenhancedSn-3.0Ag-0.5Cu solder

Experimental investigation of paraffin wax with graphene enhancement as thermal management materials for batteries

Development of bulk-nanostructuring methods for BiSbTe Thermoelectric

Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications

A review of recent progress of thermal interface materials: from research to industrial applications

Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging

Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing

Graphene-based heater

2016

Preventing Aging of Electrically Conductive Adhesives on Metal Substrate Using Graphene-Based Barrier

Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes

Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives

Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders

A brief overview of atomic layer deposition and etching in the semiconductor processing

Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor

Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

Reliability of Graphene-based Films Used for High Power Electronics Packaging

Flexible Multi-functionalized Carbon Nanotubes Based Hybrid Nanowires

Unusual tensile behavior of fiber-reinforced indium matrix composite and its in-situ TEM straining observation

Liquid Phase Exfoliated Graphene for Thermal Management in Electronic Packaging

Measurement of Dielectric Properties of Ultrafine BaTiO3 Using an Organic-Inorganic Composite Method

The promising application of graphene oxide as coating materials in orthopedic implants: preparation, characterization and cell behavior

Photonic nanostructures for advanced light trapping in thin crystalline silicon solar cells

Cooling hot spots by hexagonal boron nitride heat spreaders

Flexible Multifunctionalized Carbon Nanotubes-Based Hybrid Nanowires

Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging

Vertically stacked carbon nanotube-based interconnects for through silicon via application

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application

Chemically enhanced carbon nanotubes based Thermal Interface Materials

Combination of positive charges and honeycomb pores to promote MC3T3-E1 cell behaviour

Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles

The promising application of graphene oxide coatings in orthopedic implants: preparation, characterization, cell behavior, and antimicrobial activity

Thermal elastomer composites for soft transducers

A High Performance Ag Alloyed Nano-scale n-type Bi2Te3 Based Thermoelectric Material

2015

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment

Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications

Energy efficient nano metal polymer composites for cooling applications

A solder joint structure with vertically aligned carbon nanofibres as reinforcements

A Novel Method for Three-Dimensional Culture of Central Nervous System Neurons.

Carbon nanotube/solder hybrid structure for interconnect applications

Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application

Use of graphene-based films for hot spot cooling

CHEMICALLY VAPOR DEPOSITED CARBON NANOTUBES FOR VERTICAL ELECTRONICS INTERCONNECT IN PACKAGING APPLICATIONS

A carbon fiber solder matrix composite for thermal management of microelectronic devices

Development and characterization of graphene-enhanced thermal conductive adhesives

2014

Pre-Study of Graphene-Enhanced Cementitious Materials

Stem cell responses to plasma surface modified electrospun polyurethane scaffolds.

A new solder matrix nano polymer composite for thermal management and die attach applications

Enhanced Heat Spreader Based on Few-Layer Graphene Intercalated With Silane-Functionalization Molecules

Reliability of carbon nanotube bumps for chip on glass application

HB-EGF affects astrocyte morphology, proliferation, differentiation and the expression of intermediate filament proteins

Boron nitride nanofiber and indium composite based thermal interface materials for electronics heat dissipation applications

Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats

Study on the verification of IR and RTD methods applied in the thermal measurement of high power chips

HB-EGF affects astrocyte morphology, proliferation, differentiation, and the expression of intermediate filament proteins

A new solder matrix nano polymer composite for thermal management applications

Characterization of nano-enhanced interconnect materials for fine pitch assembly

Carbon fiber solder matrix composite for thermal management of high power electronics

1. Thermal Characterization of Power Devices Using Graphene-based Film

Experimental results versus numerical simulations of In/Cu intermetallic compounds growth

Experimental Study on the Mechanical Reliability of Carbon Nanotubes

Experimental study of Electrical properties and stability of CNT bumps in high density interconnects

Controlling the Density of CNTs by Different UnderlayerMaterials in PECVD Growth

Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD

Bioactive 3D cell culture system minimizes cellular stress and maintains the in vivo-like morphological complexity of astroglial cells

Investigation on interaction between indium based thermal interface material and copper and silicon substrates

Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application

Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration

Characterization for Graphene as Heat Spreader Using Thermal Imaging Method

Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots

Reliability of Carbon Nanotube Bumps for Chip on Film Application

Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology

Graphene Heat Spreader for Thermal Management of Hot Spots

Surface oxide analysis of lead-free solder particles

Mechanical properties of a novel Nano-Thermal Interface Material

2013

Molecular dynamics simulation of inertial trapping-induced atomic scale mass transport inside single walled carbon nanotubes

Fabrication and Characterization of a Metal Matrix Polymer Fibre Composite for Thermal Interface Material Applications

Experimental measurements for mechanical and electrical conductive properties of CNT bundles

Thermal performance characterization of nano thermal interface materials after power cycling

Direct Chemical Vapor Deposition of Large-Area Carbon Thin Films on Gallium Nitride for Transparent Electrodes: A First Attempt

Development and Characterization of Nano-Composite Solder

Selective growth of double-walled carbon nanotubes on gold films

Characterization of CNT Enhanced Conductive Adhesives in Terms of Thermal Conductivity

2012

A method to integrate patterned electrospun fibers with microfluidic systems to generate complex microenvironments for cell culture applications

Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler

Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate

Microstructural evolution in electrically conductive adhesives containing Ag micro-fillers during curing and annealing

Effect of microstructural evolution in electrically conductive adhesives containing Ag micro-fillers

Thick film patterning by lift-off process using double-coated single photoresists

Surface characterisation of oxygen plasma treated electrospun polyurethane fibres and their interaction with red blood cells

Formation of three-dimensional carbon nanotube structures by controllable vapor densification

Patterned electrospun microfibers integrated in a microfluidic system to study cells in complex microenvironments

Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology

TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder

Polymer-metal nanofibrous composite for thermal management of microsystems

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material

Reliability investigation of nano-enhanced thermal conductive adhesives

Environmental reliability of nano-structured polymer-metal composite thermal interface material

Low Partial Pressure Chemical Vapor Deposition of Graphene on Copper

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

2012

Detecting single molecules inside a carbon nanotube to control molecular sequences using inertia trapping phenomenon

Electrical Interconnects Made of Carbon Nanotubes: Applications in 3D Chip Stacking

2012

Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene

Graphene Heat Spreader for Thermal Management of Hot Spots in Electronic Packaging

Organic Thin-Film Transistors with Anodized Gate Dielectric Patterned by Self-Aligned Embossing on Flexible Substrates

A New Thermally Conductive Thermoplastic Die Attach Film

2012

Controllable chemical vapor deposition of large area uniform nanocrystalline graphene directly on silicon dioxide

Molecular dynamics simulation for the bonding energy of metal-SWNT interface

Numerical study of thermal transfer between adhesive and CNTs

Reliability of Microtechnology – Interconnects, Devices and Systems

Electrical and thermal conductivities of thermally conductive adhesives composed of a multi-functional epoxy resin containing Ag-plated Cu fillers

Numerical investigation on thermal properties of micro-pin-fin cooler

Numerical study of the interface heat transfer characteristics of micro-cooler with CNT structures

Benchmarking assembly materials for vertically aligned carbon nanotubes into microsystems

Influence of substrate on electrical conductivity of isotropic conductive adhesive

Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration

Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers

Cell road - biomaterials for neural stem cell migration

Study on the reliability of nano-structured polymer-metal composite for thermal interface material

The effect of functionalized silver on properties of conductive adhesives

Printed monopole antenna with extremely wide bandwidth on liquid crystal polymer substrates

Study on the reliability of fast curing isotropic conductive adhesive

Investigation of accelerated surface oxidation of Sn-3,5Ag-0,5Cu solder particles by TEM and STEM

Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures

Characterization of surface oxide of lead-free solder particle by TEM and STEM

Study into high temperature reliability of isotropic conductive adhesive

The effect of functionalized silver on rheological and electrical properties of conductive adhesives

Molecular Gun Composed of Carbon Nanotube

Comparisons of nano-additives influence on properties of the bi-modal solder pastes for special applications

A highly conductive bimodal isotropic conductive adhesive and its reliability

Surface-Confined Synthesis of Silver Nanoparticle Composite Coating on Electrospun Polyimide Nanofibers

Study on the bimodal filler influence on the effective thermal conductivity of thermal conductive adhesive

Study into the application of single-wall carbon nanotubes in isotropic conductive adhesives

