Analysis of heat dissipation characteristics of three-dimensional graphene-carbon nanotube composite structures
Paper i proceeding, 2020

With the rapid development of electronic materials and technologies, the working frequencies of electronic components and devices have been greatly improved and the volume of electronic products has been shrinking. The integration density has increased significantly, which puts forward higher requirements for thermal management. One of the keys to the heat dissipation of electronic components is to transfer the heat rapidly to the radiator through the heat conducting medium. Therefore, the development of high conductive materials has become a research hotspot of high-density integrated devices and systems. Due to their excellent heat transfer properties, carbon nanomaterials such as carbon nanotube and graphene have attracted extensive attention. The thermal conductivities of carbon nanotube and graphene have obvious anisotropy, which limited their applications to some extent. In this paper, three-dimensional composite structures composed of graphene sheets and carbon nanotubes are considered. The heat transfer processes are simulated by molecular dynamics method and the heat transfer characteristics of van der Waals interaction and chemical bond structures are analyzed. The effects of heat flow and nanotube layout on the thermal properties of three-dimensional composite structures are discussed.

MDS

carbon nanotubes

heat dissipation

three-dimensional composite structure

graphene

Författare

Hang Yin

Shanghai University

Yan Zhang

Shanghai University

Pei Lu

Shanghai University

Yong Zhang

Shanghai University

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)

21st International Conference on Electronic Packaging Technology (ICEPT)
Guangzhou, China,

Ämneskategorier

Energiteknik

Kompositmaterial och -teknik

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Senast uppdaterat

2021-05-17