Electrospun polyurethane-based elastomer fibers for biomedical applications

Development and characterisation of nanofiber films with high adhesion

Surface properties of electrospun polyurethane-based elastomer networks for biomedical applications

Anisotropic Thermal Conductivity in Electrically Conductive Adhesives with Single- and Bimodal Filler-size Distributions Containing Ag Flakes and Micro-particles

Direct Photolithographic Patterning of Electrospun Films for Defined Nanofibrillar Microarchitectures

3D computational fluid dynamics simulation of carbon nanotube based microchannel on-chip cooler

MDS study on the adhesive heat transfer in micro-channel cooler

A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles

Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film

Numerical investigation on the thermal properties of the micro-cooler

Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly

Effects of BN and SiC nanoparticles on properties of conductive adhesive

Polymer nanofiber based continuous metal phase composite for thermal management applications

MDS Investigation on the Heat Transfer Properties of CNT Micro-Channel Cooler

Thermal Conductivity in the Vertical Direction of Heat-Resistant Epoxy Based Conductive Adhesives with Multimodal Filler Size Distributions

Reliability characterisation of bi-modal high temperature stable Isotropic Conductive Adhesives

A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

Interpenetrating phase polymer-metal composite for thermal interface material applications

Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach

Aging effects on electrical and thermal conductivities of electrically conductive adhesvies of composed of a heat resistant epoxy binder

New fast curing isotropic conductive adhesive for electronic packaging application

Optimization of stiffness for isotropic conductive adhesives

Application of through silicon via technology for in situ temperature monitoring on thermal interfaces

Design of Printed Monopole Antennas on Liquid Crystal Polymer Substrates

Nanofiber based composites for thermal management

Dry densification of carbon nanotube bundles

Future Emerging Packaging Technology Using Carbon Nanotubes

Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill

Reliability of isotropic conductive adhesive joints

Use of carbon nanotubes in potential electronics packaging applications

The effect of modulus on the performance of thermal conductive adhesives

Reliability study for high temperature stable conductive adhesives

Thermal management technologies for electronics based on multiwalled carbon nanotube bundles: As power consumption increases, so does the need for more efficient heat removal technologies

Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Design of 50-70 GHz Planar Wideband Bandpass Filter on Liquid Crystal Polymer Substrate

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Termiskt ledande metall/polymer nanokompositfilm samt tillhörande tillverkningsmetoder

Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect Based on Micropolar Theory and Cohesive Zone Model

Study of the filler effect of the effective thermal conductivity of thermal conductive adhesive

Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells.

Modeling of Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications

Through silicon vias filled with planarized carbon nanotube bundles

Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA

FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives

Stem Cell Growth and Migration on Nanofibrous Polymer Scaffolds and Micro-Fluidic Channels on Silicon-Chip

Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages

Evaluation of new and improved thermal interface materials and surface roughness effect on thermal interface resistance

Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy

Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging

Carbon Nanotubes as Cooling Fins in Microelectronic Systems

Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg

Coffin-Mansson equation of Sn-4.0Ag-0.5Cu solder joint

Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles

The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder

Polymer-metal nano-composite films for thermal management

Development of a test platform for thermal characterization using through-silicon-via technology

A Compact Ultra-Wideband Bandpass Filter with Ultra-Fine Conductor Trace based on Liquid Crystal Polymer Substrates

3D chip stacking using planarized carbon nanotubes as through-silicon-vias

Thermal Conductivity of Electrically Conductive Adhesives Containing Fillers with Multi-modal Particle Size Distributions

Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection

Nanostructured Polymer-metal Composite for Thermal Interface Material Applications

Vibration and Bucling of a carbon nanotbue inserted with a carbon chain

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Development of Nanomaterials and Devices for Electronics Cooling and Interconnect

A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers

Effect of Encapsulation on OLED Characteristics with Anisotropic Conductive Adhesive

Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application

Vibration and buckling of a carbon nanotube inserted with a carbon chain

Heat transfer simulation of nanofluids in microfluidic channels

Preparation of Polymer-metal Nanocomposite Films and Performance Evaluation as Thermal Interface Material

Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder alloy for electronics applications

Preparation of polysulfoneamide electrospinning nanofibers

Användning av ett kompositmaterial som termiskt kontaktmaterial för mikroelektroniska komponenter

A METHOD STUDY OF CFD SIMULATION FOR CNT MICROCOOLER

Overview of Carbon Nanotubes as Off-Chip Interconnects

Understanding BGA interconnect interface behaviour using Micropolar theory

A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers

Recent Progress of Thermal Interface Materials

Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant

Development of High Temperature Stable Isotropic Conductive Adhesives

Effect of different temperature cycle profiles on the crack initiation and propagation of Sn3,5Ag wave soldered joints

Micropolar Cohesive Zone Model for Delamination Failure in Microsystem Interconnects

Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Thermal Interface Material

Recent Progress of Thermal Interface Material Research – An Overview

Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

A Compact V-band Planar Wideband Bandpass Filter Based on Liquid Crystal Polymer Substrates

The Comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu) joints during isothermal aging and their tensile strengths

Thermal cycling aging effect on the shear strength, microstructure, IMC and initiation and propagation of surface mounted Sn-3.8Ag-0.7Cu and wave soldered Sn-3.5Ag ceramic chip components

The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish

Millimeter-wave ultra-wideband bandpass filter based on LCP substrates for automotive radar systems

RF Performance of Flip Chip ACA Joints for CPW Transmission Lines

Recent Advances in the Synthesis of Lead-free Solder Nanoparticle

Recent Development of Nano-solder Paste for Electronics Interconnect Applications

Electrical and Thermal Properties of Electrically Conductive Adhesives Using A Heat-resistant Epoxy Binder

Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles

Experimental investigation and micropolar modelling of the anisotropic conductive adhesive flip-chip interconnection

Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging

Effect of Corrosion on the Low Cycle Fatigue Behaviour of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints

Interface modelling microsystem interconnections using micropolar theory and discontinuous approximation

A method for determining elastic properties of micron-sized polymer particles by using flat punch test

Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive

PBGA Interconnect Behavior under Thermal Effects

Advances in Europe - China Green Electronics Collaboration

Tensile fracture behaviour of Sn-3.0Ag-0.5Cu solder joints on copper

Electrically Conductive Adhesives

Realization of A Ultra Wideband BPF based on LCP Substrate for Wireless Application

Encapsulation of OLED device by Using Anisotropic Conductive Adhesive

Reliability characterisation of lead free solder joints using three point bending test

Second order multi-scale micropolar model for microsystem interconnections

Reliability aspects of electronics packaging technology using anisotropic conductive adhesives

A Study of Effects of Different Coolants on On-chip Cooling with Carbon Nanotube Micro-fin Architectures by Using Computational Fluid Dynamics Simulation

A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

Effect of different temperature cycling profiles on the crack initiation and propagation and of Sn-3.5Ag wave soldered joints

Development and Characterization of Carbon Nanotube-based Bumps for Ultra Fine Pitch Flip Chip Interconnection

Manufacturing and Characterisation of Silver nano particles based Nano Thermal Interface material

Investigation of the Effect of Processing Variables on the Structure and Morphology of Nano-TIM

Effect of Corrosion on the Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints

An aging study of intermetallic compounds formation in Sn-0.4Co-0.7Cu

Preparation Techniques and Characterization for Sn-3.0Ag-0.5Cu Nanopowders

Investigation of Dielectric Strength of Electrospun Nanofiber Based Thermal Interface Material

Process and pad design optimization for 01005 passive component surface mount assembly

Electrospun Nano-fibrous Polymer Films with Barium Titanate Nanoparticles for Embedded Capacitor Applications

Integrated inductors on liquid crystal polymer substrate for RF applications

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications

High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization

Interface Modelling of ACA Interconnects Using Micropolar Theory

Assessment of Lead-Free Inert Gas Soldering Using a Novel Reflow Technology

Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application

Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints

Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection

Development and Characterization of Microcoolers using Carbon Nanotubes

Analysis of Mechanical Strength for Flip-chip Bonding of GaAs MMIC

Low Cycle Fatigue of Sn-based Lead-free Solder joints and the analysis of fatigue life prediction uncertainty

Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles

Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal ccling testing

Development of High Adhesion Nano-Thermal Interface Materials for Electronics Packaging Applications

Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization

Computational Fluid Dynamics Simulation for On-chip Cooling with Carbon Nanotube Micro-fin Architectures

Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging

Development of SOP Module Technology Based on LCP Substrate for High Frequency Electronics Applications

Flow Behaviour of Anisotropic Conductive Adhesive Film during COG Bonding Process in Flat Panel Display Assembly

Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy

Development of nanosolders and nanothermal interface materials and cooling devices based on nanocarbon tubes

Design for Embedded Chinese Display Smart Card

Characterization of Nanoparticles of Lead Free Solder Alloys

On the heat transfer enhancement based on micro-scale air impingingment jets with microstructure heat sink in electronics cooling

Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering

Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions

Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint

Consequential toxicity assessment of the global shift to Pb free solder paste

New Nano-Thermal Interface Material for Heat Removal in Electronics Packaging

Low cycle fatigue testing and simulation of Sn8Zn-3Bi and Sn-37Pb solder joints

Adhesion study of copper layer deposited and liquid crystalline polymer for electronics packaging

Numerical Simulation Based on CFD for Impingement Heat Transfer in Electronics Cooling

Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints

Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint

Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate

THERMAL MODELING FOR SYSTEM-IN-A-PACKAGE BASED ON EMBEDDED CHIP STRUCTURE

Reliability of Conductive adhesives

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive

Reliability analysis of embedded chip technique with design of experiment methods

A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic Conductive Adhesive Joining Technology

Characterisation of Mechanical Properties of Metal-coated Polymer Spheres for Anisotropic Conductive Adhesive

Characterization of thermally conductive epoxy nano-composites

Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder Joint

Development of an ontology for the ACA technology in electronics applications

Integrated Nanotube Microcooler for Microelectronics Applications

Microstructural evolution of Sn-Zn based lead-free solders after exposure to temperature and humidity

Significance of intermediate production processes in life cycle assessment of electronic products assessed using a generic compact model

Thermal cycling and reliability of lead free BGA components

Reliability of Conductive adhesives

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applications

Residual Stress in Flip Chip Joining Using Anisotropic Conductive Adhesive

Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation

Conductive adhesives

Formulation and Characterization of Anisotropic Conductive Adhesive Paste for Microelectronics Packaging Applications

Integrated Capacitors and Resistors on Liquid Crystal Polymer Substrate

Design for Manufacturability and Reliability of Embedded Display Smart Card

Modelling of Carbon Nanotubes as Heat Sink Fins in Microchannels for Microelectronics Cooling

Reliability of conductive adhesives in electronics packaging

An Ontology of ICA for Microsystem applications

Microsystem Interconnections Modelling Using Micropolar Theory and Discontinuous Approximation

Application of Simplified Methods for Partial Environmental Assessment of Microelectronics Soldering Materials and Processes in Small and Medium Sized Enterprises

Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation

Thermodynamic assessment of Sn-Co lead-free solder system

2004

Uncertainty estimation by Monte Carlo Simulation applied to Life Cycle Inventory of Cordless Phones and Microscale Metallization Processes

Conductive adhesives

Characterization of electrical and mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive

Reliability Modeling and Simulation of Anisotropic Conductive Adhesive Flip-Chip Bonding Assembly using Global/Local FEM Approach

Conductive adhesives

A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic conductive adhesive joining technology

Electron conduction through nano particles in electrically conductive adhesives

Environmental Assessment of Embedded chip manufacturing Technology

High Frequency Flip Chip Interconnection on Liquid Crystal Polymer Substrate Using Anisotropic Conductive Adhesive

Theoretical Analysis of RF Performance of Anisotropic Conductive Adhesive Flip-Chip Joints

Characterization of Substrate Materials for System-in-a-Package Applications

Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components

Thermal Fatigue Cracking of Surface Mount Conductive Adhesive Joints

Integrating nano carbon tubes with microchannel cooler

Integrated Inductors on Liquid Crystal Polymer Substrate for RF Applications

Study on thermomechanical reliability of a tunable light modulator

A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic conductive adhesive joining technology

Uncertainty estimation by Monte-Carlo Simulation applied to life cycle inventory of cordless phones and microscale metallization processes

The deformation Characterization of Conductive Particles in Anisotropically Conductive Adhesive Using FEM

Characterization of Metal- coated Polymer Spheres and its Use in Anisotropic Conductive Adhesive

Microsystem Manufacturing, Assembly and Packaging Technology in Display-CardTM Applications

Effect of Curing Condition of Adhesion Strength and ACA Flip Chip Contact Resistance

LCA of Electronic Products - An environmental assessment of Gallium Arsenide Monolithic Microwave Integrated Circuit System in Package (SIP) switch product

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Process Development and Reliability for System-in-a-Package Using Liquid Crystal Polymer Substrate

Electron conduction through nano particles in electrically conductive adhesives

Development of a web-based course on lead-free solders

Electrical conduction characteristics of anisotropic conductive adhesive particles, Guangbin Dou

System-on-Packaging: A Broad Perspective from System Design to Technology Development

Microwave-transmission, heat and temperature properties of electrically conductive adhesives

Thermodynamic Assessment of Sn-Co-Cu Lead-free Solder Alloy

Design and Development of Thin Film and LCP-Based System-on-Package Modules for RF/Wireless Applications

Electron conduction through nano particles in electrically conductive adhesives

Thermal Stress Analysis of a Novel Light Modulator

Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate using the peel test with different moisture environment

Formulation and electrical and mechanical properties of anisotropic conductive adhesive pastes

Development and Characterization of Single Mode Microwave Cured Adhesives for Electronics Packaging Application,

Microstructure Investigation of Sn-Ag-Based Lead-Free Solder Joints by Electron Microscopy

Behaviour and Properties of Conductive Particles for Anisotropic Conductive Adhesive

Development of a generic data collection model for upstream processes in life cycle inventory of electronic products

High frequency characteristics of Liquid Crystal Polymer for System in a Package Application

A generic model for life cycle inventory of up-stream processes in life cycle assessment of electronic products

Panel-Size Component Integration (PCI) with Molded Liquid Crystal Polymer (LCP) Substrates

Isotropically Conductive Adhesives for Large Power Electronics Applications

Characterization of Liquid Crystal Polymer for High Frequency System-in-a-Package Applications

Process development and adhesion behaviour of Electroless Copper on Liquid Crystal Polymer (LCP) for Electronic Packaging Application

Web Course on Electrically Conductive Adhesives

Electrical Characterization of Isotropic Conductive Adhesive under Mechanical Deformation

Reliability of ACA flip-chip joints on FR-4 substrate

Experimental and Theoretical Analysis for Material Behavior of Anisotropically Conductive Adhesive Film

Low Cycle fatigue of lead-free solders

Life time prediction of anisotropic conductive adhesive joint for electronics packaging applications

The effect of bump height on the reliability of ACF in flip-chip

Spatial distribution of metal fillers in isotropically conductive adhesive, Journal of Electronics Materials

ACA bonding technology for low-cost electronics packaging applications – current status and remaining challenges

Fundamentals of Packaging Materials and Processes

Comparison of Mechanical Fatigue Test and Thermal Cycling for Failure Analysis of Solder Joints

Computational Modelling of the Anisotropic Conductive Adhesive Assembly Process

Overview of Conductive Adhesive Joining and Bumping Technology for direct chip attach applications

Thermal Performance of a System in Package Design Concept

Life Cycle Analysis of a telephone exchange station

Modelling of the anisotropic conductive adhesive assembly

Statistics on conduction in ACA materials

Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B Lead Free Solders

Low-Cycle fatigue life of SnAgBi and Sn-Ag lead-free solders

A review of microwave curing of polymer materials

Microwave Cure of Metal-filled Electrically Conductive Adhesives

Modelling of Heat Transfer for System in Package (SIP)

Development of an internet Course on Conductive Adhesives for Electronics Packaging

An Internet Course on Conductive Adhesives for Electronics Packaging

Reliability of ACF in Flip-Chip with Various Bump Height

Heating and reliability characterization electrically conductive adhesives using variable frequency microwave cure

Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesives

Microwave transmission, heating of electrically conductive adhesives

Fatigue properties of lead-free solders

Characterization of bulk mechanical properties of lead-free solders

Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip application

Life Cycle Assessment of a telecommunications exchange

Effect of thermal ageing on the shear strength of lead-free solder joints

3. Thermal cycling life Flip-Chip On Board circuits with solder and isotropically conductive adhesive joints

Heat Transfer Modeling of System in Package (SIP)

Microstructural coarsening of lead-free solders

Bump Height Effect on the Reliability and on the Strains Variations of ACA Flip-chip Joints

Cluster effects on electrical conductance of isotropically conductive adhesive